公开(公告)号：US20110193430A1

公开(公告)日：2011-08-11

申请号：US13123733

申请日：2009-10-26

Applicant: Masayuki Takada

Inventor： Masayuki Takada

IPC: H02K1/04

CPC classification number: H02K5/08 ,  H02K3/44 ,  H02K3/50 ,  H02K11/33 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/0251 ,  H05K2201/09063 ,  H05K2203/1316

Abstract: A molded motor including a stator including a housing formed by integrally molding an armature winding and a printed circuit board with resin containing a fibrous reinforcing material and filler; a magnet rotor rotatably disposed to face the stator; and a plurality of lead wires led out to outside. The printed circuit board is provided with a plurality of lands connecting the lead wires by soldering, and a round hole between the plurality of lands filled with the resin, and the reinforcing material is oriented in a board thickness direction of the printed circuit board.

Abstract translation: 一种模制电动机，包括定子，所述定子包括通过一体地模制电枢绕组而形成的壳体和具有包含纤维增强材料和填料的树脂的印刷电路板; 可旋转地设置成面向定子的磁体转子; 并将多根引线导出到外部。 印刷电路板设置有通过焊接连接引线的多个焊盘，以及填充有树脂的多个焊盘之间的圆孔，并且加强材料沿印刷电路板的板厚度方向取向。

公开(公告)号：US20110193228A1

公开(公告)日：2011-08-11

申请号：US12916677

申请日：2010-11-01

Applicant: Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

Inventor： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

IPC: H01L23/50

CPC classification number: H01L23/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/1225 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316

Abstract: A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.

Abstract translation: 模制底部填充倒装芯片封装可以包括印刷电路板，安装在印刷电路板上的半导体芯片和密封剂。 印刷电路板具有穿过印刷电路板的至少一个树脂通孔和印刷电路板的底表面上的至少一个树脂通道，所述至少一个树脂通道从至少一个树脂通道孔延伸通过 印刷电路板。 密封剂密封印刷电路板，半导体芯片，至少一个树脂通孔和至少一个树脂通道的顶表面。

公开(公告)号：US07995353B2

公开(公告)日：2011-08-09

申请号：US12189802

申请日：2008-08-12

Applicant: Chang-Te Liao

Inventor： Chang-Te Liao

IPC: H05K3/00 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A circuit board includes four positioning pads placed on a surface of the circuit board, four positioning holes corresponding to the positioning pads, respectively, and a solder mask placed on the surface around the periphery of the positioning pads. An arc-shaped recess is defined at a side of each positioning pad near the corresponding positioning hole and the space between the edges of the positioning pad and the positioning hole ranges from 0.2 mm to 0.5 mm.

Abstract translation: 电路板包括放置在电路板的表面上的四个定位焊盘，分别对应于定位焊盘的四个定位孔和放置在定位焊盘周围表面上的焊接掩模。 在相应定位孔附近的每个定位垫的一侧限定有弧形凹部，并且定位垫和定位孔的边缘之间的间隔在0.2mm至0.5mm的范围内。

公开(公告)号：US20110168438A1

公开(公告)日：2011-07-14

申请号：US13069874

申请日：2011-03-23

Applicant: Jung-Chien Chang

Inventor： Jung-Chien Chang

IPC: H05K1/11 ,  H01R43/00

CPC classification number: H05K3/4647 ,  H05K3/205 ,  H05K3/4652 ,  H05K3/4658 ,  H05K3/4679 ,  H05K2201/09063 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0733 ,  H05K2203/166 ,  Y10T29/49117 ,  Y10T29/49153

Abstract: The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit.

