公开(公告)号：US06808467B2

公开(公告)日：2004-10-26

申请号：US10147710

申请日：2002-05-17

Applicant: Hiroyuki Takeda ,  Shinji Tsuruta ,  Hiroyoshi Mitsuhashi ,  Sadao Kojima ,  Akira Terao ,  Kensuke Nakamura ,  Hajime Maeda ,  Masashi Yamada

Inventor： Hiroyuki Takeda ,  Shinji Tsuruta ,  Hiroyoshi Mitsuhashi ,  Sadao Kojima ,  Akira Terao ,  Kensuke Nakamura ,  Hajime Maeda ,  Masashi Yamada

IPC: F16H708

CPC classification number: F16H7/08 ,  F16H2007/0804 ,  F16H2007/0872

Abstract: A blade tensioner of a blade tensioner system for a chain that drivingly connects a drive shaft to a driving shaft in an engine, that improves the chain-damping efficiency in a blade tensioner applied to the chain within an engine, prevents the sideways tilt of the blade tensioner during operation, in a blade tensioner applied to the chain in an engine, and provides a blade tensioner with a functionality that allows it to transversely guide a chain along the chain sliding face in a blade shoe, while maintaining the flexural deformability (i.e., the flexibility) of the blade shoe.

公开(公告)号：US06768197B2

公开(公告)日：2004-07-27

申请号：US10168645

申请日：2002-06-24

Applicant: Takeshi Hosomi ,  Ryouichi Okada ,  Kensuke Nakamura ,  Toyosei Takahashi

Inventor： Takeshi Hosomi ,  Ryouichi Okada ,  Kensuke Nakamura ,  Toyosei Takahashi

IPC: H01I2348

CPC classification number: H01L24/81 ,  B23K35/224 ,  B23K35/3612 ,  B23K35/3613 ,  H01L21/563 ,  H01L2224/13111 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/284 ,  H05K3/3489 ,  H01L2224/0401

Abstract: A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.

公开(公告)号：US06308679B1

公开(公告)日：2001-10-30

申请号：US09507788

申请日：2000-02-22

Applicant: Kensuke Nakamura ,  Fuminori Kawashima ,  Hidehiko Kamiyama

Inventor： Kensuke Nakamura ,  Fuminori Kawashima ,  Hidehiko Kamiyama

IPC: F01M500

CPC classification number: F01L1/024 ,  F01L1/02 ,  F01L1/022 ,  F02B2275/18 ,  F16H7/18 ,  F16H2007/0872

Abstract: The interior of a chain case 23 accommodating therein a chain-sprocket mechanism (a sprocket 12 and a silent chain 14)provided for rotating a crankshaft 11 and camshafts 5 in an interlocking fashion and a tensioner shoe 18 for applying a predetermined tension to a slack side of a chain or a guide shoe 19 for preventing the run-out of the chain on a stretched side thereof is partitioned by providing a rib 27, 28 so as to protrude from at least either of an end face of an engine E and an inner surface of a chain cover 22 joined to the end face with distal end edges of the ribs being directed toward sides 18a, 18b of the tensioner shoe or the guide shoe that are perpendicular to the crankshaft. According to this construction, since the rib provided so as to protrude from the cylinder block or the chain cover cooperates with the tensioner shoe or the guide shoe so as to form a separator, an oil passage having a sufficient cross-sectional area can be defined without control from the chain line and necessity of enlargement of the engine.

Abstract translation: 链条壳体23的内部容纳有链轮机构（链轮12和无声链条14），链轮机构（链轮12和无声链条14），用于以互锁的方式旋转曲轴11和凸轮轴5，以及张紧器鞋18，用于将预定的张力施加到松弛 通过设置肋27,28来分隔链条或引导靴19的一侧，用于防止链条在其拉伸侧的脱出，从而从发动机E的端面和 连接到端面的链条盖22的内表面，其肋的远端边缘指向张紧器鞋或引导靴的与曲轴垂直的侧面18a，18b。 根据该结构，由于设置成从气缸体或链罩突出的肋与张紧器靴或导靴配合以形成隔板，因此可以定义具有足够横截面面积的油路 不受链条控制和发动机扩大的必要性。

公开(公告)号：US5913742A

公开(公告)日：1999-06-22

申请号：US911279

申请日：1997-08-14

Applicant: Kensuke Nakamura ,  Kouji Hirano ,  Tomoki Okita ,  Shinji Yamada ,  Fuminori Kawashima

Inventor： Kensuke Nakamura ,  Kouji Hirano ,  Tomoki Okita ,  Shinji Yamada ,  Fuminori Kawashima

IPC: F02B67/06 ,  F16H7/08

CPC classification number: F16H7/0848 ,  F02B67/06 ,  F16H2007/0806 ,  F16H2007/0853 ,  F16H2007/0859 ,  F16H2007/0885 ,  F16H2007/0891

Abstract: A tensioner for an endless transmitting member is provided to reliably prevent the loosening of an endless chain, while preventing the occurrence of an incorrect meshing of the endless chain with sprockets. A plunger holder is biased in an advancing direction by the action of a first spring supported in a housing, and a plunger, carried in the plunger holder, is biased in an advancing direction by the action of a second spring having a spring constant larger than that of the first spring. Only the movement of the plunger holder in the advancing direction is permitted by a ratchet mechanism mounted between the plunger holder and the housing. During operation of the engine, the advancing movement of the plunger holder is inhibited by the hydraulic pressure transmitted to a hydraulic pressure chamber, and the plunger is advanced and retracted in accordance with a variation in tension of the endless chain. When the engine is stopped, the ratchet mechanism is operated in accordance with the elongation of the endless chain due to wearing to advance the plunger holder one pitch at a time along with the plunger.

