公开(公告)号：US20130033350A1

公开(公告)日：2013-02-07

申请号：US13649604

申请日：2012-10-11

Applicant: FURUKAWA ELECTRIC CO., LTD. ,  FURUKAWA AUTOMOTIVE SYSTEMS, INC.

Inventor： Toshitaka HARA ,  Kyosuke HASHIMOTO ,  Tomoaki TORATANI ,  Kyutaro ABE ,  Hiroyuki FUKAI

IPC: H01F27/24 ,  H01F41/02

CPC classification number: H05K3/202 ,  H01F41/046 ,  H01F2017/048 ,  H05K1/165 ,  H05K2201/0215 ,  H05K2201/0397 ,  H05K2201/086 ,  H05K2201/09118 ,  Y10T29/49073

Abstract: A substrate has a coil that is a choke coil part and, for example, is used for controlling a motor. At the substrate, an electronic component mounting part is formed such that a circuit conductor therein is to be exposed to outside. A portion other than an externally connected portion such as the electronic mounting part is covered with substrate-forming resin to form an injection molded circuit board. The coil arranged at the substrate (the injection molded circuit board) is provided for smoothing current inputted from outside. A core part is formed at the coil by core-forming resin such that the coil part covers at least a center core part of the coil.

Abstract translation: 基板具有作为扼流线圈部的线圈，例如用于控制电动机。 在基板上，形成电子部件安装部，使得其中的电路导体暴露于外部。 除了外部连接部分之外的诸如电子安装部分的部分被基板形成树脂覆盖以形成注射成型的电路板。 设置在基板（注射成型电路板）上的线圈用于从外部输入的平滑电流。 通过芯部形成树脂在线圈形成芯部，使得线圈部分至少覆盖线圈的中心芯部分。

公开(公告)号：US08362366B2

公开(公告)日：2013-01-29

申请号：US13006222

申请日：2011-01-13

Applicant: Tsugio Ambo ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

Inventor： Tsugio Ambo ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

IPC: H05K1/11

CPC classification number: H05K3/202 ,  H01R9/2466 ,  H01R12/523 ,  H05K3/041 ,  H05K3/222 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4611 ,  H05K13/0061 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T428/24917

Abstract: A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

Abstract translation: 电路板包括设置在通过注射成型形成的合成树脂板上的箔电路，由铜箔制成并且具有不同于电路板的图案。 在树脂板上设置向上突出的定位销，并穿过箔片电路中制成的针孔。 箔片电路定位并固定到树脂板上。 在树脂板的所需部分中，设置有端子插入孔，并且接收端子固定到端子插入孔的所需部分并连接到箔片电路。

公开(公告)号：US08264847B2

公开(公告)日：2012-09-11

申请号：US12848000

申请日：2010-07-30

Applicant: Jin-Hong An ,  Jae-Soon Kim

Inventor： Jin-Hong An ,  Jae-Soon Kim

IPC: H05K7/02 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/288 ,  H05K2201/0187 ,  H05K2201/0397 ,  H05K2203/1316 ,  H05K2203/1476 ,  H05K2203/162

Abstract: An electronic circuit module and a method of manufacturing the electronic circuit module are disclosed. In one embodiment, the electronic circuit module includes i) a substrate on which a circuit is formed, ii) a plurality of electrical devices electrically connected to the circuit and iii) a first molding unit coated on the substrate to cover at least the electrical devices. The module further includes i) a test terminal unit comprising a plurality of test wires and configured to inspect the circuit, wherein each of the test wires comprises a first end electrically connected to the circuit and a second end exposed from the first molding unit, and wherein the second ends of the test wires form an inspection unit and are adjacent to each other on the substrate and ii) a second molding unit coated on the substrate to cover the second ends of the test wires.

