公开(公告)号：US20160155868A1

公开(公告)日：2016-06-02

申请号：US14906438

申请日：2014-07-24

Applicant: NAMICS CORPORATION

Inventor： Tetsu TAKAHASHI ,  Genki SAITO

IPC: H01L31/0368 ,  H01L31/18 ,  H01L31/0216

CPC classification number: H01L31/03682 ,  C03C3/07 ,  C03C3/14 ,  C03C8/04 ,  C03C8/16 ,  C03C8/18 ,  H01B1/16 ,  H01B1/22 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/182 ,  Y02E10/547 ,  Y02P70/521

Abstract: The present invention aims to provide a high performance crystalline silicon solar cell. The present invention is a crystalline silicon solar cell including a first conductivity-type crystalline silicon substrate; an impurity diffusion layer formed on at least a portion of at least one surface of the crystalline silicon substrate; a buffer layer formed on at least a portion of a surface of the impurity diffusion layer; and an electrode formed on a surface of the buffer layer, wherein the electrode includes a conductive metal and a complex oxide, and the buffer layer is a layer comprising silicon, oxygen, and nitrogen.

Abstract translation: 本发明旨在提供一种高性能晶体硅太阳能电池。 本发明是一种包括第一导电型晶体硅衬底的晶体硅太阳能电池; 形成在所述晶体硅衬底的至少一个表面的至少一部分上的杂质扩散层; 形成在所述杂质扩散层的表面的至少一部分上的缓冲层; 以及形成在所述缓冲层的表面上的电极，其中所述电极包括导电金属和复合氧化物，并且所述缓冲层是包含硅，氧和氮的层。

公开(公告)号：US20150299477A1

公开(公告)日：2015-10-22

申请号：US14436565

申请日：2013-10-18

Applicant: NAMICS CORPORATION

Inventor： Yoshiaki YOSHII

IPC: C09D5/24 ,  H05K1/09 ,  H05K3/10 ,  H05K1/18

CPC classification number: C09D5/24 ,  C09D7/40 ,  C09D201/00 ,  H01B1/16 ,  H01B1/22 ,  H05K1/092 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/12

Abstract: A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese.

Abstract translation: 导电浆料，包括：（A）银粉; （B）玻璃料; （C）有机粘合剂; 和（D）含有铜，锡和锰的粉末。

公开(公告)号：US20150218391A1

公开(公告)日：2015-08-06

申请号：US14426607

申请日：2013-09-05

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki Takahashi ,  Noriyuki Sakai ,  Akito Yoshii

IPC: C09D5/24 ,  B22F9/24 ,  C22B3/00 ,  H01B1/22 ,  C22C5/06

CPC classification number: C09D5/24 ,  B22F1/0011 ,  B22F1/0048 ,  B22F1/0059 ,  B22F9/24 ,  B22F2999/00 ,  C09D7/61 ,  C22B11/04 ,  C22C5/06 ,  H01B1/22 ,  H05K1/095 ,  C22C1/08

Abstract: A silver paste composition that includes (A) silver particles that are spherical and have continuous open pores, and a (B) resin and/or a (C) dispersant, and that preferably further comprises at least one substance selected from the group consisting of a (D) curing agent, a (E) fluxing agent, and a (F) curing accelerator. The silver paste composition serves to suppress an increase in electrical resistance and viscosity and reduces the electrical resistivity.

Abstract translation: 一种银膏组合物，其包含（A）球形并具有连续开孔的银颗粒和（B）树脂和/或（C）分散剂，并且优选还包含至少一种选自以下的物质： （D）固化剂，（E）助熔剂和（F）固化促进剂。 银糊剂组合物用于抑制电阻和粘度的增加并降低电阻率。

公开(公告)号：US20150041974A1

公开(公告)日：2015-02-12

申请号：US14382617

申请日：2013-02-26

Applicant: NAMICS CORPORATION

Inventor： Makoto Kobayashi ,  Koji Sasaki

IPC: B23K35/30 ,  H01L23/00 ,  B23K35/365 ,  B22F3/10 ,  B23K1/00

CPC classification number: B23K35/3006 ,  B22F1/0018 ,  B22F1/0044 ,  B22F3/10 ,  B22F9/24 ,  B23K1/0016 ,  B23K35/365 ,  B82Y30/00 ,  C22C5/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13339 ,  H01L2224/13499 ,  H01L2224/165 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/8184 ,  H01L2224/8384 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/207

Abstract: A sintered body of silver fine particles for a bonding member to bond components of a semiconductor device, wherein an activation energy for creep of the sintered body of the silver fine particles is from 0.4 to 0.75 times that of an activation energy for a lattice diffusion of bulk silver.