Abstract translation: 提供用于无端传递构件的张紧器，以可靠地防止环形链条的松动，同时防止环链与链轮的不正确啮合的发生。 柱塞保持器通过支撑在壳体中的第一弹簧的作用沿前进方向偏置，并且承载在柱塞保持器中的柱塞通过弹簧常数大于第二弹簧的第二弹簧的作用沿前进方向偏置 第一个春天。 通过安装在柱塞保持器和壳体之间的棘轮机构，允许柱塞保持器在前进方向上的移动。 在发动机工作期间，通过传递到液压室的液压阻止柱塞保持器的前进运动，并且柱塞根据环形链的张力变化而前进和缩回。 当发动机停止时，棘轮机构根据环形链的伸长而由于磨损而一起操作，以使柱塞保持架一次与柱塞一起推进。

公开(公告)号：US09349714B2

公开(公告)日：2016-05-24

申请号：US14239960

申请日：2012-08-24

Applicant: Kensuke Nakamura ,  Toru Meura ,  Yoji Ishimura

Inventor： Kensuke Nakamura ,  Toru Meura ,  Yoji Ishimura

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L25/50 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7598 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81209 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/05552

Abstract: A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.

Abstract translation: 提供一种制造半导体器件的方法，其能够提高生产率和可靠性。 制造本发明的半导体器件（1）的方法包括顺序堆叠工艺，单独的层叠体获得工艺和基材粘合工艺。 在顺序堆叠处理中，获得块堆叠体。 块状堆叠体是在未焊接的状态下层叠有半导体块（10B，12B，14B，16B）的块状堆叠体（2B）。 在半导体块（10B，12B，14B，16B）中，配置有多个半导体元件。 在各个层叠体的取得处理中，获得堆叠的半导体部件的端子被焊接并在堆叠的半导体部件单元中从块状堆叠体（2B）切断的单个层叠体（2）。

公开(公告)号：US09002609B2

公开(公告)日：2015-04-07

申请号：US13701165

申请日：2011-06-06

Applicant: Kensuke Nakamura ,  Noriaki Fujiki ,  Keigo Ajiro

Inventor： Kensuke Nakamura ,  Noriaki Fujiki ,  Keigo Ajiro

IPC: B60T7/12 ,  B60T8/17 ,  B60T1/10 ,  B60T13/74 ,  B60W10/08 ,  B60W10/188 ,  B60W30/18 ,  B60T8/1755 ,  B60T8/176 ,  B60W50/00

CPC classification number: B60T8/17 ,  B60T1/10 ,  B60T8/1755 ,  B60T8/176 ,  B60T13/745 ,  B60T2270/604 ,  B60W10/08 ,  B60W10/188 ,  B60W30/18127 ,  B60W2050/0052

Abstract: A vehicle brake control system includes a regenerative braking control component, a frictional braking control component, a calculating component and a controlling component. The regenerative braking control component controls a regenerative braking device to provide a regenerative braking torque. The frictional braking control component controls a frictional braking device to provide a frictional braking torque. The calculating component calculates a regenerative braking torque filter processing value based on a fluctuation frequency of the regenerative braking torque. The controlling component, during a first condition, operates a motorized power assist control device based on the regenerative braking torque filter processing value, instead of the regenerative braking torque, to moderate the frictional braking torque, such that the regenerative braking torque and the moderated frictional braking torque provide a target braking torque based on a braking operation.

Abstract translation: 车辆制动控制系统包括再生制动控制部件，摩擦制动控制部件，计算部件和控制部件。 再生制动控制部件控制再生制动装置，以提供再生制动转矩。 摩擦制动控制部件控制摩擦制动装置以提供摩擦制动转矩。 计算部件基于再生制动转矩的变动频率来计算再生制动转矩滤波处理值。 控制部件在第一状态下，基于再生制动转矩滤波器处理值而不是再生制动转矩来操作电动助力控制装置，以调节摩擦制动转矩，使得再生制动转矩和调节摩擦 制动力矩基于制动操作提供目标制动转矩。

公开(公告)号：US08227703B2

公开(公告)日：2012-07-24

申请号：US12593749

申请日：2008-01-17

Applicant: Hironori Maruyama ,  Kensuke Nakamura ,  Toru Meura ,  Hiroshi Hirose

Inventor： Hironori Maruyama ,  Kensuke Nakamura ,  Toru Meura ,  Hiroshi Hirose

IPC: H05K1/03

CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/0271 ,  H05K1/0366 ,  H05K3/205 ,  H05K3/4676 ,  H05K3/4682 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/1536 ,  H01L2924/00

Abstract: A multilayered circuit board of the present invention has a single-side laminated structure and does not include a core substrate having via-holes formed therethrough and vias for providing electrical connection through the via-holes. The multilayered circuit board includes a plurality of pairs of layers, each pair including a conductor circuit layer and an insulator layer, wherein a glass transition temperature of each insulator layer is 170° C. or higher, a coefficient of thermal expansion at the glass transition temperature or lower of each insulator layer is 35 ppm or less, and a modulus of elasticity of each insulator layer is 5 GPa or more.