Abstract translation: 公开了一种电子电路模块及其制造方法。 在一个实施例中，电子电路模块包括i）其上形成电路的基板，ii）电连接到电路的多个电气装置，以及iii）涂覆在基板上的至少覆盖电气装置的第一模制单元 。 该模块还包括i）测试终端单元，包括多个测试线并被配置为检查电路，其中每个测试线包括电连接到该电路的第一端和从第一模制单元暴露的第二端，以及 其中所述测试线的第二端形成检查单元并且在所述基底上彼此相邻，以及ii）涂覆在所述基底上以覆盖所述测试线的第二端的第二模制单元。

公开(公告)号：US20120224281A1

公开(公告)日：2012-09-06

申请号：US13401189

申请日：2012-02-21

Applicant: Hajime ARAI

Inventor： Hajime ARAI

IPC: G11B5/48

CPC classification number: G11B5/4833 ,  G11B5/486 ,  H05K1/0268 ,  H05K1/056 ,  H05K3/4092 ,  H05K2201/0397

Abstract: A flexure has a metal base plate, an insulating layer formed on the metal base plate, a wiring pattern formed on the insulating layer, a read-write head connected to a first end of the wiring pattern, and terminals for external connection that are adjacent to each other and are connected to a second end of the wiring pattern. The flexure includes a hole formed through the insulating layer in the vicinity of respective one of the adjacent terminals and an exposed part being a part of the metal base plate that is exposed through the hole to the terminals. A distance between the respective one of the adjacent terminals and the exposed part exposed through the hole in the vicinity thereof is shorter than a distance between the adjacent terminals.

Abstract translation: 挠曲具有金属基板，形成在金属基板上的绝缘层，形成在绝缘层上的布线图案，连接到布线图案的第一端的读写头和相邻的外部连接端子 并且连接到布线图案的第二端。 弯曲部包括通过绝缘层在相邻的一个相邻端子附近形成的孔，露出部分是通过孔暴露于端子的金属基板的一部分。 相邻端子之间的距离和暴露在其附近的孔的露出部分之间的距离比相邻端子之间的距离短。

公开(公告)号：US08192207B2

公开(公告)日：2012-06-05

申请号：US13034066

申请日：2011-02-24

Applicant: Mituru Iida

Inventor： Mituru Iida

IPC: H01R12/00

CPC classification number: H01R12/62 ,  H01R12/52 ,  H01R12/55 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/09181 ,  H05K2201/1059 ,  H05K2201/2009

Abstract: A female circuit board for use with a male circuit board has electrically conductive projections. The female circuit board includes a flexible insulating film. The flexible insulating film includes insertion portions into which the conductive projections of the male circuit board are allowed to be inserted. Each of the insertion portions includes a plurality of slits communicating with each other at the center of each of the insertion portions. The flexible insulating film further includes electrically conduction portions for making contact with the conductive projections to come into conduction with the male circuit board. The conduction portions are disposed around the insertion portions on the surface of the female circuit board facing the male circuit board when the female circuit board is in contact with the male circuit board. The conduction portions conform in shape to the insertion portions.

Abstract translation: 与阳电路板一起使用的母电路板具有导电突起。 阴电路板包括柔性绝缘膜。 柔性绝缘膜包括允许插入阳电路板的导电突起的插入部分。 每个插入部分包括在每个插入部分的中心处彼此连通的多个狭缝。 柔性绝缘膜还包括用于与导电突起接触以与阳电路板导通的导电部分。 当阴电路板与阳电路板接触时，导电部分设置在阴电路板的面对阳电路板的表面上的插入部分周围。 导电部分的形状与插入部分一致。

公开(公告)号：US08139372B2

公开(公告)日：2012-03-20

申请号：US12285352

申请日：2008-10-02

Applicant: Yuusuke Matsui

Inventor： Yuusuke Matsui

IPC: H05K1/14 ,  H05K7/18

CPC classification number: H05K3/4691 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0397 ,  Y10T29/49126

Abstract: A printed circuit board is disclosed. The printed circuit board includes an insulation layer and a conductor layer having a GND pattern. The printed circuit board has a center portion, to which an element is to be mounted. The printed circuit board has a periphery portion and a slit pattern separating the periphery portion from the center portion. The GND pattern extends through the center portion and the periphery portion.

Abstract translation: 公开了印刷电路板。 印刷电路板包括绝缘层和具有GND图案的导体层。 印刷电路板具有要安装元件的中心部分。 印刷电路板具有将周边部分与中心部分分开的周边部分和狭缝图案。 GND图案延伸穿过中心部分和周边部分。

公开(公告)号：US20120000700A1

公开(公告)日：2012-01-05

申请号：US12837487

申请日：2010-07-15

Applicant: CHIEN-HUNG LIU ,  PO-CHUAN HSIEH ,  YU-CHANG PAI ,  SHOU-KUO HSU

Inventor： CHIEN-HUNG LIU ,  PO-CHUAN HSIEH ,  YU-CHANG PAI ,  SHOU-KUO HSU

IPC: H05K1/11

CPC classification number: H05K1/162 ,  H05K1/0239 ,  H05K2201/0397 ,  H05K2201/10015 ,  H05K2201/1034

Abstract: A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.

