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    Advanced grounding scheme
    21.
    发明授权
    Advanced grounding scheme 有权
    高级接地方案

    公开(公告)号：US09585240B2

    公开(公告)日：2017-02-28

    申请号：US14062494

    申请日：2013-10-24

    Applicant: TriQuint Semiconductor, Inc.

    Inventor： Thomas R. Landon, Jr. ,  Paul D. Bantz ,  Tarak A. Railkar

    IPC: H05K1/16 ,  H05K1/02 ,  H05K3/46

    CPC classification number: H05K1/0204 ,  H05K1/0207 ,  H05K1/0215 ,  H05K1/0216 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/10416 ,  H05K2203/0191 ,  Y10T29/49155

    Abstract: A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug.

    Abstract translation: 层压基板可以包括位于层叠芯的空腔内的块状物。 层压基板可以在层叠芯的任一侧上具有路由层，其中至少一个与块的外侧共面。 然后可以将覆盖层施加到与块和路由层直接耦合的层压基板。 在实施例中，电介质层可以与覆盖层耦合，并且附加布线层可以与电介质层耦合。 因此，路由层可以是与块状体共面并与其结合的“内部”路由层。

    Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips
    22.
    发明授权
    Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips 有权
    用于与封装的半导体芯片集成的电容结构的导电聚合物通孔

    公开(公告)号：US09572261B2

    公开(公告)日：2017-02-14

    申请号：US14668085

    申请日：2015-03-25

    Applicant: Texas Instruments Incorporated

    Inventor： Matthew D. Romig ,  Frank Stepniak ,  Saumya Gandhi

    IPC: H05K1/18

    CPC classification number: H01L23/5223 ,  H01L21/288 ,  H01L21/31051 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76874 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/14 ,  H01L28/60 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H05K1/113 ,  H05K1/162 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0215 ,  H05K2201/10734

    Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

    Abstract translation: 一种电子系统，包括具有端子焊盘（310）的电子体（301）和嵌入电子体中的至少一个电容器。 所述电容器包括绝缘和粘合的第一聚合物膜（302），所述绝缘和粘合的第一聚合物膜（302）覆盖除了所述端子焊盘之外 高密度电容元件的片材（320），所述第一电容器端子是附着到膜（302）上的金属箔（321），所述第二端子是导电聚合物（324），所述绝缘体是介电性皮层（323） 。 片（320）具有一组通孔：第一组孔到达金属箔321），第二组孔到达端子（310），第三组孔到达导电聚合物（324）。 绝缘的第二聚合物膜（303），其衬在所述孔的侧壁上并平坦化所述片材表面; 和填充聚合物侧壁之间的通孔的金属（432），并在系统表面上形成导电迹线和附着垫。

    PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS
    23.
    发明申请
    PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS 有权
    至少印制电路板区域的印刷电路板

    公开(公告)号：US20170042028A1

    公开(公告)日：2017-02-09

    申请号：US15331987

    申请日：2016-10-24

    Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

    Inventor： Rainer PLUDRA ,  Dietmar DROFENIK ,  Johannes STAHR ,  Siegfried GÖTZINGER ,  Ljubomir MARELJIC

    IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/142 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/225 ,  H05K3/368 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2203/1461 ,  Y10T29/49155

    Abstract: In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.

    Abstract translation: 在制造由至少两个印刷电路区域组成的印刷电路板的方法中，其中印刷电路板区域各自损害至少一个导电层和/或至少一个器件或一次导电部件，其中印刷电路板区域为 连接到另一个，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过联接或连接彼此连接，并且其中在印刷电路板区域的耦合或连接之后，至少一个 印刷电路板的附加层或层被施加在印刷电路板区域上，附加层被实施为导电层，其通过电镀通孔与导电层或集成在印刷电路中的器件或部件接触连接 董事会区域。

    Printed Circuit Board Assembly With Foam Dielectric Material
    24.
    发明申请
    Printed Circuit Board Assembly With Foam Dielectric Material 审中-公开
    印刷电路板组件与泡沫电介质材料

