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    Micro-electro mechanical tunneling switch
    21.
    发明授权
    Micro-electro mechanical tunneling switch 有权
    微电机械隧道开关

    公开(公告)号：US08432239B2

    公开(公告)日：2013-04-30

    申请号：US11943146

    申请日：2007-11-20

    Applicant: Carl O. Bozler ,  Craig L. Keast ,  Jeremy Muldavin

    Inventor： Carl O. Bozler ,  Craig L. Keast ,  Jeremy Muldavin

    IPC: H01H51/22

    CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B2201/014 ,  H01H2059/0063 ,  H01H2059/0072

    Abstract: A micro-electromechanical system switch includes a substrate and a plurality of actuating electrodes formed the substrate wherein each actuating electrode is activatable. A cantilever beam has a first end and a second end and a plurality of stops formed thereon. The plurality of stops engages the substrate between the plurality of actuating electrode. A contact area is formed in the substrate and located to engage the second end of the cantilever beam. A voltage source applies a voltage to each actuating electrode independently in a sequence from an actuating electrode located adjacent to the first end of the cantilever beam to an actuating electrode located adjacent to the second end of the cantilever beam so that the plurality of stops sequentially engage the substrate between the plurality of actuating electrodes.

    Abstract translation: 微机电系统开关包括基板和形成基板的多个致动电极，其中每个致动电极都是可激活的。 悬臂梁具有形成在其上的第一端和第二端以及多个挡块。 多个止动件与多个致动电极之间的基板接合。 接触区域形成在基板中并且被定位成接合悬臂梁的第二端。 电压源以与从悬臂梁的第一端相邻的致动电极的顺序独立地向每个致动电极施加电压到与悬臂梁的第二端相邻的致动电极，使得多个停止件顺序地接合 多个致动电极之间的基板。

    ELIMINATION OF SILICON RESIDUES FROM MEMS CAVITY FLOOR
    22.
    发明申请
    ELIMINATION OF SILICON RESIDUES FROM MEMS CAVITY FLOOR 有权
    从MEMS CAVITY地板消除硅残余物

    公开(公告)号：US20130032453A1

    公开(公告)日：2013-02-07

    申请号：US13565693

    申请日：2012-08-02

    Applicant: Brian I. Troy ,  Mickael Renault ,  Thomas L. Maguire ,  Joseph Damian Gordon Lacey ,  James F. Bobey

    Inventor： Brian I. Troy ,  Mickael Renault ,  Thomas L. Maguire ,  Joseph Damian Gordon Lacey ,  James F. Bobey

    IPC: H01H59/00 ,  H01H65/00

    CPC classification number: B81C1/00484 ,  B81B3/0008 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81C2201/0108 ,  H01H1/0036 ,  H01H2001/0089

    Abstract: The present invention generally relates to a MEMS device in which silicon residues from the adhesion promoter material are reduced or even eliminated from the cavity floor. The adhesion promoter is typically used to adhere sacrificial material to material above the substrate. The adhesion promoter is the removed along with then sacrificial material. However, the adhesion promoter leaves silicon based residues within the cavity upon removal. The inventors have discovered that the adhesion promoter can be removed from the cavity area prior to depositing the sacrificial material. The adhesion promoter which remains over the remainder of the substrate is sufficient to adhere the sacrificial material to the substrate without fear of the sacrificial material delaminating. Because no adhesion promoter is used in the cavity area of the device, no silicon residues will be present within the cavity after the switching element of the MEMS device is freed.