Abstract translation: 一种用于粘合半导体器件的部件的接合部件的银微粒的烧结体，其中，银微粒的烧结体的蠕变活化能为晶格扩散的活化能的活化能的0.4〜0.75倍 散装银

公开(公告)号：US12131970B2

公开(公告)日：2024-10-29

申请号：US16618697

申请日：2018-05-31

Applicant: Hitachi Chemical Company, Ltd. ,  NAMICS CORPORATION

Inventor： Hidetoshi Inoue ,  Takayuki Matsuzaki ,  Hisato Takahashi ,  Tsuyoshi Kamimura ,  Haruyuki Yoshii

IPC: C08G59/28 ,  C08G59/22 ,  C08G59/24 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C09K3/10 ,  H01L23/29

CPC classification number: H01L23/295 ,  C08G59/226 ,  C08G59/245 ,  C08G59/5073 ,  C08K3/36 ,  C08K7/18 ,  C09K3/1025 ,  C08G2190/00 ,  C09K2200/0247 ,  C09K2200/0647

Abstract: A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

公开(公告)号：US20240301113A1

公开(公告)日：2024-09-12

申请号：US18281499

申请日：2022-02-28

Applicant: NAMICS CORPORATION

Inventor： Masayoshi OTOMO

IPC: C08F290/06 ,  C09J4/00 ,  C09J9/02

CPC classification number: C08F290/067 ,  C09J4/00 ,  C09J9/02

Abstract: There are provided: a resin composition that has low elasticity, is curable at low temperature, and has a long pot life; an electrically conductive adhesive that contains the resin composition; a cured product of the resin composition; and a semiconductor device that contains the electrically conductive adhesive or the cured product of the resin composition. The resin composition contains (A) a radically polymerizable curable resin, (B) a radical polymerization initiator, and (C) a radical polymerization inhibitor. The (C) component contains (C1) a nitrosamine compound. The (A) component contains (A1) a urethane acrylate oligomer. The (A1) component has a mass average molecular weight of 1,600 or more and 20,000 or less. The resin composition is useful as an electrically conductive adhesive, a material for mounting components or a sealing material for protecting components, and an insulating material for reinforcement which are used in the FHE field.

公开(公告)号：US20240179849A1

公开(公告)日：2024-05-30

申请号：US18283537

申请日：2021-06-10

Applicant: NAMICS CORPORATION

Inventor： Naoki OBATA ,  Makiko SATO

IPC: H05K3/18 ,  G01N23/20058 ,  G01N23/20091 ,  G01N33/00 ,  H05K1/05 ,  H05K3/38

CPC classification number: H05K3/18 ,  G01N23/20058 ,  G01N23/20091 ,  G01N33/00 ,  H05K1/05 ,  H05K3/38 ,  G01N2033/0096 ,  H05K2203/06

Abstract: The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.

公开(公告)号：US11850625B2

公开(公告)日：2023-12-26

申请号：US17414754

申请日：2020-01-29

Applicant: NAMICS CORPORATION

Inventor： Hiroki Myodo ,  Yosuke Sakai ,  Masaaki Hoshiyama

IPC: B05C17/005 ,  C08G59/24 ,  C08G59/50 ,  C08F222/10

CPC classification number: B05C17/00593 ,  C08F222/102 ,  C08G59/245 ,  C08G59/5033

Abstract: There are provided a syringe filled with a resin composition and a storage method thereof. According to the syringe and the storage method, mixed air, which causes the resin composition to be intermittently discharged from the syringe, is suppressed. The syringe filled with the resin composition includes a syringe, a resin composition filling the syringe, and a plunger. The resin composition contains voids. The ratio of the volume of the voids relative to the volume of the resin composition is 1.0 ppm by volume to 520 ppm by volume. The voids have a maximum diameter of 2,500 μm or less.

公开(公告)号：US20230272238A1

公开(公告)日：2023-08-31

申请号：US18026484

申请日：2021-09-10

Applicant: NAMICS CORPORATION

Inventor： Taku FUJINO ,  Toshiaki OGIWARA

IPC: C09D11/52 ,  C09D11/102 ,  C09D11/037 ,  H01B1/22

CPC classification number: C09D11/52 ,  C09D11/102 ,  C09D11/037 ,  H01B1/22

Abstract: A conductive paste that can reduce an increase in electrical resistance caused by stretching of a wiring when the wiring of an electrical circuit and/or an electronic circuit is formed on a surface of a stretchable and/or bendable base material. The stretchable conductive paste includes (A) surface-treated silver particles and (B) a thermoplastic resin. The (A) surface-treated silver particles include a surface-treated layer.

公开(公告)号：US20230203237A1

公开(公告)日：2023-06-29

申请号：US17913334

申请日：2021-03-30

Applicant: NAMICS CORPORATION

Inventor： Yuya NAKAI ,  Rieko NAGATA

IPC: C08G59/18 ,  C08G59/50 ,  C08G59/68

CPC classification number: C08G59/184 ,  C08G59/5073 ,  C08G59/686 ,  C08G2170/00 ,  C08G2190/00

Abstract: An object of the present invention is to provide an epoxy amine adduct, a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. There is prepared an epoxy amine adduct in which a value of (melting onset temperature at a temperature increasing rate of 50° C./min)/(melting onset temperature at a temperature increasing rate of 10° C./min) in differential scanning calorimetry (DSC) is 1.00 or more and 1.10 or less. There are prepared a curing catalyst for epoxy resin containing the epoxy amine adduct, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition.