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公开(公告)号：US09173284B2
公开(公告)日：2015-10-27
申请号：US14068029
申请日：2013-10-31
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/024 , H01B7/0838 , H01B7/0861 , H05K1/0242 , H05K1/025 , H05K3/28 , H05K3/281 , H05K2201/0323 , H05K2201/09236 , H05K2201/098 , H05K2201/09881
Abstract: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.
Abstract translation: 柔性电路板的平面化覆盖层结构包括通过第一粘合剂层粘合到布置在柔性电路板的基板上的每个导电信号线的表面的绝缘层。 分别在相邻的导电信号线之间形成的分离区域各自形成有填充层，使得填充层在分离区域中为第一粘合剂层提供平坦化高度，并且平坦化高度基本上等于 导电信号线。 填充层可以替代地具有比导体层的表面高一个覆盖高度的高度，使得第一粘合剂层在分离区域中具有平坦化高度，并且平坦化高度基本上等于高度 的导电信号线和覆盖高度。
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22.发明申请公开(公告)号：US20150102874A1
公开(公告)日：2015-04-16
申请号：US14478322
申请日：2014-09-05
Applicant: Advanced Flexible Circuits Co., Ltd.
Inventor： CHIH-HENG CHUO , KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K1/118 , H05K1/024 , H05K1/025 , H05K1/117 , H05K2201/0191
Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.
Abstract translation: 电路板的衰减减小结构包括在高频信号接触焊盘和电路板的接地层之间形成的膨胀厚度。 膨胀的厚度大于接地层和高频信号线之间的参考厚度。 电路板由聚对苯二甲酸乙二醇酯（PET）或聚酰亚胺（PI）制成。 或者，使用包括树脂和纤维材料的刚性板或刚挠板。 电路板可以是通过组合至少两个单层电路板而形成的单层电路板或多层板。 在高频信号接触焊盘和接地层之间安装厚度扩大的焊盘，或者增加电路板的接合层的一部分的厚度以提供膨胀的厚度。
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公开(公告)号：US20150027751A1
公开(公告)日：2015-01-29
申请号：US14068029
申请日：2013-10-31
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
IPC: H05K1/02
CPC classification number: H05K1/024 , H01B7/0838 , H01B7/0861 , H05K1/0242 , H05K1/025 , H05K3/28 , H05K3/281 , H05K2201/0323 , H05K2201/09236 , H05K2201/098 , H05K2201/09881
Abstract: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.
Abstract translation: 柔性电路板的平面化覆盖层结构包括通过第一粘合剂层粘合到布置在柔性电路板的基板上的每个导电信号线的表面的绝缘层。 分别在相邻的导电信号线之间形成的分离区域各自形成有填充层，使得填充层在分离区域中为第一粘合剂层提供平坦化高度，并且平坦化高度基本上等于 导电信号线。 填充层可以替代地具有比导体层的表面高一个覆盖高度的高度，使得第一粘合剂层在分离区域中具有平坦化高度，并且平坦化高度基本上等于高度 的导电信号线和覆盖高度。
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公开(公告)号：US20140144678A1
公开(公告)日：2014-05-29
申请号：US14068041
申请日：2013-10-31
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , KUO-FU SU , CHIH-HENG CHUO
IPC: H01R12/59
CPC classification number: H01R12/592 , H01R43/0256
Abstract: Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.
Abstract translation: 公开了一种用于将至少一个连接器安装在柔性电路板上的焊接结构。 连接器包括SMD引脚和焊锡引脚。 柔性电路板具有连接器安装部分，其具有形成有SMD焊接区域和焊料浸渍针孔的部件表面。 加强板联接到柔性电路板的加强结合表面。 加强板具有与柔性电路板的焊料浸渍针孔相对应的通孔。 连接器的SMD引脚分别焊接到柔性电路板的SMD焊接区域，连接器的焊料浸渍引脚分别插入柔性电路板的焊料浸渍针孔和 加强板加固板的焊接表面，以焊接材料焊接。
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公开(公告)号：US20140014409A1
公开(公告)日：2014-01-16
申请号：US13690344
申请日：2012-11-30
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , KUO-FU SU
IPC: H02G15/08
CPC classification number: H02G15/08 , H05K1/0219 , H05K1/0225 , H05K1/0245 , H05K1/0253 , H05K1/117 , H05K1/118 , H05K1/147 , H05K2201/0715 , H05K2201/09063 , H05K2201/09254
Abstract: A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section. The first section, the second section, and the extension section include at least one fold line.
