公开(公告)号：US20140340904A1

公开(公告)日：2014-11-20

申请号：US14276921

申请日：2014-05-13

Applicant: Micro-Hybrid Electronic GmbH

Inventor： Steffen Biermann ,  André Magi ,  Patrick Sachse

IPC: F21V31/00 ,  F21V7/00 ,  H05K5/00 ,  G01J1/02

CPC classification number: F21V31/005 ,  F21V7/00 ,  G01J1/0271 ,  G01J1/0418 ,  G01J1/0437 ,  G01J1/0492 ,  G01J1/4228 ,  G01J5/045 ,  H05K5/0095

Abstract: A method for producing a hermetically gastight optoelectronic or electro-optical component with great robustness to heat and moisture is described. A housing cap is connected to a carrier in a hermetically gastight manner. Orifices in the housing cap are closed in a hermetically gastight manner by a window element. An electronic component with a housing has a housing cap, a carrier as base plate of the housing, and an interior space enclosed by the housing cap and the carrier. An optoelectronic or electro-optical converter element is arranged in the interior space. The housing cap is closed in a hermetically gastight manner by the carrier through a bonding connection of fused metal. The orifice is connected to the housing cap in a hermetically gastight manner by a window element along an edge metallization of the window element by a circumferential first seam of a fused metallic material.

Abstract translation: 描述了一种用于制造对热和湿度具有很强鲁棒性的气密气密光电或电光部件的方法。 壳体帽以气密气密的方式连接到载体。 壳体盖中的孔口通过窗口元件以密封气密的方式封闭。 具有壳体的电子部件具有壳体盖，作为壳体的基板的托架以及由壳体盖和托架包围的内部空间。 光电或电光转换器元件布置在内部空间中。 壳体盖通过熔融金属的接合连接由载体以气密气密的方式封闭。 通过熔融金属材料的周向第一接缝，孔口以气密气密的方式通过窗元件沿着窗元件的边缘金属化连接到壳体盖。

公开(公告)号：US08890071B2

公开(公告)日：2014-11-18

申请号：US13336501

申请日：2011-12-23

Applicant: Frédéric Perratone ,  Didier Simon

Inventor： Frédéric Perratone ,  Didier Simon

IPC: H01L21/56 ,  H01L27/146 ,  G01J5/04 ,  H01L23/10 ,  H01L23/26 ,  G01J5/20

CPC classification number: H01L27/14618 ,  G01J5/045 ,  G01J5/20 ,  H01L23/10 ,  H01L23/26 ,  H01L2924/0002 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A method of assembling and hermetically sealing a package including a side wall mounted on a substrate, with the space thus defined accommodating a component that operates in a controlled atmosphere, the space being closed off by a hermetic sealing cover mounted on said side wall. This method involves depositing a metallic connector element, also referred to as a brazing preform, on the upper face of the side wall; depositing the upper cover on, and in contact with, the brazing preform; subjecting the assembly thus obtained to the desired environment in terms of the kind of gas and operating pressure of the component; increasing the temperature to a value that is at least in excess of the melting temperature of the material that constitutes the brazing preform; then lowering said temperature in order to cause solidification of said brazing material and, consequently, sealing of the cover on the side wall.

Abstract translation: 一种组装和密封包装的方法，所述包装包括安装在基板上的侧壁，其中所述限定的空间容纳在受控气氛中操作的部件，所述空间被安装在所述侧壁上的密封盖封闭。 该方法包括在侧壁的上表面上沉积金属连接器元件，也称为钎焊预型件; 将上盖沉积在钎焊预成型件上并与其接触; 根据气体的种类和部件的工作压力，使由此获得的组件经受所需的环境; 将温度升高至至少超过构成钎焊预成型体的材料的熔融温度的值; 然后降低所述温度以引起所述钎焊材料的固化，并因此封盖在侧壁上。

