公开(公告)号：US20150047883A1

公开(公告)日：2015-02-19

申请号：US14381693

申请日：2013-02-28

Applicant: Cima Nano Tech Israel Ltd.

Inventor： Eyal Shapira ,  Dov Zamir

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H01B13/00

CPC classification number: H05K1/0274 ,  H01B13/0026 ,  H05K1/0213 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/0162 ,  H05K2201/0257

Abstract: A transparent, conductive article that includes a network of electrically conductive metal traces defining cells that are transparent to light on a self-supporting, elastomeric substrate, as well as a process for forming the article.

Abstract translation: 一种透明导电制品，其包括限定在自支撑弹性体基底上对光透明的细胞的导电金属迹线网络，以及用于形成制品的方法。

公开(公告)号：US08852734B2

公开(公告)日：2014-10-07

申请号：US12902505

申请日：2010-10-12

Applicant: Nobuki Tanaka ,  Seiji Mori

Inventor： Nobuki Tanaka ,  Seiji Mori

IPC: H05K1/03 ,  B32B15/092 ,  B32B27/04 ,  B32B27/20 ,  B32B27/38 ,  C08K3/36 ,  C08G59/32 ,  C08L63/00 ,  C08L63/04 ,  C08G59/40 ,  C08G59/62 ,  C08J5/24

CPC classification number: H05K1/0373 ,  C08G59/4014 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  C08K2201/003 ,  C08K2201/011 ,  C08L63/00 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/252 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L79/00

Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 μm or more and 5.0 μm or less.

Abstract translation: 本发明提供一种均匀地含有大量无机填料，耐热性和阻燃性优异并且对基材具有良好浸渍性的环氧树脂组合物，以及具有良好粘合性的使用该环氧树脂组合物的预浸料，以及 易于处理。 此外，提供一种印刷线路板，其使用能够容易地进行ENEPIG工艺的预浸料坯和/或预浸料或环氧树脂组合物形成的覆金属层压板，以及使用印刷线路板的半导体装置 在演出。 环氧树脂组合物包含固体环氧树脂，平均粒径为1nm以上且100nm以下的二氧化硅纳米粒子和平均粒径大于二氧化硅纳米粒子的二氧化硅粒子的范围， 0.1μm以上且5.0μm以下。

公开(公告)号：US20140170412A1

公开(公告)日：2014-06-19

申请号：US13827374

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Young JI ,  Shang Hoon Seo ,  Suk Jin Ham ,  Seung Hwan Kim

IPC: C09D7/12 ,  B05D7/24

CPC classification number: C09D11/324 ,  C09D11/38 ,  H05K1/0373 ,  H05K3/28 ,  H05K2201/0141 ,  H05K2201/0257 ,  H05K2201/0293 ,  H05K2203/013 ,  Y10T428/26

Abstract: An insulating composition including a graphene oxide and an insulating material including the same; and a polar solvent having a solvent polarity index (P) of greater than 5.5, a substrate including an insulating layer using the same, and a method for manufacturing the substrate. It is possible to provide an insulating composition including a specific solvent that can secure dispersibility of the graphene oxide while including the graphene oxide having excellent insulating and mechanical properties as an insulating material. Further, it is possible to provide a substrate including a fine insulating layer pattern as well as a bulk insulating layer pattern by using the insulating composition to overcome an aggregation problem in a conventional inkjet printing method.

Abstract translation: 包含石墨烯氧化物和包含其的绝缘材料的绝缘组合物; 和具有大于5.5的溶剂极性指数（P）的极性溶剂，使用其的绝缘层的基板以及该基板的制造方法。 可以提供包含能够确保石墨烯氧化物的分散性的特定溶剂的绝缘组合物，同时包括具有优异的绝缘和机械性能的石墨烯氧化物作为绝缘材料。 此外，通过使用绝缘组合物来克服常规喷墨打印方法中的聚集问题，可以提供包括精细绝缘层图案的衬底以及体绝缘层图案。

公开(公告)号：US08568867B2

公开(公告)日：2013-10-29

申请号：US11758796

申请日：2007-06-06

Applicant: Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

Inventor： Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

IPC: B32B5/16 ,  B32B15/08 ,  B32B27/28

CPC classification number: H05K1/0346 ,  C08G73/1007 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/068 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

Abstract translation: 溶剂流延膜包括聚酰亚胺，其包含衍生自二酐组分的聚合的结构单元，所述二酐组分包含二酐，其选自3,4'-氧二邻苯二甲酸二酐，3,3'-氧联二邻苯二甲酸二酐，4,4'-氧联二邻苯二甲酸二酐， 和其组合与二胺组分包含4,4'-二氨基二苯砜; 其中所述聚酰亚胺的玻璃化转变温度为190℃至400℃; 并且其中所述膜具有小于60ppm /℃的热膨胀系数，0.1至250微米的厚度，不超过5重量％的残留溶剂。