    公开(公告)号：US20170040678A1

    公开(公告)日：2017-02-09

    申请号：US15302638

    申请日：2015-04-09

    Applicant: Massachusetts Institute Of Technology

    Inventor： Glenn A. Brigham

    IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q9/28

    CPC classification number: H01Q1/38 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/285 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/165 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/10098 ,  H05K2203/061

    Abstract: An assembly that includes a printed circuit board and a foam dielectric material, and a method of fabricating the assembly is disclosed. The assembly includes at least one layer of a foam dielectric material, which has properties similar to those of air. This layer of foam dielectric material is disposed between a top sublaminate and a bottom sublaminate. The bottom sublaminate may be a traditional printed circuit board, comprising an arbitrary number of layers. The top sublaminate may be a single layer, or may be multiple layers and may include an antenna. The foam dielectric material serves to provide mechanical support for the top sublaminate and the central conductor. The foam dielectric material also provides physical separation between the bottom sublaminate and the antenna.

    Abstract translation: 公开了一种包括印刷电路板和泡沫电介质材料的组件，以及制造组件的方法。 该组件包括至少一层泡沫电介质材料，其具有与空气相似的性质。 该泡沫介电材料层设置在顶层和底层之间。 底部层压板可以是传统的印刷电路板，其包括任意数量的层。 顶层亚层可以是单层，或者可以是多层，并且可以包括天线。 泡沫介电材料用于为顶部亚层和中心导体提供机械支撑。 泡沫介电材料还提供底部层压板和天线之间的物理分离。

    PRINTED BOARD AND ELECTRONIC APPARATUS
    25.
    发明申请
    PRINTED BOARD AND ELECTRONIC APPARATUS 有权
    印刷板和电子设备

    公开(公告)号：US20160345424A1

    公开(公告)日：2016-11-24

    申请号：US15159393

    申请日：2016-05-19

    Applicant: Tomoyoshi Kobayashi ,  Masato Kasashima

    Inventor： Tomoyoshi Kobayashi ,  Masato Kasashima

    IPC: H05K1/02 ,  H05K1/18 ,  H05K1/05 ,  H05K1/11

    CPC classification number: H05K1/0204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/09854 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/063

    Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

    Abstract translation: 印刷电路板包括：基底构件; 设置在所述基座部件中的凹部; 安装在所述凹部中的散热构件; 以及经由绝缘体设置在基座构件的上侧和散热构件上的布线图案。 形成有凹部的内周面和散热构件的外周面彼此接触的接触部以及彼此接触的分离部。 凹部与散热构件之间的间隙填充有通过加热熔化的基底构件的热固性树脂。 布线图案的宽度方向的至少一部分通过与分离部垂直重叠的位置，其整个部分未穿过与接触部分垂直重叠的位置。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    28.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20160156333A1

    公开(公告)日：2016-06-02

    申请号：US14954284

    申请日：2015-11-30

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Mi Ran HWANG ,  Se Jong KIM

    IPC: H03H9/25 ,  H03H9/10 ,  H01L41/31 ,  H03H9/02 ,  H01L41/047 ,  H01L41/053

    CPC classification number: H01L41/31 ,  H03H9/1064 ,  H05K1/023 ,  H05K1/16 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0187

    Abstract: A printed circuit board includes: insulating layers and wiring layers arranged in stacked configuration; a cavity disposed in a first insulating layer among the insulating layers; a piezoelectric substrate disposed in the cavity; an electrode disposed on the piezoelectric substrate and configured to convert an electrical signal into an elastic wave or to convert an elastic wave into an electrical signal; and a sealing part disposed on the piezoelectric substrate, the sealing part enclosing the electrode and forming an air gap around the electrode.

    Abstract translation: 印刷电路板包括：堆叠构造布置的绝缘层和布线层; 在绝缘层中设置在第一绝缘层中的空腔; 设置在所述空腔中的压电基板; 设置在所述压电基板上并且被配置为将电信号转换为弹性波或将弹性波转换为电信号的电极; 以及密封部，其设置在所述压电基板上，所述密封部封闭所述电极并在所述电极周围形成气隙。

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