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公开(公告)号：US11910160B2
公开(公告)日：2024-02-20
申请号：US17550716
申请日：2021-12-14
Applicant: Shinsung SoundMotion Co., Ltd.
Inventor： Sangwoo Lee , Kyudong Jung , Jinho Kim
CPC classification number: H04R19/04 , B81B3/001 , B81B3/0072 , H04R7/04 , H04R7/18 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , H04R2201/003
Abstract: The present invention relates to a MEMS acoustic sensor for sensing variable capacitance between a flexible diaphragm and a back plate. The MEMS acoustic sensor is composed of a substrate comprising a cavity, a back plate supported on the substrate and comprising a plurality of through holes, an electrode formed on the inner surface of the back plate, at least one anchor protruding from the back plate toward the substrate, a diaphragm supported by the at least one anchor and deformed by a sound wave introduced from the outside through the cavity, and a stress release unit extending from the edge portion of the back plate and in contact with the substrate.
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公开(公告)号：US11905167B2
公开(公告)日：2024-02-20
申请号：US17932409
申请日：2022-09-15
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geissler , Matthias Friedrich Herrmann , Ulrich Krumbein , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
CPC classification number: B81C1/00158 , B81B3/0021 , B81B7/02 , B81C1/00103 , H04R1/08 , H04R7/02 , H04R7/08 , H04R31/003 , B81B2201/0257 , B81B2203/0127 , B81B2203/0384 , B81C2201/013 , H04R2201/003
Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.
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公开(公告)号：US11897762B2
公开(公告)日：2024-02-13
申请号：US17704667
申请日：2022-03-25
Applicant: Knowles Electronics, LLC
Inventor： Deepak Bharadwaj , Payel Mukherjee , Balabrahmachari Matcha , Gururaj Ghorpade
CPC classification number: B81C1/00238 , H02M3/156 , H04R1/083 , H04R31/006 , B81B2201/0257
Abstract: The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes an output driver circuit, a low drop out (LDO) regulator circuit, and an over-voltage protection circuit with improved capacity and response time.
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公开(公告)号：US20240015446A1
公开(公告)日：2024-01-11
申请号：US18050606
申请日：2022-10-28
Applicant: Fortemedia, Inc.
Inventor： Wen-Shan LIN , Chun-Kai MAO , Chih-Yuan CHEN , Jien-Ming CHEN , Feng-Chia HSU , Nai-Hao KUO
CPC classification number: H04R19/04 , B81B3/007 , H04R2201/003 , B81B2201/0257 , B81B2203/0127 , B81B2203/019
Abstract: A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.
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公开(公告)号：US20230382714A1
公开(公告)日：2023-11-30
申请号：US18201710
申请日：2023-05-24
Applicant: DB HITEK CO., LTD.
Inventor： Min Hyun JUNG , Joo Hyeon LEE
CPC classification number: B81B3/0021 , B81C1/00158 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81B2203/0338 , B81B2203/0353 , B81B2203/04 , B81C2201/0154 , B81C2201/014 , B81C2201/0133 , B81C2201/0166 , B81C2201/0164
Abstract: A MEMS microphone includes a substrate having a cavity, a diaphragm disposed above the cavity and having a ventilation path, and a back plate disposed above the diaphragm and having a plurality of air holes. The ventilation path includes a plurality of slits extending in a circumferential direction.
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Patent Agency Ranking
公开(公告)号：US11832057B2
公开(公告)日：2023-11-28
申请号：US18064896
申请日：2022-12-12
Applicant: Skyworks Solutions, Inc.
Inventor： Yu Hui , Guofeng Chen
CPC classification number: H04R17/02 , B81B3/0021 , H10N30/2047 , B81B2201/0257 , H04R2201/003
Abstract: A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer having substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.
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公开(公告)号：US20230370783A1
公开(公告)日：2023-11-16
申请号：US18356246
申请日：2023-07-21
Inventor： CHUN-WEN CHENG , CHUN YIN TSAI , CHIA-HUA CHU
CPC classification number: H04R17/02 , B81B3/0021 , B81C1/00158 , H04R2201/003 , B81B2203/0127 , B81B2203/04 , B81B2201/0257
Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.
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公开(公告)号：US11818542B2
公开(公告)日：2023-11-14
申请号：US17448352
申请日：2021-09-21
Applicant: GMEMS TECH SHENZHEN LIMITED
Inventor： Guanghua Wu , Xingshuo Lan , Zhixiong Xiao
CPC classification number: H04R19/04 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , H04R2201/003
Abstract: The present invention provides a MEMS microphone comprising (i) a substrate layer, (ii) a fixed backplate, and (iii) an intermediate layer sandwiched between the substrate layer and the fixed backplate. The substrate layer has a first opening through the thickness of the substrate layer. The intermediate layer has a second opening through the thickness of the intermediate layer. The fixed backplate forms a ceiling of the second opening, and the second opening is larger than the first opening and extends into the first opening, forming a looped recess (“undercut”). The looped recess is defined by a looped ledge on the substrate, a looped sidewall around the second opening, and a looped ceiling from the fixed backplate. The looped sidewall and the looped ceiling are made of a same material.
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29.发明公开公开(公告)号：US20230357001A1
公开(公告)日：2023-11-09
申请号：US18246790
申请日：2021-09-30
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Hans Artmann , Peter Schmollngruber , Thomas Friedrich , Uwe Schiller
CPC classification number: B81C1/00158 , B81B3/0021 , B81B2201/0257 , B81C2201/0105 , B81C2201/014 , B81C2203/038 , B81B2203/0307 , B81B2203/0315 , B81B2203/033 , B81B2203/0353
Abstract: A production method for a micromechanical component for a sensor device or microphone device. The method includes: forming a supporting structure composed of a first sacrificial material on a substrate surface of a substrate with a first sacrificial material layer, a plurality of etching holes structured through the first sacrificial material layer, and a plurality of supporting posts projecting into the substrate; etching into the substrate surface at least one cavity spanned by the supporting structure; forming a diaphragm composed of at least one semiconductor material on or over the first sacrificial material layer of the supporting structure; depositing a layer stack comprising at least one sacrificial layer and at least one counter electrode; and exposing the diaphragm by at least partially removing at least the supporting structure and the at least one sacrificial layer.
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公开(公告)号：US20230353933A1
公开(公告)日：2023-11-02
申请号：US18192722
申请日：2023-03-30
Applicant: SONICEDGE LTD.
Inventor： Mordehai Margalit
CPC classification number: H04R1/2803 , B81B7/02 , H04R19/02 , B81B2201/0257 , H04R2201/003 , H04R2217/03
Abstract: Techniques described herein generally relate to generating an audio signal with a speaker. In some examples, a speaker device is described that includes a membrane and a shutter and driver device is configured to receive an audio signal, modulate it and generate electric signals to operate the speaker and generate an acoustic audio signal.
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