Abstract translation: 本发明公开了一种互连结构，其通过包括提供第一导电基板，第二导电基板和绝缘基板的方法形成; 分别在第一导电衬底和第二导电衬底上形成第一电路和第二电路; 在第二电路上形成导电凸块; 以及通过按压所述第一导电基板，所述绝缘基板和所述第二导电基板来将所述绝缘基板与所述第一电路和所述第二电路连接，其中所述导电凸块穿过所述绝缘基板以接触所述第一电路。

公开(公告)号：US20110149569A1

公开(公告)日：2011-06-23

申请号：US12702300

申请日：2010-02-09

Applicant: Tzu-Hui Hsu ,  Yen-Po Yeh

Inventor： Tzu-Hui Hsu ,  Yen-Po Yeh

IPC: F21S4/00

CPC classification number: H05K3/361 ,  H05K1/0271 ,  H05K2201/09063 ,  H05K2201/10106

Abstract: An LED module including an LED light bar and a FPC is provided. The LED light bar includes a circuit board and a plurality of LED devices. The circuit board has a first surface, a second surface, first pins, second pins, and a slot. The LED devices are disposed on the first surface and electrically connected with the first pins. The FPC passes through the slot and is electrically connected with the second pins. The FPC includes a first bonding part, a second bonding part, and a bending part. The first bonding part has a plurality of third pins electrically connected with the second pins and is in contact with the first surface of the circuit board. The second bonding part has a plurality of fourth pins electrically connected with a control board. The bending part connects between the first part and the second part and passes through the slot.

Abstract translation: 提供了包括LED灯条和FPC的LED模块。 LED灯条包括电路板和多个LED器件。 电路板具有第一表面，第二表面，第一销，第二销和槽。 LED器件设置在第一表面上并与第一引脚电连接。 FPC穿过狭槽并与第二针电连接。 FPC包括第一接合部分，第二接合部分和弯曲部分。 第一接合部分具有与第二引脚电连接并与电路板的第一表面接触的多个第三引脚。 第二接合部具有与控制板电连接的多个第四引脚。 弯曲部分在第一部分和第二部分之间连接并穿过狭槽。

公开(公告)号：US20110141711A1

公开(公告)日：2011-06-16

申请号：US12967585

申请日：2010-12-14

Applicant: Seung-Hyun SOHN ,  Yul-Kyo Chung ,  Dae-Jung Byun ,  Moon-II Kim

Inventor： Seung-Hyun SOHN ,  Yul-Kyo Chung ,  Dae-Jung Byun ,  Moon-II Kim

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H01L23/5389 ,  H01L23/5383 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/01029 ,  H05K1/185 ,  H05K2201/09063 ,  H05K2203/1469 ,  H05K2203/166 ,  Y10T29/4913

Abstract: An electronic component embedded printed circuit board and a method of manufacture the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a dielectric core substrate, which has a cavity formed therein, an electronic component, which is housed in the cavity and has an electrode formed on one surface thereof, an insulation layer, which is formed on both surface of the dielectric core substrate, a via, which is formed in the insulation layer such that the via is electrically connected to the electrode, and a first circuit pattern, which is formed on the insulation layer such that the first circuit pattern is electrically connected to the via.

Abstract translation: 公开了电子部件嵌入式印刷电路板及其制造方法。 根据本发明的实施例的电子部件嵌入式印刷电路板可以包括其中形成有腔的电介质芯基板，容纳在空腔中并具有形成在其一个表面上的电极的电子部件， 形成在介质芯基板的两个表面上的绝缘层，形成在绝缘层中的通孔，使得通孔电连接到电极;以及第一电路图案，其形成在绝缘层上 使得第一电路图案电连接到通孔。

公开(公告)号：US20110132642A1

公开(公告)日：2011-06-09

申请号：US12959842

申请日：2010-12-03

Applicant: Koji Shinoda ,  Hiroshi Nakagawa

Inventor： Koji Shinoda ,  Hiroshi Nakagawa

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2203/0195 ,  H05K2203/1572 ,  H05K2203/166 ,  H05K2203/167

Abstract: A plurality of protruding substrate portions (12) is extended from positions placed at an interval from each other along a peripheral edge of a wiring substrate (10). Each of the protruding substrate portions (12) is provided with wiring terminals (15), (16) electrically connected to each of a plurality of electrode terminals provided to an electrical instrument substrate. A cut-out part (18) is formed in a peripheral edge (13a) between the protruding substrate portions (12) in the wiring substrate (10).

