公开(公告)号：US20150371886A1

公开(公告)日：2015-12-24

申请号：US14758718

申请日：2013-12-20

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Isao Sato ,  Hiroki Ueno ,  Yasutoshi Ito ,  Masataka Ryu ,  Troy Palm

IPC: H01L21/687 ,  H01L21/67 ,  B25J15/00

CPC classification number: H01L21/68707 ,  B25J11/0095 ,  B25J15/0014 ,  H01L21/67259

Abstract: A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.

Abstract translation: 公开了一种用于处理诸如半导体晶片的衬底的机构。 该机构以倾斜方向支撑衬底，以确保弓形衬底和机构之间不会发生不期望的接触。 以倾斜方向支撑衬底的结构可以是固定的或可调节的。 可以提供传感器来测量和/或监测衬底和机构之间的距离。 或者，可以提供用于确定基板和机构之间的接触的传感器。

公开(公告)号：US20150253256A1

公开(公告)日：2015-09-10

申请号：US14432045

申请日：2013-09-27

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Wei Zhou

IPC: G01N21/88 ,  G01B11/06 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01B11/02 ,  G01B11/06 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/02 ,  G01N2201/062 ,  G01N2201/10

Abstract: An inspection system is disclosed. An optical assembly establishes an optical path between a light source and a detector. The optical assembly has a relatively large amount of longitudinal chromatic aberration, so that light at a first wavelength focuses on one region of a substrate in the optical path, while light at a second wavelength simultaneously focuses on another region of the substrate. The system can operate in a calibration mode to determine one or more wavelengths of light corresponding to regions of interest in the substrate and in an imaging mode to image regions of interest in the substrate.

Abstract translation: 公开了一种检查系统。 光学组件在光源和检测器之间建立光路。 光学组件具有相对大量的纵向色差，使得第一波长的光聚焦在光路中的衬底的一个区域上，而第二波长的光同时聚焦在衬底的另一区域上。 该系统可以在校准模式下操作以确定对应于衬底中的感兴趣区域的一个或多个波长的光，并且以成像模式来对基底中的感兴趣的区域进行成像。

公开(公告)号：US20140110582A1

公开(公告)日：2014-04-24

申请号：US14145497

申请日：2013-12-31

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： David S. Marx ,  David L. Grant

IPC: G01B11/22

CPC classification number: G01B11/22 ,  G01B11/0633 ,  G01B11/0675 ,  G01B2210/56

Abstract: A system (10) for directly measuring the depth of a high aspect ratio etched feature on a wafer (80) that includes an etched surface (82) and a non-etched surface (84). The system (10) utilizes an infrared reflectometer (12) that in a preferred embodiment includes a swept laser (14), a fiber circulator (16), a photodetector (22) and a combination collimator (18) and an objective lens (20). From the objective lens (20) a focused incident light (23) is produced that is applied to the non-etched surface (84) of the wafer (80). From the wafer (80) is produced a reflected light (25) that is processed through the reflectometer (12) and applied to an ADC (24) where a corresponding digital data signal (29) is produced. The digital data signal (29) is applied to a computer (30) that, in combination with software (32), measures the depth of the etched feature that is then viewed on a display (34).

Abstract translation: 一种用于直接测量包括蚀刻表面（82）和非蚀刻表面（84）的晶片（80）上的高纵横比蚀刻特征的深度的系统（10）。 系统（10）利用红外反射计（12），在优选实施例中，扫描激光器（14），光纤循环器（16），光电检测器（22）和组合准直仪（18）和物镜（20） ）。 从物镜（20），产生被施加到晶片（80）的未蚀刻表面（84）的聚焦入射光（23）。 从晶片（80）产生的反射光（25）通过反射计（12）处理并被施加到产生相应的数字数据信号（29）的ADC（24）。 数字数据信号（29）被应用于与软件（32）组合的计算机（30），其测量在显示器（34）上被观看的蚀刻特征的深度。

公开(公告)号：US20020135784A1

公开(公告)日：2002-09-26

申请号：US10092866

申请日：2002-03-06

Applicant: Rudolph Technologies, Inc.

Inventor： Christopher Morath ,  Andrey Vertikov

IPC: G01B011/06

CPC classification number: G01N29/2418 ,  G01B11/0666

Abstract: Disclosed are methods and apparatus for reducing thermal loading of a film disposed on a surface of a sample, such as a semiconductor wafer, while obtaining a measurement of a thickness of the film in an area about a measurement site. The method includes steps of (a) bringing an optical assembly of the measurement system into focus; (b) aligning a beam spot with the measurement site; (c) turning on one of a dither EOM or a dither AOM or a piezo-electric dither assembly to sweep the beam spot in an area about the measurement site, thereby reducing the thermal loading within the measurement site; (d) making a measurement by obtaining a signal representing an average for the film under the area; (e) recording the measurement data; and (f) analyzing the measurement data to determine an average film thickness in the measurement area.