Abstract translation: 差分模式信号传输模块包括具有外部连接端的第一部分，在该第一部分上形成有至少一对差模信号传输端子，并且包括接地端子，第一差分模式信号端子和第二差分模式信号端子。 第一部分的延伸连接端形成与外部连接端对应的对应信号端子。 在第一部分上形成至少一个第一导电连接线。 导电连接线将第一部分的外部连接端的接地端子连接到集合接地点。 第一部分的延伸连接端连接到扩展部分。 延伸部分进一步连接到与第一部分相对的第二部分。 延伸部分包括至少一条狭缝线以形成捆扎部分。 第一部分，第二部分和扩展部分包括至少一个折线。
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Patent Agency Ranking
公开(公告)号：US20190067847A1
公开(公告)日：2019-02-28
申请号：US16002198
申请日：2018-06-07
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , KUO-FU SU
Abstract: A pressure adaptive contact structure for a flexible circuit board is disclosed, in which the flexible circuit board is provided with a weakening portion or a partly surrounding weakening portion between a plurality of first contact pads so that contact surfaces of the plurality of first contact pads are respectively contactable with corresponding ones of contact points to generate contact pressing forces applied to the contact points in a manner that the contact pressing forces are adaptively adjustable by the weakening portion to accommodate height differences between adjacent ones of the first contact pads to prevent the first contact pads from being stretched and pulled with respect to each other.
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公开(公告)号：US09462685B2
公开(公告)日：2016-10-04
申请号：US14090157
申请日：2013-11-26
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H05K1/028 , B29C53/04 , H05K2201/051 , H05K2201/056 , H05K2201/057 , H05K2201/09063 , H05K2203/0195 , Y10T29/49826
Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.
Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组合的方法和结构。 通过将预折线作为中心线来处理预成形的柔性电路板，以将柔性电路板的连接部分朝向端子分配部分折叠。 然后，将连接部朝向端子分配部的方向卷绕，以使连接部形成卷边体。 然后将卷绕的物体穿过铰链组件的孔，以使轧制体完全延伸穿过铰链组件的孔，使得柔性电路板的延伸部分定位在铰链组件的孔中，并且第一端 并且第二端分别位于铰链组件的孔的相对侧。
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公开(公告)号：US09433086B2
公开(公告)日：2016-08-30
申请号：US14283372
申请日：2014-05-21
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
CPC classification number: H05K1/0271 , H05K1/0277 , H05K1/028 , H05K1/0281 , H05K1/118 , H05K2201/09063 , H05K2201/09145
Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.
Abstract translation: 公开了一种用于柔性电路板的撕裂保护结构。 在柔性电路板的延伸部中，至少形成有切割线。 切割线至少具有应力分流切割部分从该终端延伸的终端。 应力转向切割段通过沿切割方向切割形成，该切割方向限定相对于延伸部分的延伸方向的角度，以用作柔性电路板的撕裂保护结构。 柔性电路板的延伸部分沿着切口线可折叠。 应力转向切割段还可以包括在其终止端中形成的撕裂保护孔。
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公开(公告)号：US09386692B2
公开(公告)日：2016-07-05
申请号：US14704196
申请日：2015-05-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
CPC classification number: H05K1/028 , H05K1/118 , H05K3/361 , H05K2201/0394 , H05K2201/041 , H05K2201/055 , H05K2201/09481
Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.
Abstract translation: 提供了一种用于柔性电路板的电源路径结构，并且包括第一柔性电路板，其包括至少一个第一连接焊盘和第一相对连接焊盘以及连接在第一连接焊盘和第一相对连接之间的第一电源路径 垫和第二柔性电路板，其包括连接在第二连接焊盘和第二相对连接焊盘之间的至少一个第二连接焊盘和第二相对连接焊盘和第二电源路径。 第一柔性电路板在垂直方向上堆叠在第二柔性电路板上，使得第一电源路径和第二电源路径形成用作电源路径的并联连接的电源路径，或者 第一柔性电路板的接地路径。
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公开(公告)号：US20150359083A1
公开(公告)日：2015-12-10
申请号：US14704196
申请日：2015-05-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO , GWUN-JIN LIN
CPC classification number: H05K1/028 , H05K1/118 , H05K3/361 , H05K2201/0394 , H05K2201/041 , H05K2201/055 , H05K2201/09481
Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.
Abstract translation: 提供了一种用于柔性电路板的电源路径结构，并且包括第一柔性电路板，其包括至少一个第一连接焊盘和第一相对连接焊盘以及连接在第一连接焊盘和第一相对连接之间的第一电源路径 垫和第二柔性电路板，其包括连接在第二连接焊盘和第二相对连接焊盘之间的至少一个第二连接焊盘和第二相对连接焊盘和第二电源路径。 第一柔性电路板在垂直方向上堆叠在第二柔性电路板上，使得第一电源路径和第二电源路径形成用作电源路径的并联连接的电源路径，或者 第一柔性电路板的接地路径。
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