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    Electronic package having controlled height stand-off solder joint
    22.
    发明授权
    Electronic package having controlled height stand-off solder joint 失效
    电子封装具有受控的高度接头焊点

    公开(公告)号：US06986454B2

    公开(公告)日：2006-01-17

    申请号：US10616617

    申请日：2003-07-10

    Applicant: Morris D Stillabower

    Inventor： Morris D Stillabower

    IPC: B23K31/00 ,  B23K31/02 ,  B23K35/12

    CPC classification number: H05K3/3484 ,  H01L2224/16225 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0254 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

    Abstract translation: 提供一种电子封装（10），其包括具有衬底（14）和电路（16）的电路板（12）和具有接触端子（24）的表面安装器件（22）。 在电路板（12）上形成安装垫（28）。 电子封装（10）还包括将表面安装器件（22）的接触端子（24）连接到电路板（12）上的安装焊盘（28）的焊接接头（30）。 焊接接头（30）包括可回流焊料和多个分离构件（32或42）。 分离构件（32或42）在电路板（12）和表面安装装置（22）之间提供在约0.01mm至0.10mm的范围内的间隔距离（H）。

    Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
    24.
    发明申请
    Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers 审中-公开
    成型尺寸组合物，涂覆其的玻璃纤维和由这种涂布纤维编织的织物

    公开(公告)号：US20020051882A1

    公开(公告)日：2002-05-02

    申请号：US09779732

    申请日：2001-02-09

    Inventor： Ernest L. Lawton ,  Kami Lammon-Hilinski

    IPC: D02G003/00

    CPC classification number: H05K1/0366 ,  B05C1/06 ,  B05C11/1039 ,  B05C11/1042 ,  C03C25/255 ,  C03C25/26 ,  C03C25/321 ,  C03C25/47 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2203/127 ,  Y10T428/2938

    Abstract: The present invention provides coated fiber strand comprising at least one fiber having a residue of an aqueous forming size composition applied to at least a portion of a surface of the at least one fiber, the aqueous forming size composition comprising: (a) at least one starch; (b) at least one film-forming material; (c) at least one lubricant; and (d) a plurality of discrete particles that provide interstitial space between the at least one fiber and at least one adjacent fiber sufficient to allow wet out of the fiber strand. In one embodiment of the invention, the fibers are glass fibers, the at least one starch comprises an oleophobic starch, the at least one film-forming material comprises a N-vinyl amide polymer, the at least one lubricant comprises an ester, and the particles are dimensionally stable particles selected from polymeric organic materials, non-polymeric organic materials, polymeric inorganic materials, non-polymeric inorganic materials, composite materials and mixtures thereof. In one non-limiting embodiment of the invention, the particles comprise hexagonal boron nitride particles and/or hollow particles formed from a copolymer of styrene and acrylic monomer. The present invention also provides a fabric incoporating the coated fabric strand and an electronic support and an electronic circuit board incorporating the fabric.

    Abstract translation: 本发明提供了包含至少一种具有至少一种纤维的水性成型尺寸组合物的残余物的纤维束，所述水性成型剂组合物包含：（a）至少一种 淀粉; （b）至少一种成膜材料; （c）至少一种润滑剂; 和（d）多个离散的颗粒，其在所述至少一个纤维和至少一个相邻的纤维之间提供足够的间隙，以允许从纤维束中脱出。 在本发明的一个实施方案中，所述纤维是玻璃纤维，所述至少一种淀粉包含疏油性淀粉，所述至少一种成膜材料包含N-乙烯基酰胺聚合物，所述至少一种润滑剂包含酯， 颗粒是选自聚合有机材料，非聚合有机材料，聚合物无机材料，非聚合无机材料，复合材料及其混合物的尺寸稳定的颗粒。 在本发明的一个非限制性实施方案中，颗粒包括由苯乙烯和丙烯酸单体的共聚物形成的六方氮化硼颗粒和/或中空颗粒。 本发明还提供了一种覆盖涂层织物线束的织物，以及包含织物的电子支架和电子电路板。

    Molded resin composition exhibiting good adhesion to conductive material on a surface
    25.
    发明申请
    Molded resin composition exhibiting good adhesion to conductive material on a surface 审中-公开
    对表面上的导电材料表现出良好粘附性的模制树脂组合物

    公开(公告)号：US20010011111A1

    公开(公告)日：2001-08-02

    申请号：US09815059

    申请日：2001-03-23

    Applicant: NEC Corporation

    Inventor： Yoshitsugu Funada ,  Koji Matsui

    IPC: C08L001/00 ,  B05D005/12

    CPC classification number: H05K1/0373 ,  C08L63/00 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0254 ,  C08L2666/04 ,  C08L2666/02

    Abstract: A resin matrix with resistances to alkali and acid includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative component particles have a particle diameter in the range of 1-20 micrometers.

    Abstract translation: 具有对碱和酸的电阻的树脂基体包括绝缘有机颗粒和具有有机组分和无机组分的绝缘复合颗粒中的至少一种，这些颗粒的总量在5-50体积％的范围内，其中 绝缘性有机粒子和绝缘性复合粒子的有机成分被碱或酸腐蚀，其中不小于90体积％的绝缘有机粒子和绝缘成分粒子的粒径在 1-20微米。

    Alkali or acid corrodible organic or composite particles in resin matrix
    26.
    发明授权
    Alkali or acid corrodible organic or composite particles in resin matrix 失效
    碱性或酸性腐蚀性有机或复合颗粒在树脂基质中

    公开(公告)号：US06232398B1

    公开(公告)日：2001-05-15

    申请号：US08986104

    申请日：1997-12-05

    Applicant: Yoshitsugu Funada ,  Koji Matsui

    Inventor： Yoshitsugu Funada ,  Koji Matsui

    IPC: C08L6310

    CPC classification number: H05K1/0373 ,  C08L63/00 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0254 ,  C08L2666/04 ,  C08L2666/02

    Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

    Abstract translation: 含有芴环氧丙烯酸酯和/或苯并环丁烯树脂的耐酸碱性树脂基体包括绝缘性有机颗粒和具有有机成分和无机成分的绝缘性复合颗粒中的至少一种，其总量为 颗粒在5-50体积％的范围内，其中绝缘有机颗粒和绝缘复合颗粒的有机组分被碱或酸腐蚀，并且其中不小于90体积％的绝缘体 有机颗粒和绝缘复合颗粒的粒径在1-20微米的范围内。

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