Abstract translation: 印刷电路板包括第一信号层，第二信号层和夹在第一信号层和第二信号层之间的电介质层。 第一信号层包括两个焊盘。 第二信号层包括连接到两个信号迹线的两个导电片。 垫的形状和材料与导电片的形状和材料相同。 第二信号层上的焊盘的突起与导电片重叠。

公开(公告)号：US08068348B2

公开(公告)日：2011-11-29

申请号：US12279460

申请日：2007-02-03

Applicant: Gunther Chritz

Inventor： Gunther Chritz

IPC: H01R12/16

CPC classification number: H05K1/0263 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10053 ,  H05K2201/10272 ,  H05K2201/10553

Abstract: An electrical power distribution unit (1) for an electrical system has a printed circuit board (200) with a punched grid (100) arranged thereon. An electrical component (300, 310) is arranged on the printed circuit board on a side of the punched grid (100). An electrical contact (350) of the electrical component projects through a passage opening in the printed circuit board. The punched grid is arranged between the electrical component and the printed circuit board, and an opening is formed in the punched grid in an area (130) around the electrical contact. The punched grid has a current infeed (110) which comprises a plurality of tongues (111, 112; 113). At least one of the tongues is bendable out of a plane of the punched grid in such a way that two of the tongues form a mutually adjacent common portion (115), which is electrically contactable by an electrical plug connector.

Abstract translation: 一种用于电气系统的电力分配单元（1）具有布置有冲压格栅（100）的印刷电路板（200）。 在冲压网格（100）的一侧上的印刷电路板上布置电气部件（300,310）。 电气部件的电接触件（350）突出穿过印刷电路板中的通道开口。 冲压网格布置在电气部件和印刷电路板之间，并且在电触点周围的区域（130）中的冲压格栅中形成开口。 冲压格栅具有包括多个舌片（111,112; 113）的电流进料（110）。 舌片中的至少一个可以以冲压网格的平面弯曲，使得两个舌片形成相互相邻的公共部分（115），该公共部分可由电插头连接器电接触。

公开(公告)号：US08063594B2

公开(公告)日：2011-11-22

申请号：US12404422

申请日：2009-03-16

Applicant: Haruaki Motoda

Inventor： Haruaki Motoda

IPC: H02P6/00

CPC classification number: H05K7/1432 ,  H02K11/33 ,  H05K1/144 ,  H05K3/202 ,  H05K3/326 ,  H05K3/328 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A motor drive apparatus includes an assembly of first and second subassemblies. The first subassembly includes a first board and at least one connecting member, such as a bus bar, formed in the first board, and arranged to form a current supply path from a power source to the motor. The second subassembly includes a second board and at least one switching device mounted on the second board. The first and second subassemblies are stacked with an interspace between the first and second boards. A terminal segment of the switching device is connected with a terminal segment of the connecting member.

Abstract translation: 电动机驱动装置包括第一和第二子组件的组件。 第一子组件包括第一板和形成在第一板中的至少一个连接构件，例如母线，并且布置成形成从电源到电动机的电流供应路径。 第二子组件包括第二板和安装在第二板上的至少一个开关装置。 第一和第二子组件在第一和第二板之间堆叠有间隙。 开关装置的端子段与连接构件的端子段连接。

公开(公告)号：US20110254148A1

公开(公告)日：2011-10-20

申请号：US12908500

申请日：2010-10-20

Applicant: Masaki KATO ,  Masahiko FUJITA ,  Kazuyasu SAKAMOTO

Inventor： Masaki KATO ,  Masahiko FUJITA ,  Kazuyasu SAKAMOTO

IPC: H01L23/36

CPC classification number: H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/184 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10166 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.

Abstract translation: 本发明提供一种半导体装置，其被配置为可靠且容易地定位半导体器件，而不会在半导体器件中的半导体器件的底表面中形成突出部分。 通过将表面安装封装型半导体器件和布线构件附接到散热器来制造半导体器件。 在配线部件上设置有将半导体装置配合的嵌合部，通过将半导体装置嵌入到配线部件的嵌合部中来定位半导体装置。 根据本发明的半导体装置，可以高精度地定位半导体器件。