公开(公告)号：US06716572B2

公开(公告)日：2004-04-06

申请号：US10082154

申请日：2002-02-26

Applicant: Takuya Yamamoto ,  Takashi Kataoka ,  Yutaka Hirasawa ,  Naotomi Takahashi

Inventor： Takuya Yamamoto ,  Takashi Kataoka ,  Yutaka Hirasawa ,  Naotomi Takahashi

IPC: G03F700

CPC classification number: H05K3/0038 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/0347 ,  H05K2203/0361 ,  H05K2203/1388 ,  Y10S430/146 ,  Y10T29/49165

Abstract: It is an object to provide a manufacturing process for a printed wiring board in which a copper foil and resin as a substrate material of a copper clad laminate are irradiated with carbon dioxide gas laser light to drill in both of them simultaneously. In forming a through hole or a hole such as IVH, BVH or the like in the copper clad laminate using carbon dioxide gas laser light, one of a nickel layer of 0.08 to 2 &mgr;m in thickness, a cobalt layer of 0.05 to 3 &mgr;m in thickness and a zinc layer of 0.03 to 2 &mgr;m in thickness is formed as an additional metal layer on a surface of the copper foil residing in an external layer of the copper clad laminate and thereafter, by performing laser drilling, the copper foil layer and the resin layer as a substrate material of the copper clad laminate are enabled to drill simultaneously.

Abstract translation: 本发明的目的是提供一种印刷线路板的制造方法，其中铜箔和作为覆铜层压板的基板材料的树脂被二氧化碳气体激光照射以同时钻孔。 在使用二氧化碳气体激光的覆铜层压板中形成IVH，BVH等通孔或孔，在0.08〜2μm厚的镍层中，将0.05〜3μm的钴层 在覆铜层压板的外层的铜箔的表面上形成厚度为0.03〜2μm的锌层作为附加金属层，然后通过进行激光打孔，将铜箔层和 作为覆铜层压板的基材的树脂层能够同时钻孔。

公开(公告)号：US20030193055A1

公开(公告)日：2003-10-16

申请号：US10120158

申请日：2002-04-10

Inventor： Robert H. Martter ,  Craig C. Sundberg ,  Richard N. Giardina ,  Brian S. Fetscher ,  G. James Deutschlander

IPC: H01L027/15

CPC classification number: H05K1/0203 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H05K1/053 ,  H05K1/092 ,  H05K1/167 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/0112 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat sink for the heat emitted by LED during operation.

Abstract translation: 一种具有发光二极管（LED）的照明装置。 该装置包括具有表面的金属基板。 电介质涂层重叠在金属基板的表面上。 发光二极管（LED）被支撑在电介质涂层上。 金属基板用作在操作期间由LED发射的热量的散热器。

公开(公告)号：US06617541B1

公开(公告)日：2003-09-09

申请号：US08391745

申请日：1995-02-21

Applicant: Sipke Wadman ,  Klaus B. Schildbach

Inventor： Sipke Wadman ,  Klaus B. Schildbach

IPC: B23K2638

CPC classification number: B23K26/18 ,  G02F1/13439 ,  H05K1/0306 ,  H05K3/027 ,  H05K2201/0112 ,  H05K2201/0326 ,  H05K2203/107

Abstract: A method of furnishing a substrate with a patterned film of electrode material making use of a laser beam, whereby a stack is made by providing a surface of the substrate at least with a layer of an assistant material and an overlying layer of the said electrode material, the assistant material being capable of decomposition upon heating with the aid of the said laser beam, subsequent to which the stack is, in accordance with a desired pattern, locally irradiated with the laser beam so as to heat the assistant material to at least its decomposition temperature, consequent upon which the locally overlying electrode material is caused to detach.

Abstract translation: 使用激光束提供具有电极材料的图案化膜的衬底的方法，由此通过至少提供辅助材料层和所述电极材料的覆盖层来提供衬底的表面而制成叠层 辅助材料能够借助于所述激光束在加热时分解，随后根据期望的图案，堆叠被局部地用激光束照射，以便将辅助材料加热到至少它 分解温度，从而导致局部上覆的电极材料分离。

公开(公告)号：US06562179B1

公开(公告)日：2003-05-13

申请号：US09697134

申请日：2000-10-27

Applicant: Nobuyuki Ikeguchi ,  Masahiro Shimoda

Inventor： Nobuyuki Ikeguchi ,  Masahiro Shimoda

IPC: C09J502

CPC classification number: C08J5/24 ,  C08G59/4014 ,  C08G73/0655 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0038 ,  H05K2201/0112 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2203/0315

Abstract: A high relative-permittivity B-staged sheet obtained by incorporating an insulating inorganic filler having a relative permittivity of at least 500 at room temperature into a solvent-less resin component so as to have an insultaing inorganic filler content of 80 to 99% by weight, a high relative-permittivity prepreg obtained from the above high relative-permittivity B-staged sheet, a process for the production of the high relative-permittivity prepreg, and a printed wiring board obtained from any one of the above high relative-permittivity B-staged sheet and the high relative-permittivity prepreg.