Abstract translation: 本发明的多层电路板具有单面层叠结构，不包括具有通孔形成的芯基板和用于通过通孔提供电连接的通孔。 多层电路板包括多对层，每对层包括导体电路层和绝缘体层，其中每个绝缘体层的玻璃化转变温度为170℃或更高，玻璃化转变温度系数 每个绝缘体层的温度或低于35ppm或更低，并且每个绝缘体层的弹性模量为5GPa以上。

公开(公告)号：US08062539B2

公开(公告)日：2011-11-22

申请号：US11659973

申请日：2005-08-09

Applicant: Kensuke Nakamura

Inventor： Kensuke Nakamura

IPC: C03C15/00

CPC classification number: H05K1/162 ,  H05K3/002 ,  H05K3/0044 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2203/025 ,  H05K2203/0554 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer printed wiring board which enables the dielectric layers to have excellent thickness uniformity, the capacitor circuits to have high registration accuracy and the unnecessary dielectric layer is removed as large as possible; and a multilayer printed wiring board with an embedded capacitor circuit manufactured by the method.

Abstract translation: 可以尽可能地去除能够使电介质层具有优异的厚度均匀性，具有高配准精度的电容器电路和不需要的介电层的多层印刷线路板的制造方法。 以及通过该方法制造的具有嵌入式电容器电路的多层印刷线路板。

公开(公告)号：US20100025093A1

公开(公告)日：2010-02-04

申请号：US12593749

申请日：2008-01-17

Applicant: Hironori Maruyama ,  Kensuke Nakamura ,  Toru Meura ,  Hiroshi Hirose

Inventor： Hironori Maruyama ,  Kensuke Nakamura ,  Toru Meura ,  Hiroshi Hirose

IPC: H05K1/03

CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/0271 ,  H05K1/0366 ,  H05K3/205 ,  H05K3/4676 ,  H05K3/4682 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/1536 ,  H01L2924/00

Abstract: A multilayered circuit board of the present invention has a single-side laminated structure and does not include a core substrate having via-holes formed therethrough and vias for providing electrical connection through the via-holes. The multilayered circuit board includes a plurality of pairs of layers, each pair including a conductor circuit layer and an insulator layer, wherein a glass transition temperature of each insulator layer is 170° C. or higher, a coefficient of thermal expansion at the glass transition temperature or lower of each insulator layer is 35 ppm or less, and a modulus of elasticity of each insulator layer is 5 GPa or more.

Abstract translation: 本发明的多层电路板具有单面层叠结构，不包括具有通孔形成的芯基板和用于通过通孔提供电连接的通孔。 多层电路板包括多对层，每对层包括导体电路层和绝缘体层，其中每个绝缘体层的玻璃化转变温度为170℃或更高，玻璃化转变温度系数 每个绝缘体层的温度或低于35ppm或更低，并且每个绝缘体层的弹性模量为5GPa以上。

公开(公告)号：US20090218672A1

公开(公告)日：2009-09-03

申请号：US12298706

申请日：2007-04-26

Applicant: Kensuke Nakamura ,  Hiroshi Hirose

Inventor： Kensuke Nakamura ,  Hiroshi Hirose

IPC: H01L23/52 ,  H05K1/02 ,  B32B9/04 ,  B32B3/00 ,  B32B7/02 ,  B32B17/10 ,  B32B27/38

CPC classification number: H05K3/281 ,  B32B3/263 ,  B32B5/022 ,  B32B5/024 ,  B32B27/10 ,  B32B27/12 ,  B32B27/18 ,  B32B27/20 ,  B32B27/28 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0238 ,  B32B2262/0246 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/0292 ,  B32B2262/101 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/402 ,  B32B2307/50 ,  B32B2307/718 ,  B32B2457/08 ,  C08G2650/56 ,  C08L63/00 ,  C08L65/00 ,  C08L71/00 ,  H05K1/0269 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2203/161 ,  Y10T428/24612 ,  Y10T428/2495 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31525 ,  C08L2666/14

Abstract: The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.

Abstract translation: 本发明提供一种阻焊材料，其即使在薄的布线板中使用也能够抑制暴露于热或冲击时的半导体封装的翘曲，并且满足电子器件的尺寸减小和更高的集成度的需求，以及 包括阻焊材料和半导体封装的布线板。 本发明的阻焊材料能够有效地抑制通过设置在树脂层之间的含有纤维基材的层的半导体封装的翘曲。 含有纤维基材的层优选在阻焊材料的厚度方向上不均匀地分布。