Abstract translation: 公开了一种降低设置在诸如半导体晶片的样品的表面上的膜的热负荷的方法和装置，同时在测量位置的区域中获得薄膜厚度的测量。 该方法包括以下步骤：（a）使测量系统的光学组件聚焦; （b）将光斑与测量部位对准; （c）打开抖动EOM或抖动AOM或压电抖动组件中的一个以扫描测量位置周围区域中的光斑，从而降低测量位置内的热负荷; （d）通过获得表示该区域下的电影的平均值的信号进行测量; （e）记录测量数据; 和（f）分析测量数据以确定测量区域中的平均膜厚度。

公开(公告)号：US11315832B2

公开(公告)日：2022-04-26

申请号：US16067748

申请日：2016-12-23

Applicant: Rudolph Technologies, Inc.

Inventor： Wayne Fitzgerald

IPC: H01L21/78 ,  H01L21/66 ,  G06T7/13 ,  G06T7/00 ,  G06T7/55 ,  G06T7/73 ,  G06T7/33

Abstract: A method for monitoring and controlling a substrate singulation process is described. Device edges are imaged and identified for analysis. Discrepancies in device edges are noted and used to modify a singulation process and to monitor the operation of singulation processes for anomalous behavior.

公开(公告)号：US20220012261A2

公开(公告)日：2022-01-13

申请号：US16651870

申请日：2018-09-28

Applicant: Rudolph Technologies, Inc.

Inventor： Kevin Barr ,  Edward Condon

IPC: G06F16/25 ,  G06F16/176 ,  G06F16/26 ,  G06F16/28

Abstract: A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.

公开(公告)号：US09772183B2

公开(公告)日：2017-09-26

申请号：US14409756

申请日：2013-06-27

Applicant: Rudolph Technologies Inc.

Inventor： Wojciech Stefanczyk ,  James Francis Kane ,  Michael Colgan ,  James Abondolo

IPC: G01B11/00 ,  G01B21/04

CPC classification number: G01B21/047 ,  G01B11/005

Abstract: The present disclosure provides a system and method of optical inspection of substrates that have relative large variations in topography. The present disclosure provides a system wherein optical components of the optical inspection system can be automatically moved vertically towards or away from the substrate during optical inspection of the substrate. The system moves the optics in a controlled and precise manner, thereby enabling accurate on-the-fly inspection of substrates having a large variation in topography.

公开(公告)号：US09684052B2

公开(公告)日：2017-06-20

申请号：US14298539

申请日：2014-06-06

Applicant: Rudolph Technologies, Inc.

Inventor： Greg Olmstead

IPC: G01R31/00 ,  G01R35/00 ,  G01R31/28

CPC classification number: G01R35/00 ,  G01R31/2891

Abstract: A method of assessing functionality of a probe card includes providing a probe card analyzer without a probe card interface, removably coupling a probe card having probes to a support plate of the probe card analyzer, aligning a sensor head of the probe card analyzer with the probe card, and measuring a component of the probes with the sensor head.

公开(公告)号：US20170141004A1

公开(公告)日：2017-05-18

申请号：US15346278

申请日：2016-11-08

Applicant: Rudolph Technologies, Inc.

Inventor： Michael Kotelyanskii ,  Roman Basistyy

IPC: H01L21/66 ,  G01R31/302 ,  G01R31/28 ,  H01L21/768 ,  G01N21/17

CPC classification number: G01R31/3025 ,  G01N21/1702 ,  G01N21/9501 ,  H01L21/7685 ,  H01L21/76883 ,  H01L22/12 ,  H01L24/11

Abstract: Methods and systems for manufacturing and analyzing interconnect structures in integrated circuit (IC) devices. The methods include forming an interconnect structure, such as a pillar, in an IC device. The pillar is analyzed using an opto-acoustic sensor to quantify physical characteristics used to determine whether the pillar satisfies predetermined quality criterion. The analysis includes capturing an opto-acoustic signal from the pillar and estimating optical parameters for a number of local maxima of the signal. A mode may then be fitted for each of the identified local maxima based on the optical characteristics. The modes and estimated optical parameters may then be iteratively corrected in an order from strongest to weakest local maximum. The corrected values may then be compared to a predicted physical model to identify the physical characteristics of the pillar. If the physical characteristics fall outside of the quality criterion, manufacturing processes may be altered.

公开(公告)号：US20170045463A1

公开(公告)日：2017-02-16

申请号：US15305380

申请日：2015-04-21

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Holger Wenz

IPC: G01N21/95 ,  G01N21/47 ,  G01B11/24 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01B11/24 ,  G01N21/47 ,  G01N21/474 ,  G01N21/8806 ,  G01N21/9505 ,  G01N21/958 ,  G01N2021/4735 ,  G01N2201/06113

Abstract: A system for scanning a substrate and specifically a volume of that substrate to identify anomalous structures or defects is herein described. Radiation is focused at locations within the volume of the substrate and measurements of scattered light are made. Scanning of the volume of a substrate may be fairly uniform or over selected regions, favoring those regions of the substrate that are to be involved with subsequent substrate processing steps.

Abstract translation: 这里描述了用于扫描基底，特别是该基底的体积以识别异常结构或缺陷的系统。 辐射集中在基板体积内的位置，并且进行散射光的测量。 衬底的体积的扫描可以是相当均匀的或超过所选择的区域，有利于衬底的那些随后的衬底处理步骤的区域。