    Abstract translation: 本发明一般涉及一种MEMS器件，其中来自粘合促进剂材料的硅残余物从空腔底板减少甚至消除。 粘合促进剂通常用于将牺牲材料粘附到衬底上方的材料上。 粘附促进剂与牺牲材料一起被去除。 然而，粘合促进剂在去除时将硅基残留物留在空腔内。 发明人已经发现，在沉积牺牲材料之前，可以从空腔区域去除粘合促进剂。 保留在基材的其余部分上的粘合促进剂足以将牺牲材料粘附到基材上，而不用担心牺牲材料分层。 因为在器件的空腔区域中没有使用粘合促进剂，所以在MEMS器件的开关元件被释放之后，腔内将不存在硅残余物。

    MEMS SWITCHES AND FABRICATION METHODS
    23.
    发明申请
    MEMS SWITCHES AND FABRICATION METHODS 失效
    MEMS开关和制造方法

    公开(公告)号：US20120138436A1

    公开(公告)日：2012-06-07

    申请号：US12961047

    申请日：2010-12-06

    Applicant: Jeffrey P. Gambino ,  Stephen A. Mongeon

    Inventor： Jeffrey P. Gambino ,  Stephen A. Mongeon

    IPC: H01H59/00 ,  H05K13/00

    CPC classification number: H01H59/0009 ,  B81B2201/014 ,  B81B2203/051 ,  B81C1/00293 ,  B81C2203/0145 ,  H01H2001/0052 ,  H01H2059/0027

    Abstract: MEMS switches and methods of fabricating MEMS switches. The switch has a vertically oriented deflection electrode having a conductive layer supported by a supporting layer, at least one drive electrode, and a stationary electrode. An actuation voltage applied to the drive electrode causes the deflection electrode to be deflect laterally and contact the stationary electrode, which closes the switch. The deflection electrode is restored to a vertical position when the actuation voltage is removed, thereby opening the switch. The method of fabricating the MEMS switch includes depositing a conductive layer on mandrels to define vertical electrodes and then releasing the deflection electrode by removing the mandrel and layer end sections.

    Abstract translation: MEMS开关和制造MEMS开关的方法。 开关具有垂直取向的偏转电极，其具有由支撑层支撑的导电层，至少一个驱动电极和固定电极。 施加到驱动电极的致动电压使得偏转电极横向偏转并且接触固定电极，该固定电极闭合开关。 当去除致动电压时，偏转电极恢复到垂直位置，从而打开开关。 制造MEMS开关的方法包括在心轴上沉积导电层以限定垂直电极，然后通过去除心轴和层端部来释放偏转电极。

    HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE
    24.
    发明申请
    HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE 失效
    水平共振开关及其制造方法

    公开(公告)号：US20120025331A1

    公开(公告)日：2012-02-02

    申请号：US12844299

    申请日：2010-07-27

    Applicant: Felix P. ANDERSON ,  Thomas L. MCDEVITT ,  Anthony K. STAMPER

    Inventor： Felix P. ANDERSON ,  Thomas L. MCDEVITT ,  Anthony K. STAMPER

    IPC: H01L29/84 ,  H01L21/02 ,  G06F17/50

    CPC classification number: H01H59/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00182 ,  B81C2201/0107 ,  G06F17/5068

    Abstract: A MEMS structure and methods of manufacture. The method includes forming a sacrificial metal layer at a same level as a wiring layer, in a first dielectric material. The method further includes forming a metal switch at a same level as another wiring layer, in a second dielectric material. The method further includes providing at least one vent to expose the sacrificial metal layer. The method further includes removing the sacrificial metal layer to form a planar cavity, suspending the metal switch. The method further includes capping the at least one vent to hermetically seal the planar cavity.

    Abstract translation: MEMS结构及制造方法。 该方法包括在第一电介质材料中形成与布线层相同水平的牺牲金属层。 该方法还包括在第二电介质材料中形成与另一布线层相同水平的金属开关。 该方法还包括提供至少一个通风口以暴露牺牲金属层。 该方法还包括去除牺牲金属层以形成平坦的空腔，使金属开关悬挂。 该方法还包括加盖至少一个通气口以气密地密封平面腔。

    SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY
    27.
    发明申请
    SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY 审中-公开
    开关及其制造方法和继电器