公开(公告)号：US20140248735A1

公开(公告)日：2014-09-04

申请号：US14109917

申请日：2013-12-17

Applicant: Robert Bosch GmbH

Inventor： Fabian Purkl ,  Gary Yama ,  Ando Feyh ,  Andrew Graham ,  Ashwin Samarao ,  Gary O'Brien

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/09

CPC classification number: H01L31/0203 ,  G01J5/045 ,  G01J5/20 ,  H01L31/09 ,  H01L31/18

Abstract: A method of fabricating a bolometer infrared sensor includes depositing a first sacrificial layer on a surface of a substrate over a sensor region, and forming an absorber structure for the infrared sensor on top of the first sacrificial layer. A second sacrificial layer is deposited on top of the absorber structure. An encapsulating thin film is then deposited on top of the second sacrificial layer. Vent holes are formed in the encapsulating thin film. The first and the second sacrificial layers are removed below the encapsulating thin film to release the absorber structure and form a cavity above the sensing region that extends down to the substrate in which the absorber structure is located via the vent holes. The vent holes are then closed in a vacuum environment to seal the absorber structure within the cavity.

Abstract translation: 一种制造测辐射热计红外传感器的方法包括在传感器区域上的衬底表面上沉积第一牺牲层，以及在第一牺牲层的顶部上形成用于红外传感器的吸收体结构。 第二牺牲层沉积在吸收体结构的顶部。 然后将封装的薄膜沉积在第二牺牲层的顶部上。 在封装薄膜中形成排气孔。 在封装薄膜下方移除第一和第二牺牲层，以释放吸收体结构，并在感应区域之上形成一个空腔，该感应区域向下延伸到吸收体结构通过通气孔位于其中的衬底。 然后在真空环境中关闭通气孔以密封空腔内的吸收体结构。

公开(公告)号：US08772718B2

公开(公告)日：2014-07-08

申请号：US13270633

申请日：2011-10-11

Applicant: Jean-Louis Ouvrier-Buffet ,  Jerome Meilhan

Inventor： Jean-Louis Ouvrier-Buffet ,  Jerome Meilhan

IPC: G01J5/00 ,  G01J5/12 ,  G01J5/04 ,  G01J5/02 ,  G01J5/20 ,  G01J5/06

CPC classification number: G01J5/06 ,  G01J5/02 ,  G01J5/0285 ,  G01J5/04 ,  G01J5/045 ,  G01J5/12 ,  G01J5/20 ,  G01J2005/065 ,  G01J2005/068

Abstract: A device for detecting electromagnetic radiation that comprises an active bolometer provided with a first element sensitive to said electromagnetic radiation and a reference bolometer identical to the active bolometer, provided with a second element sensitive to said electromagnetic radiation. The active bolometer and reference bolometer are arranged close to one another on the same substrate. A cover covers at least the part of the second sensitive element exposed to the electromagnetic radiation and arranges an empty space between said second sensitive element and the cover. The inner wall of the cover is constituted by an absorbent layer made from a material absorbing at least the thermal radiations emitted by the second sensitive element. A reflecting shield forms at least a part of the outer wall exposed to said electromagnetic radiation.

Abstract translation: 一种用于检测电磁辐射的装置，其包括具有对所述电磁辐射敏感的第一元件的活性测辐射热计和与活性测辐射热计相同的参考辐射热计，其具有对所述电磁辐射敏感的第二元件。 主动测辐射热计和参考测辐射热谱仪在同一基板上彼此靠近。 覆盖物覆盖暴露于电磁辐射的第二敏感元件的至少一部分，并且在所述第二敏感元件和盖之间布置空白空间。 盖的内壁由吸收层构成，吸收层由至少吸收第二敏感元件发射的热辐射的材料制成。 反射屏蔽形成暴露于所述电磁辐射的外壁的至少一部分。

公开(公告)号：US08674308B2

公开(公告)日：2014-03-18

申请号：US13820297

申请日：2011-10-11

Applicant: Michael Singer

Inventor： Michael Singer

IPC: G01J5/02

CPC classification number: G02B5/208 ,  G01J5/04 ,  G01J5/045 ,  G01J5/061 ,  G01J5/08 ,  G01J5/0809 ,  G01J5/0815 ,  G01J5/10 ,  G02B19/0019 ,  G02B19/0023 ,  G02B19/0076 ,  G02B19/009

Abstract: A dewar assembly is presented for use in an optical IR detection system defining a light collecting region. The dewar assembly comprises a warm shield unit configured as an enclosure for optically enclosing the light collection region and having an optical window through which incident light enters the dewar. The warm shield defines a reflective inner surface configured such that light portions of the incident light propagating through said optical window onto said inner surface are reflected by the inner surface towards regions outside said light collecting region.