Abstract translation: 将相对介电常数至少为500的绝缘无机填料在室温下加入到无溶剂树脂成分中而获得的高相对介电常数B阶片，以使无机填料含量为80-99重量％ ，由上述高相对介电常数B阶片材得到的高相对介电常数预浸料坯，高相对介电常数预浸料坯的制造方法以及由上述高相对介电常数B - 高级相对介电常数预浸料。

公开(公告)号：US20020167063A1

公开(公告)日：2002-11-14

申请号：US10127478

申请日：2002-04-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Katsumi Fujimoto ,  Keiichi Okano ,  Masato Koike

IPC: H01L031/0216 ,  H01L031/0224

CPC classification number: H04N5/23258 ,  G01C19/56 ,  H01L2224/73204 ,  H04N5/23248 ,  H05K1/02 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/0112 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/10151

Abstract: A vibration gyro which is a sensor circuit module includes a packaging substrate, a vibrator mounted on the substrate, a chip type semiconductor element mounted by flip-chip bonding, a chip element, and a cover. The portion of the end surfaces of the packaging substrate in which no through-hole terminals are formed is coated with a light-shielding coating material which is a light-transmission-stopping member. Preferably, the color of the light-shielding coating material is as dark as possible, and is black, if possible.

Abstract translation: 作为传感器电路模块的振动陀螺仪包括封装基板，安装在基板上的振动器，通过倒装芯片接合安装的芯片型半导体元件，芯片元件和盖。 在其中没有形成通孔端子的封装基板的端面的一部分涂覆有作为光传输阻止部件的遮光涂层材料。 优选地，遮光涂层材料的颜色尽可能暗，并且如果可能的话是黑色的。

公开(公告)号：US20020029906A1

公开(公告)日：2002-03-14

申请号：US09734593

申请日：2000-12-13

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC: H05K003/36 ,  H01K003/10 ,  B23K026/00

CPC classification number: H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

Abstract translation: 通过施加和干燥包括紫外线吸收剂的树脂清漆304在具有粘合剂层302的基板的两侧上形成可移除掩模膜303，并且通过使用第三谐波YAG固体激光器形成细小通孔306 具有比紫外线范围内的波长相对较短波长的光可以减少通过层压方法形成可去除掩模膜的这种残留应变的效果以及更细孔钻孔 与使用具有较长波长的二氧化碳气体激光器的常规实施例相比可以进行。

公开(公告)号：US6156445A

公开(公告)日：2000-12-05

申请号：US28371

申请日：1998-02-24

Applicant: Francis Charles Burns ,  William Weathers Fleming ,  Victor Yee-Way Lee ,  Randy William Snyder

Inventor： Francis Charles Burns ,  William Weathers Fleming ,  Victor Yee-Way Lee ,  Randy William Snyder

IPC: C07C315/04 ,  C07C317/36 ,  C08F20/34 ,  C08F20/38 ,  C08F220/06 ,  C08F220/10 ,  C08F220/34 ,  C08F220/38 ,  C09D133/04 ,  C09D133/06 ,  C09D133/14 ,  G03F1/00 ,  G03F7/039 ,  G03F7/20 ,  H01L21/027 ,  H01L23/498 ,  H05K3/00 ,  H05K3/18 ,  B32B29/30 ,  B32B15/08 ,  B32B18/00 ,  H01L29/12

CPC classification number: G03F7/202 ,  C07C315/04 ,  G03F7/039 ,  G03F7/2053 ,  H01L23/49894 ,  H05K3/0082 ,  H05K3/184 ,  H01L2924/0002 ,  H05K2201/0112 ,  H05K3/0032 ,  Y10S428/901 ,  Y10S430/106 ,  Y10S430/111 ,  Y10T428/12528 ,  Y10T428/12569

Abstract: The present invention provides an ablatively photodecomposable polymer having a photoabsorber bound to the polymer (the "ablatively photodecomposable polymer") which does not phase separate, nor does it crystallize. The ablatively photodecomposable polymer provides even ablation, high resolution and in preferred embodiments, can withstand potassium permanganate etchant and ferric chloride etchant. The ablatively photodecomposable polymer is strippable, although it can remain on the substrate if desired. The ablatively photodecomposable polymer comprises a polymer to which a photoabsorber is bound, either covalently or ionically. The present invention is also directed to a process for forming a metal pattern on a substrate employing the ablatively photodecomposable polymer.