    公开(公告)号：US20110209970A1

    公开(公告)日：2011-09-01

    申请号：US13029898

    申请日：2011-02-17

    Applicant: Takahiro Masuda ,  Naoki Yoshitake ,  Kenichi Hinuma ,  Junya Yamamoto ,  Takashi Fujisawa ,  Takeshi Fujiwara

    Inventor： Takahiro Masuda ,  Naoki Yoshitake ,  Kenichi Hinuma ,  Junya Yamamoto ,  Takashi Fujisawa ,  Takeshi Fujiwara

    IPC: H01H59/00 ,  H01H11/00

    CPC classification number: H01H1/06 ,  B81B2201/014 ,  B81C1/00166 ,  B81C2201/0177 ,  B81C2201/0181 ,  B81C2201/0184 ,  H01H1/0036 ,  H01H2001/0052 ,  Y10T29/49105

    Abstract: A switch and a relay include a contact with a smooth contacting surface. A side surface of a fixed contact faces a side surface of a movable contact. The fixed contact has an insulating layer and a base layer stacked on a fixed contact substrate, and a first conductive layer formed thereon through electrolytic plating. The side surface of the first conductive layer that faces the movable contact becomes the fixed contact (contacting surface). The movable contact has an insulating layer and a base layer stacked on the movable contact substrate, and a movable contact formed thereon through electrolytic plating. A side surface of a second conductive layer that faces the fixed contact becomes the movable contact (contacting surface). The fixed contact and the movable contact have surfaces that contact the side surfaces of the mold portion when growing the first and second conductive layers through electrolytic plating.

    Abstract translation: 开关和继电器包括具有光滑接触表面的触点。 固定触点的侧表面面对活动触点的侧表面。 固定触点具有层叠在固定接触基板上的绝缘层和基层，以及通过电解电镀形成在其上的第一导电层。 第一导电层的面对可动触点的侧表面成为固定触点（接触面）。 可动触头具有堆叠在可动触点基板上的绝缘层和基极层，以及通过电解电镀形成的可动触点。 面对固定触点的第二导电层的侧表面成为可动触头（接触面）。 固定触点和可动触点具有通过电解电镀生长第一和第二导电层时与模具部分的侧表面接触的表面。

    Switch array
    28.
    发明授权
    Switch array 失效
    开关阵列

    公开(公告)号：US07994443B2

    公开(公告)日：2011-08-09

    申请号：US11886856

    申请日：2006-03-20

    Applicant: Masato Hayashi ,  Masami Yakabe ,  Tetsuya Hasebe ,  Muneo Harada ,  Katsuya Okumura

    Inventor： Masato Hayashi ,  Masami Yakabe ,  Tetsuya Hasebe ,  Muneo Harada ,  Katsuya Okumura

    IPC: H01H1/00 ,  H01H9/00

    CPC classification number: H01H1/0036 ,  B81B3/0054 ,  B81B2201/014 ,  B81B2203/053 ,  H01H1/24 ,  H01H37/46 ,  H01H67/22 ,  H01H2001/0042 ,  H01H2037/008

    Abstract: A first wiring layer 16 is disposed on an insulating film 14 on the lower surface of an upper substrate 15, while a second wiring layer 13three-dimensionally crossing the first wiring layer 16 is provided on the insulating film 12 on a lower substrate 11. A cantilever 17 has one end connected to the first wiring layer 16 and the other end opposed to the second wiring layer 13 with a space therebetween. A thermoplastic sheet 19 is arranged on the upper substrate 15 so as to cover the through-hole 18. The thermoplastic sheet 19 is pressed by a heated pin 20 against the cantilever 17 and deformed so as to maintain the connection between the cantilever 17and the second wiring layer 13, and therefore close the switch 10.