公开(公告)号：US08545975B2

公开(公告)日：2013-10-01

申请号：US11758807

申请日：2007-06-06

Applicant: Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

Inventor： Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

IPC: B32B5/16 ,  B32B15/08 ,  B32B27/28

CPC classification number: H05K1/0346 ,  B29B17/0042 ,  B29B17/0404 ,  B29K2079/08 ,  B29L2007/008 ,  B32B15/08 ,  C08G73/1007 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/068 ,  Y02W30/62 ,  Y02W30/625 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/2938 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31765

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

Abstract translation: 溶剂流延膜包括聚酰亚胺，其包含衍生自二酐组分的聚合的结构单元，所述二酐组分包含二酐，其选自3,4'-氧二邻苯二甲酸二酐，3,3'-氧联二邻苯二甲酸二酐，4,4'-氧联二邻苯二甲酸二酐， 和其组合与二胺组分包含4,4'-二氨基二苯砜; 其中所述聚酰亚胺的玻璃化转变温度为190℃至400℃; 并且其中所述膜具有小于60ppm /℃的热膨胀系数，0.1至250微米的厚度，不超过5重量％的残留溶剂。

公开(公告)号：US20130126216A1

公开(公告)日：2013-05-23

申请号：US13728325

申请日：2012-12-27

Applicant: Ajit KHOSLA ,  Bonnie Lynne GRAY

Inventor： Ajit KHOSLA ,  Bonnie Lynne GRAY

IPC: H01B1/12 ,  H05K1/03

CPC classification number: H01B1/124 ,  B82Y40/00 ,  H01B1/24 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/207 ,  H05K2201/0133 ,  H05K2201/0257 ,  H05K2201/0314 ,  H05K2201/0329 ,  H05K2203/0113 ,  Y10S977/752 ,  Y10S977/779 ,  Y10S977/81 ,  Y10T428/24942 ,  Y10T428/31504

Abstract: An electrically conductive, thermosetting elastomeric composition is provided. The composition may comprise: an initially substantially non-electrically conductive, thermosetting base polymer; a particulate filler comprising electrically conductive particles; and an electrically conductive polymer additive. The non-electrically conductive, thermosetting base polymer, the particulate filler and the electrically conductive polymer additive are mixed substantially macroscopically homogeneously.

Abstract translation: 提供导电的热固性弹性体组合物。 组合物可以包括：初始基本上非导电的热固性基础聚合物; 包含导电颗粒的颗粒填料; 和导电聚合物添加剂。 非导电性，热固性基础聚合物，颗粒填料和导电聚合物添加剂基本上在宏观上均匀混合。

公开(公告)号：US20120298009A1

公开(公告)日：2012-11-29

申请号：US13576014

申请日：2010-04-23

Applicant: Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

Inventor： Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

IPC: C09J11/04 ,  B32B7/12 ,  B82Y30/00

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.

Abstract translation: 提供了使用金属纳米粒子形成接合产物的方法。 更具体地，提供了含有即使在惰性气氛中也可形成金属相的助熔剂成分的糊剂。 通过使用该糊状物，可以在不进行常规使用的加压的情况下，在低温下在惰性气氛例如氮气气氛中提供可以提供实际可接受的粘合强度的接合材料。 糊状物是构成为包含平均一次粒径为1〜200nm的银纳米粒子并涂布有碳原子数为8以下的有机材料的接合材料。 具有至少两个羧基的助熔剂组分; 和分散介质。 使用这种粘合材料即使在300℃或更低的温度也可以粘合材料。

公开(公告)号：US08274779B2

公开(公告)日：2012-09-25

申请号：US12453635

申请日：2009-05-18

Applicant: Jung Rag Yoon ,  Kyung Min Lee ,  Jeong Woo Han

Inventor： Jung Rag Yoon ,  Kyung Min Lee ,  Jeong Woo Han

IPC: H01G4/06 ,  H01G4/20 ,  H01G4/005 ,  H01G4/38

CPC classification number: H01G4/33 ,  H01G4/01 ,  H01G4/1209 ,  H01G4/1218 ,  H05K1/162 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2203/135

Abstract: Provided are an embedded capacitor, an embedded capacitor sheet using the embedded capacitor, and a method of manufacturing the same that may increase a surface area to thereby increase a capacity for each unit area and may provide an embedded capacitor in a sheet to thereby readily lay the embedded capacitor on an embedded printed circuit board. The embedded capacitor may include: a common electrode member 11 including a plurality of grooves 11a; a sealing dielectric layer 12 being formed by sealing a nano dielectric powder with a high dielectric constant in the plurality of grooves 11a formed in the common electrode member 11; a buffer dielectric layer 13 sealing and smoothing an uneven portion of the sealing dielectric layer 12 by applying a paste or a slurry including epoxy of 20 Vol % through 80 Vol % and dielectric powder of 20 Vol % through 80 Vol % with respect to the sealing dielectric layer 12; and an individual electrode member 14 being formed on the buffer dielectric layer 13.