Abstract translation: 提供了一种杜瓦瓶组件，用于定义光收集区域的光学IR检测系统。 杜瓦组件包括暖屏蔽单元，其被配置为用于光学地封闭光收集区域并具有光学窗口的外壳，入射光通过该窗口进入杜瓦瓶。 温暖的屏蔽限定反射内表面，其被配置为使得通过所述光学窗口传播到所述内表面上的入射光的光部分被内表面朝向所述聚光区域外部的区域反射。

公开(公告)号：US20140022718A1

公开(公告)日：2014-01-23

申请号：US14033672

申请日：2013-09-23

Applicant: TAKAO YAMAZAKI ,  MASAHIKO SANO ,  SEIJI KURASHINA

Inventor： TAKAO YAMAZAKI ,  MASAHIKO SANO ,  SEIJI KURASHINA

IPC: H05K5/06

CPC classification number: H05K5/066 ,  G01J5/029 ,  G01J5/045 ,  H01L23/057 ,  H01L23/10 ,  H01L23/26 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state of the hollow portion being evacuated via a through-hole that brings the inside and the outside of the hollow portion into communication, the package main body portion is sealed with a sealing member, the getter material and the electronic device are connected to a first conductor pad and a second conductor pad, the first conductor pad is connected with a third conductor pad via a thermally conductive material, and the second conductor pad is electrically connected with a fourth conductor pad on a wiring substrate.

Abstract translation: 真空密封包装体包括：封装体主体部分，其中第一主体部分和第二主体部分经由中空部分接合;以及吸气材料和电子装置，其设置在中空部分内，并且处于该状态 通过使中空部的内部和外部连通的通孔而使空心部抽真空，将封装主体部用密封部件密封，吸气材料和电子装置与第一导体 焊盘和第二导体焊盘，第一导体焊盘通过导热材料与第三导体焊盘连接，并且第二导体焊盘与布线基板上的第四导体焊盘电连接。

公开(公告)号：US20130334635A1

公开(公告)日：2013-12-19

申请号：US13628248

申请日：2012-09-27

Applicant: RAYTHEON COMPANY

Inventor： Adam M. Kennedy ,  Stephen H. Black

IPC: H01L31/02

CPC classification number: G01J5/045 ,  G01J5/0285 ,  G01J5/20

Abstract: A pixel structure, which may be used for infrared bolometers or other microelectromechanical systems (MEMS) devices, configured to increase immunity of the pixel to molecular heat transfer and reduce the vacuum requirements for a wafer level packaged device incorporating the pixel or an array thereof. In one example, the pixel has a perforated body or discontinuous surface structure.

Abstract translation: 可用于红外测辐射热计或其他微机电系统（MEMS）装置的像素结构，其被配置为增加像素对分子热传递的免疫力，并降低结合有像素或其阵列的晶片级封装装置的真空要求。 在一个示例中，像素具有穿孔体或不连续表面结构。

公开(公告)号：US20130291380A1

公开(公告)日：2013-11-07

申请号：US13933278

申请日：2013-07-02

Applicant: TAKAO YAMAZAKI ,  MASAHIKO SANO ,  SEIJI KURASHIMA ,  YOSHIMICHI SOGAWA

Inventor： TAKAO YAMAZAKI ,  MASAHIKO SANO ,  SEIJI KURASHIMA ,  YOSHIMICHI SOGAWA

IPC: H05K3/30

CPC classification number: H05K3/30 ,  G01J5/04 ,  G01J5/045 ,  H01L21/54 ,  H01L23/055 ,  H01L23/10 ,  H01L23/26 ,  H01L24/73 ,  H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/3025 ,  Y10T29/49146 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.