Abstract translation: 本发明提供了一种具有与聚合物结合的光吸收剂的可消光的可光分解聚合物（“可消融的光可分解聚合物”），其不相分离，也不结晶。 可消融的可光解聚合物提供均匀的消融，高分辨率，并且在优选的实施方案中，可以耐受高锰酸钾蚀刻剂和氯化铁蚀刻剂。 可消融的可光解聚合物是可剥离的，但如果需要，其可以保留在基材上。 可消融的可光分解的聚合物包含与光吸收剂结合的共价或离子的聚合物。 本发明还涉及使用可消光的可光解聚合物在基材上形成金属图案的方法。

公开(公告)号：US5958647A

公开(公告)日：1999-09-28

申请号：US858977

申请日：1997-05-20

Applicant: David A. Morgan

Inventor： David A. Morgan

IPC: G03C1/498 ,  H05K3/06 ,  G03C1/73

CPC classification number: H05K3/064 ,  G03C1/4989 ,  H05K2201/0112 ,  H05K2203/107

Abstract: A thermosensitive resist used in the manufacturing of printed circuit boards comprising a mixture of polyacrylic acid, a salt of a long chain fatty acid such as silver behenate, an infra-red absorber and modifiers such as additional polymers. In the unheated form the resist can be easily washed away with water-based mild solutions or pure water. When selectively heated by an IR laser a non-soluble, etch resistant composition is formed protecting the copper clad printed circuit board from the etchants used in the process.

Abstract translation: 用于制造印刷电路板的热敏抗蚀剂，其包含聚丙烯酸，长链脂肪酸的盐如山嵛酸银的混合物，红外吸收剂和诸如另外的聚合物的改性剂的混合物。 在未加热的形式中，抗蚀剂可以容易地用水基温和溶液或纯水冲洗掉。 当通过IR激光器选择性加热时，形成不可蚀刻的耐蚀刻组合物，以保护铜包覆印刷电路板免受在该工艺中使用的蚀刻剂的影响。

公开(公告)号：US4909895A

公开(公告)日：1990-03-20

申请号：US336868

申请日：1989-04-11

Applicant: Dominic A. Cusano

Inventor： Dominic A. Cusano

IPC: B23K26/18 ,  C23F4/02 ,  G03F7/20 ,  H05K3/02 ,  H05K3/18

CPC classification number: C23F4/02 ,  B23K26/066 ,  B23K26/18 ,  G03F7/2053 ,  H05K3/027 ,  H05K2201/0112 ,  H05K2201/0347 ,  H05K2203/0315 ,  H05K2203/056 ,  H05K2203/107 ,  H05K2203/1383 ,  H05K3/181

Abstract: A system and method for improved conductive circuit patterning utilizing laser ablation is disclosed. In an embodiment, a substrate, which has an electroless conductive layer plated thereon, is heated to a predetermined temperature for a predetermined time to form an oxide layer upon the conductive layer. The oxide layer, due to its non-absorptive properties, is more easily ablated than the conductive layer. Hence, the overall processing time for circuit patterning is significantly reduced.

Abstract translation: 公开了一种利用激光烧蚀改进导电电路图案的系统和方法。 在一个实施例中，将其上镀有无电导电层的基板在预定时间内加热至预定温度，以在导电层上形成氧化物层。 氧化物层由于其非吸收性质比导电层更容易烧蚀。 因此，电路图案化的总体处理时间显着降低。

公开(公告)号：US4732560A

公开(公告)日：1988-03-22

申请号：US532090

申请日：1983-09-14

Applicant: Michael R. Kling

Inventor： Michael R. Kling

IPC: G03B15/04 ,  H05K1/00 ,  F21K5/00

CPC classification number: G03B15/0457 ,  H05K1/0293 ,  H05K2201/0112 ,  H05K2203/173

Abstract: A multilamp photoflash unit responsive to either a high pulse potential source or a low voltage source includes normally open (N/O) switches having a composition which includes an admixture of silver carbonate and/or silver oxide, titanium dioxide and a blended binder of polystyrene and thermoplastic.

Abstract translation: 响应于高脉冲电位源或低电压源的多通道闪光灯单元包括常开（N / O）开关，其具有包含碳酸银和/或氧化银的混合物，二氧化钛和聚苯乙烯的共混粘合剂 和热塑性塑料。