Abstract translation: 提供了嵌入式电容器，使用嵌入式电容器的嵌入式电容器片及其制造方法，其可以增加表面积从而增加每个单位面积的容量，并且可以在片材中提供嵌入式电容器，从而容易地铺设 嵌入式电路板上的嵌入式电容器。 嵌入式电容器可以包括：公共电极构件11，其包括多个槽11a; 密封电介质层12通过在形成在公共电极构件11中的多个槽11a中密封具有高介电常数的纳米介电粉末而形成; 缓冲电介质层13，通过将包含20体积％〜80体积％的环氧树脂的糊剂或包含20体积％〜80体积％的电介质粉末的密封，密封介质层12的不均匀部分密封并平滑， 电介质层12; 以及形成在缓冲介电层13上的单独电极部件14。

公开(公告)号：US08257795B2

公开(公告)日：2012-09-04

申请号：US12019450

申请日：2008-01-24

Applicant: Guo-Quan Lu ,  Guangyin Lei ,  Jesus Calata

Inventor： Guo-Quan Lu ,  Guangyin Lei ,  Jesus Calata

IPC: B05D3/02 ,  B22F7/02

CPC classification number: B22F1/0059 ,  B22F7/064 ,  B22F2001/0066 ,  B22F2998/00 ,  B22F2998/10 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/203 ,  H01L2924/3025 ,  H05K3/321 ,  H05K3/341 ,  H05K2201/0257 ,  H05K2203/1126 ,  H05K2203/1131 ,  B22F1/0018 ,  B22F3/1021 ,  B22F3/15 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0002

Abstract: A paste including metal or metal alloy particles (which are preferably silver or silver alloy), a dispersant material, and a binder is used to form an electrical, mechanical or thermal interconnect between a device and a substrate. By using nanoscale particles (i.e., those which are less than 500 nm in size and most preferably less than 100 nm in size), the metal or metal alloy particles can be sintered at a low temperature to form a metal or metal alloy layer which is desired to allow good electrical, thermal and mechanical bonding, yet the metal or metal alloy layer can enable usage at a high temperature such as would be desired for SiC, GaN, or diamond (e.g., wide bandgap devices). Furthermore, significant application of pressure to form the densified layers is not required, as would be the case with micrometer sized particles. In addition, the binder can be varied so as to insulate the metal particles until a desired sintering temperature is reached; thereby permitting fast and complete sintering to be achieved.

Abstract translation: 包括金属或金属合金颗粒（其优选为银或银合金），分散剂材料和粘合剂的糊料用于在器件和衬底之间形成电，机械或热互连。 通过使用纳米级粒子（即，尺寸小于500nm，最优选小于100nm的纳米级粒子），可以在低温下烧结金属或金属合金粒子，形成金属或金属合金层，该金属或金属合金层是 期望允许良好的电，热和机械结合，但是金属或金属合金层可以使得能够在诸如SiC，GaN或金刚石（例如，宽带隙器件）所期望的高温下使用。 此外，不需要显着施加压力以形成致密层，如微米尺寸颗粒的情况。 此外，可以改变粘合剂以使金属颗粒绝缘直到达到所需的烧结温度; 从而可以实现快速和完全的烧结。

公开(公告)号：US08247703B2

公开(公告)日：2012-08-21

申请号：US12938759

申请日：2010-11-03

Applicant: Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich

Inventor： Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich

IPC: H05K1/16

CPC classification number: H05K1/167 ,  H01G4/206 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/095 ,  H05K1/162 ,  H05K3/0023 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/1453 ,  Y10T29/49082 ,  Y10T29/49087 ,  Y10T29/49089 ,  Y10T29/49091 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.

Abstract translation: 一种制造电路化基板的方法，包括由包括聚合物树脂的材料和包括至少一种金属组分和至少一种陶瓷组分的混合物的纳米粉末的量组成的电阻器。 陶瓷部件可以是铁电陶瓷和/或高表面积陶瓷和/或透明氧化物和/或掺杂亚锰酸盐。 或者，材料将包括聚合物树脂和纳米粉末，其中纳米粉末包含至少一种金属涂覆的陶瓷和/或至少一种氧化物涂覆的金属组分。 还提供了使用这种电路化基板的电气组件（基板和至少一个电气部件）以及信息处理系统（例如，个人计算机）。