    Abstract translation: 第一布线层16设置在上基板15的下表面上的绝缘膜14上，而在下基板11上的绝缘膜12上设置与第一布线层16三维交叉的第二布线层13。 悬臂17的一端与第一配线层16连接，另一端与第二配线层13相对置，而其间具有间隔。 热塑片19布置在上基板15上以覆盖通孔18.热塑片19被加热的销20压靠在悬臂17上并变形，从而保持悬臂17和第二个之间的连接 布线层13，因此闭合开关10。

    Shaped MEMS contact
    29.
    发明授权
    Shaped MEMS contact 有权
    成型MEMS接触

    公开(公告)号：US07906738B1

    公开(公告)日：2011-03-15

    申请号：US12578034

    申请日：2009-10-13

    Applicant: Ronald A. Coutu, Jr. ,  Paul E. Kladitis ,  Robert L. Crane

    Inventor： Ronald A. Coutu, Jr. ,  Paul E. Kladitis ,  Robert L. Crane

    IPC: H01L29/78

    CPC classification number: B81C1/0015 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/019 ,  B81B2203/04 ,  B81C1/00103 ,  H01H2001/0052

    Abstract: A MEMS switch fabrication process and apparatus inclusive of a bulbous rounded surface movable contact assembly that is integral with the switch movable element and achieving of long contact wear life with low contact electrical resistance. The disclosed process is compatible with semiconductor integrated circuit fabrication materials and procedures and includes an unusual photoresist reflow step in which the bulbous contact shape is quickly defined in three dimensions from more easily achieved integrated circuit mask and etching-defined precursor shapes. A plurality of differing photoresist materials are used in the process. A large part of the contact and contact spring formation used in the invention is accomplished with low temperature processing including electroplating. Alternate processing steps achieving an alloy metal contact structure are included. Use of a subroutine of processing steps to achieve differing but related portions of the electrical contact structure is also included.

    Abstract translation: 一种MEMS开关制造工艺和装置，包括与开关可移动元件成一体的球形圆形表面可移动接触组件，并实现具有低接触电阻的长接触磨损寿命。 所公开的方法与半导体集成电路制造材料和程序兼容，并且包括异常的光刻胶回流步骤，其中球状接触形状从更容易实现的集成电路掩模和蚀刻限定的前体形状三维地快速地限定。 在该过程中使用多种不同的光致抗蚀剂材料。 本发明中使用的接触和接触弹簧形成的大部分是通过包括电镀在内的低温处理实现的。 包括实现合金金属接触结构的替代处理步骤。 还包括使用处理步骤的子程序来实现电接触结构的不同但有关的部分。

    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    30.
    发明申请
    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    电子设备及其制造方法

    公开(公告)号：US20100294633A1

    公开(公告)日：2010-11-25

    申请号：US12783124

    申请日：2010-05-19

    Applicant: Tadashi NAKATANI ,  Hiroaki Inoue ,  Hitoshi Yamada ,  Satoshi Ueda

    Inventor： Tadashi NAKATANI ,  Hiroaki Inoue ,  Hitoshi Yamada ,  Satoshi Ueda

    IPC: H01H57/00

    CPC classification number: H01H59/0009 ,  B81B7/007 ,  B81B2201/014 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/30105

    Abstract: An electronic device includes a substrate, a stationary electrode provided above the substrate, a movable electrode that is provided to face the stationary electrode, a wall portion that is provided on the substrate and surrounds the movable electrode and the stationary electrode, a film member that is fixed to the wall portion and seals space including the movable electrode and the stationary electrode, and a support portion that is provided, on an inner side of the wall portion on the substrate, in addition to the movable electrode and the stationary electrode to support the film member from within the space.

    Abstract translation: 一种电子设备，包括基板，设置在基板上方的固定电极，设置成面向固定电极的可动电极，设置在基板上并围绕可动电极和固定电极的壁部;膜部件， 被固定到壁部分并且密封包括可动电极和固定电极的空间，以及在可移动电极和固定电极之外还设置在基板上的壁部的内侧上的支撑部分 电影会员从空间内。

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