Field emission array having carbon microstructure and method of manufacturing the same
    21.
    发明授权
    Field emission array having carbon microstructure and method of manufacturing the same 失效
    具有碳微观结构的场发射阵列及其制造方法

    公开(公告)号:US08017413B2

    公开(公告)日:2011-09-13

    申请号:US12450965

    申请日:2008-07-01

    Abstract: Provided is a method for manufacturing a field emission array with a carbon microstructure. The method includes: a photomask attachment step of attaching a photomask with a pattern groove to one surface of a transparent substrate; a photoresist attachment step of attaching a negative photoresist to one surface of the photomask; an exposure step of irradiating light toward the opposite surface of the transparent substrate from the photomask to cure a portion of the negative photoresist with the light irradiated on the negative photoresist through the pattern groove; a developing step of removing an uncured portion of the negative photoresist while leaving the cured portion of the negative photoresist as a microstructure; a pyrolysis step of heating and carbonizing the microstructure thus obtained; and a cathode attachment step of attaching a voltage-supplying cathode to the surface of the transparent substrate on which the microstructure is formed.

    Abstract translation: 提供一种制造具有碳微观结构的场致发射阵列的方法。 该方法包括:光掩模附着步骤,其将具有图案凹槽的光掩模附着到透明基板的一个表面; 将负性光致抗蚀剂附着到光掩模的一个表面的光致抗蚀剂附着步骤; 曝光步骤,从所述光掩模向所述透明基板的相对表面照射光,以通过所述图案凹槽照射在所述负性光致抗蚀剂上的光来固化所述负性光致抗蚀剂的一部分; 去除负性光致抗蚀剂的未固化部分同时留下负性光致抗蚀剂的固化部分作为微结构的显影步骤; 对由此获得的微结构进行加热和碳化的热解步骤; 以及将电压供给阴极安装在其上形成微结构的透明基板的表面上的阴极附着步骤。

    FIELD EMISSION ARRAY HAVING CARBON MICROSTRUCTURE AND METHOD OF MANUFACTURING THE SAME
    22.
    发明申请
    FIELD EMISSION ARRAY HAVING CARBON MICROSTRUCTURE AND METHOD OF MANUFACTURING THE SAME 失效
    具有碳微结构的场发射阵列及其制造方法

    公开(公告)号:US20110089396A1

    公开(公告)日:2011-04-21

    申请号:US12450965

    申请日:2008-07-01

    Abstract: Provided is a method for manufacturing a field emission array with a carbon microstructure. The method includes: a photomask attachment step of attaching a photomask with a pattern groove to one surface of a transparent substrate; a photoresist attachment step of attaching a negative photoresist to one surface of the photomask; an exposure step of irradiating light toward the opposite surface of the transparent substrate from the photomask to cure a portion of the negative photoresist with the light irradiated on the negative photoresist through the pattern groove; a developing step of removing an uncured portion of the negative photoresist while leaving the cured portion of the negative photoresist as a microstructure; a pyrolysis step of heating and carbonizing the microstructure thus obtained; and a cathode attachment step of attaching a voltage-supplying cathode to the surface of the transparent substrate on which the microstructure is formed.

    Abstract translation: 提供一种制造具有碳微观结构的场致发射阵列的方法。 该方法包括:光掩模附着步骤,其将具有图案凹槽的光掩模附着到透明基板的一个表面; 将负性光致抗蚀剂附着到光掩模的一个表面的光致抗蚀剂附着步骤; 曝光步骤,从所述光掩模向所述透明基板的相对表面照射光,以通过所述图案凹槽照射在所述负性光致抗蚀剂上的光来固化所述负性光致抗蚀剂的一部分; 去除负性光致抗蚀剂的未固化部分同时留下负性光致抗蚀剂的固化部分作为微结构的显影步骤; 对由此获得的微结构进行加热和碳化的热解步骤; 以及将电压供给阴极安装在其上形成微结构的透明基板的表面上的阴极附着步骤。

    FIELD EMISSION DEVICE
    24.
    发明申请
    FIELD EMISSION DEVICE 有权
    场发射装置

    公开(公告)号:US20080018227A1

    公开(公告)日:2008-01-24

    申请号:US11565528

    申请日:2006-11-30

    Abstract: A field emission device (10) includes a sealed container (11) with a light-permeable portion (12). A phosphor layer (13) is formed on the light-permeable portion. A light-permeable anode (14) is formed on the light-permeable portion. At least one cathode is positioned opposite to the light-permeable anode. A shielding barrel (16) is electrically connected to the at least one cathode and disposed in the container. The shielding barrel has opposite open ends respectively facing towards the light-permeable anode and the cathode (18, 19). The shielding barrel has an inner surface, and a slurry layer (17) containing conductive nano material is formed on the inner surface of the shielding barrel.

    Abstract translation: 场发射装置(10)包括具有透光部分(12)的密封容器(11)。 荧光体层(13)形成在透光部分上。 在透光部分上形成透光阳极(14)。 至少一个阴极与透光阳极相对设置。 屏蔽筒(16)电连接到至少一个阴极并且设置在容器中。 屏蔽筒具有相对的开口端,分别面向透光阳极和阴极(18,19)。 屏蔽筒具有内表面,并且在屏蔽筒的内表面上形成含有导电纳米材料的浆料层(17)。

    Carbon film for field emission devices
    26.
    发明授权
    Carbon film for field emission devices 失效
    用于场致发射装置的碳膜

    公开(公告)号:US5869922A

    公开(公告)日:1999-02-09

    申请号:US910604

    申请日:1997-08-13

    Applicant: Zhidan Li Tolt

    Inventor: Zhidan Li Tolt

    Abstract: A carbon film used for a field emission cathode comprises a layer of thin carbon film on a substrate. With 244 nm and 2-7 mW excitation, and within the wave number from 1100 to 1850 cm.sup.-1, the carbon film has a distinct UV Raman band in the range from 1578 cm.sup.-1 to 1620 cm.sup.-1 with a full width at half maximum from 25 to 165 cm.sup.-1. The carbon film can be deposited by chemical vapor deposition, physical vapor deposition, electrolysis, printing or painting, and can be continuous or noncontinuous.

    Abstract translation: 用于场发射阴极的碳膜包括在基板上的薄碳膜层。 具有244nm和2-7mW激发,并且在1100至1850cm -1的波数内,碳膜具有在1578cm -1至1620cm -1范围内的不同的UV拉曼带,全宽为 从25到165厘米-1的最大值。 碳膜可以通过化学气相沉积,物理气相沉积,电解,印刷或喷涂沉积,并且可以是连续的或非连续的。

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