Abstract translation: 多个突出的基板部分（12）沿着布线基板（10）的周缘彼此间隔开的位置延伸。 每个突出基板部分（12）设置有电连接到设置在电气仪器基板上的多个电极端子中的布线端子（15），（16）。 在配线基板（10）的突出基板部（12）之间的周缘部（13a）上形成切口部（18）。

公开(公告)号：US20110111264A1

公开(公告)日：2011-05-12

申请号：US12912113

申请日：2010-10-26

Applicant: Hiroyuki HANAZONO

Inventor： Hiroyuki HANAZONO

IPC: H01M2/00 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/16 ,  H01M8/0269 ,  H01M8/1011 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/244 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09481 ,  Y02E60/523

Abstract: A rectangular collector portion is formed on each of a first insulating portion and a second insulating portion. A cover layer is provided on the first insulating portion to cover the collector portion, and a cover layer is provided on the second insulating portion to cover the collector portion. A seal region is provided on the first insulating portion to surround the cover layer. A seal region is provided on the second insulating portion to surround the cover layer. Rectangular drawn-out conductor portions are formed on the back surface of the base insulating layer. The collector portion and the drawn-out conductor portion are electrically connected to each other, and the collector portion and the drawn-out conductor portion are electrically connected to each other.

Abstract translation: 在第一绝缘部分和第二绝缘部分中的每一个上形成矩形收集部分。 覆盖层设置在第一绝缘部分上以覆盖集电器部分，并且覆盖层设置在第二绝缘部分上以覆盖集电器部分。 密封区域设置在第一绝缘部分上以包围覆盖层。 密封区域设置在第二绝缘部分上以包围覆盖层。 矩形拉出导体部分形成在基底绝缘层的背面上。 集电体部分和引出导体部分彼此电连接，并且集电极部分和引出导体部分彼此电连接。

公开(公告)号：US20110101411A1

公开(公告)日：2011-05-05

申请号：US13000042

申请日：2009-06-23

Applicant: Marcus Johannes Gerardus Elzinga

Inventor： Marcus Johannes Gerardus Elzinga

IPC: H01L33/62 ,  F21V21/00

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

Abstract translation: 一种支撑模块（1），包括具有槽孔（5）的导电层（2）和适于接收固态光源（3）的接收表面，所述电接触焊盘（4）与所述通孔 （5）。 支撑模块（1）还包括电绝缘元件（8）和延伸穿过电绝缘元件（8）并且穿过通孔（5）突出的至少一个接触销（9）。 此外，电绝缘元件（8）包括通道（10），允许接触到接触销（9）的端部和由固态光源（3）的表面接收的固态光源（3）的电接触焊盘（4） 导电层（2）。 这样的通道使得可以用焊接工具通过绝缘元件到达接触针和接触垫的端部。 因此，可以通过将接触销焊接到接触焊盘来将固态光源附着在金属表面上。 由于金属表面的散热性优于印刷电路板，因此在金属表面上安装固态照明装置在需要良好散热的应用中是有利的。

公开(公告)号：US07927149B2

公开(公告)日：2011-04-19

申请号：US12646817

申请日：2009-12-23

Applicant: Timothy A. Lemke

Inventor： Timothy A. Lemke

IPC: H01R24/00

CPC classification number: H05K1/14 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/116 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0187 ,  H05K2201/044 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.

Abstract translation: 一种装置将相应于背板前侧各个电路板的独立阵列从背板的后侧突出的引线互连。 该装置包括连接器板组件，该连接器板组件在分开的销阵列之间跨越背板的后侧延伸。 连接器板组件具有将这些单独的引脚阵列电互连的信号路由电路。 这使得各个印刷电路板能够独立于底板结构内的任何信号路由电路而电互连。 因此，该装置优选地包括一个背板，该背板没有用于互连延伸穿过背板的引脚的信号路由电路。