Abstract translation: 本发明是一种具有中空部分的包装主体部分， 以及电子装置，其设置在所述封装主体部的中空部中，在所述封装体主体部中形成有贯通孔，所述中空部通过所述通孔与所述封装主体部的外部连通，并且在所述通孔 设置有一个密封部分，其中通孔附近被部分地加热，并且包装主体部分的组成材料熔化，从而阻挡通孔。

公开(公告)号：US20130186945A1

公开(公告)日：2013-07-25

申请号：US13728723

申请日：2012-12-27

Applicant: KYOCERA CORPORATION

Inventor： Takayuki MIYAO

IPC: H05K13/04

CPC classification number: H05K13/04 ,  G01C19/5783 ,  G01J5/024 ,  G01J5/045 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device manufacturing apparatus is disclosed. The electronic device manufacturing apparatus includes a vacuum chamber, a support part, a moving part, and a heating part. The support part is located in the vacuum chamber and has a first placement surface on which a first member is to be placed. The moving part is located in the vacuum chamber and has a second placement surface on which a second member is to be placed. The moving part is movable between a first position where the first placement surface and the second placement surface do not face each other when seen in plan view and a second position where the first placement surface and the second placement surface face each other when seen in plan view. The heating part heats the first member and the second member.

Abstract translation: 公开了一种电子装置制造装置。 电子装置制造装置包括真空室，支撑部，移动部和加热部。 支撑部分位于真空室中并且具有第一放置表面，第一构件将放置在第一放置表面上。 移动部件位于真空室中，并且具有第二放置表面，第二构件将放置在第二放置表面上。 移动部件在平面图中看到的第一放置面和第二放置面不相对的第一位置和第一位置与第二位置之间可移动，第一位置表面和第二放置面在平面图中看到时彼此面对 视图。 加热部件加热第一部件和第二部件。

公开(公告)号：US08487257B2

公开(公告)日：2013-07-16

申请号：US12601613

申请日：2008-05-28

Applicant: Carsten Giebeler ,  Matthias Schreiter ,  Jörg Zapf

Inventor： Carsten Giebeler ,  Matthias Schreiter ,  Jörg Zapf

IPC: G01J5/00

CPC classification number: H01L27/16 ,  G01J5/04 ,  G01J5/045 ,  G01J5/10 ,  G01J5/34 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In a device for the detection of thermal radiation and a method for production of such a device, a stack is formed with a detector support having a detector element for converting the thermal radiation into an electric signal, a circuit support with a read-out circuit for reading out the electrical signal and a cover to shield the detector element. The detector support and the cover are so arranged that a first stack cavity is formed between the detector element and the cover and a second stack cavity is formed between detector support and the circuit support. The first stack cavity and/or the second stack cavity is evacuated and hermetically sealed. In the manufacturing operation, functionalized silicon-substrates are stacked upon one another, firmly bonded together and subsequently sub-divided. Preferably, the detector elements are pyro-electric detector elements. The device finds application in motion detectors, presence reporters and thermal-image cameras.

Abstract translation: 在用于检测热辐射的装置和用于生产这种装置的方法中，叠层形成有具有用于将热辐射转换成电信号的检测器元件的检测器支架，具有读出电路的电路支架 用于读出电信号和盖以屏蔽检测器元件。 检测器支架和盖被布置成使得在检测器元件和盖之间形成第一堆叠空腔，并且在检测器支架和电路支架之间形成第二堆叠腔。 将第一堆叠空腔和/或第二堆叠空腔抽真空并密封。 在制造操作中，将功能化的硅衬底彼此堆叠，牢固地结合在一起并随后进行细分。 优选地，检测器元件是热电探测器元件。 该设备在运动检测器，存在记录器和热像摄像机中找到应用。