公开(公告)号：US09872383B1

公开(公告)日：2018-01-16

申请号：US14266636

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/00 ,  H05K1/03 ,  H01R4/00 ,  D05B17/00 ,  H01R4/02 ,  H01R43/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.

公开(公告)号：US09795039B2

公开(公告)日：2017-10-17

申请号：US15346043

申请日：2016-11-08

Applicant: HARRIS CORPORATION

Inventor： Louis Joseph Rendek, Jr.

IPC: H05K1/00 ,  H05K3/34 ,  H05K1/16 ,  H05K3/16 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K3/3452 ,  H01L2224/16225 ,  H05K1/028 ,  H05K1/03 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/16 ,  H05K3/3436 ,  H05K3/4038 ,  H05K2201/0141 ,  H05K2201/05 ,  Y02P70/613

Abstract: A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

公开(公告)号：US09795035B2

公开(公告)日：2017-10-17

申请号：US15356852

申请日：2016-11-21

Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC

Inventor： Jonathan Douglas Hatch ,  Stephen McGarry Hatch

IPC: H05K1/14 ,  H05K3/46 ,  H05K1/02 ,  H05K3/10 ,  H05K3/38 ,  H05K3/12 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

公开(公告)号：US09717144B2

公开(公告)日：2017-07-25

申请号：US14768800

申请日：2014-02-19

Applicant: Tokyo Institute of Technology ,  JX Nippon Oil & Energy Corporation

Inventor： Koichi Sakajiri ,  Keisuke Azuma ,  Hidetoshi Matsumoto ,  Junji Watanabe ,  Masatoshi Tokita

IPC: H05K1/09 ,  H05K3/02 ,  G06F3/041 ,  H01L31/0224 ,  H01B1/02 ,  G02F1/1343

CPC classification number: H05K1/097 ,  G02F1/13439 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H01B1/023 ,  H01L31/022466 ,  H05K3/02 ,  H05K2201/05

Abstract: There are provided a conductive nanowire network, a conductive board and transparent electrode utilizing it, and a method for producing the same. The conductive nanowire network of the invention has essentially unbroken, continuous conductive nanowires randomly formed into a network. In the method for producing a conductive nanowire network according to the invention, nanofibers are applied in a random network-like fashion onto a substrate covered with a conductive layer, the conductive layer regions that are not covered with the nanofibers are removed, and then the nanofibers are removed. The network structure (wire diameter and network density) are also controlled to obtain a transparent electrode exhibiting both transparency and conductivity.

公开(公告)号：US20170164463A1

公开(公告)日：2017-06-08

申请号：US15356852

申请日：2016-11-21

Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC

Inventor： JONATHAN DOUGLAS HATCH ,  STEPHEN MCGARRY HATCH

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/12 ,  H05K1/11 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

公开(公告)号：US20170094806A1

公开(公告)日：2017-03-30

申请号：US14941887

申请日：2015-11-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  James A. BUSBY ,  Phillip Duane ISAACS ,  David C. LONG

IPC: H05K3/12 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/0275 ,  H05K1/0298 ,  H05K1/034 ,  H05K1/09 ,  H05K1/183 ,  H05K3/12 ,  H05K3/30 ,  H05K3/301 ,  H05K3/46 ,  H05K5/0208 ,  H05K7/023 ,  H05K2201/015 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056

Abstract: Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

公开(公告)号：US20170077211A1

公开(公告)日：2017-03-16

申请号：US15363228

申请日：2016-11-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Kensuke YOSHIZUMI

IPC: H01L27/32 ,  G04G9/00 ,  H01L51/00

CPC classification number: H01L27/3276 ,  G04G9/0088 ,  H01L27/1244 ,  H01L27/3262 ,  H01L51/0097 ,  H01L2227/323 ,  H01L2251/5338 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/051 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  Y02E10/549

Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

Abstract translation: 本发明的一个实施例提供了一种高度可靠的显示装置。 特别地，提供可以稳定地供给信号或电源电位的显示装置。 此外，提供了可稳定地供给信号或电源电位的可弯曲显示装置。 显示装置在柔性基板上包括显示部分，可以输入来自外部的信号的多个连接端子和多个布线。 多个布线中的一个将多个连接端子中的一个电连接到显示部分。 多个布线中的一个布线包括包括多条单独的线的第一部分和多条线会聚的第二部分。

公开(公告)号：US20170075054A1

公开(公告)日：2017-03-16

申请号：US15363789

申请日：2016-11-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Duck YANG ,  Jin Hee KIM ,  Chul Hong KIM ,  Gwang Ho PARK ,  Moo Ryoung PARK

IPC: F21V8/00 ,  F21S8/10

CPC classification number: G02B6/0036 ,  F21S43/14 ,  F21S43/145 ,  F21S43/239 ,  F21S43/245 ,  F21S43/249 ,  F21S43/26 ,  F21S43/40 ,  F21V13/12 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02B6/0001 ,  G02B6/0021 ,  G02B6/0025 ,  G02B6/003 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  H05K1/00 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: Disclosed is a lighting device which comprises: an optical member comprising a protruding optical pattern forming a gap with an adjacent layer; at least one light emitting unit inserted into the optical member; and a resin layer formed on the optical member and the at least one light emitting unit, whereby it is possible to obtain an effect that the shapes of light change depending on the viewing angle when viewing the light source by producing various protruding optical patterns, an effect that the whole thickness can be reduced, and an effect that the degree of design freedom can be enhanced when designing products thanks to an enhanced flexibility.

Abstract translation: 公开了一种照明装置，其包括：光学构件，包括与相邻层形成间隙的突出光学图案; 至少一个发光单元插入到光学构件中; 以及形成在所述光学构件和所述至少一个发光单元上的树脂层，由此可以获得当通过产生各种突出的光学图案来观察光源时，光的形状随着视角而变化的效果， 可以降低整个厚度，并且由于增强的灵活性，在设计产品时可以提高设计自由度。

公开(公告)号：US20170034909A1

公开(公告)日：2017-02-02

申请号：US15223241

申请日：2016-07-29

Applicant: Nitto Denko Corporation

Inventor： Daisuke YAMAUCHI ,  Hiroyuki TANABE

IPC: H05K1/02 ,  G11B5/48 ,  H05K1/09 ,  H05K3/46 ,  H05K1/03

CPC classification number: G11B5/4833 ,  G11B5/484 ,  H05K1/056 ,  H05K1/09 ,  H05K1/111 ,  H05K3/244 ,  H05K3/388 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2201/05 ,  Y02P70/611

Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.

Abstract translation: 在基底绝缘层上形成导体迹线。 导体迹线包括两个端子部分和一个布线部分。 布线部形成为将两个端子部彼此连接并从各端子部延伸。 形成金属覆盖层以覆盖导体迹线的端子部分和布线部分并且从端子部分的表面连续地延伸到布线部分的表面。 金属覆盖层由具有低于镍的磁性的金属制成，例如由金制成。 在绝缘层上形成覆盖绝缘层，以覆盖形成在导体迹线上的金属覆盖层的覆盖布线部分的部分，而不覆盖覆盖端子部分的金属覆盖层的一部分。

公开(公告)号：US09543533B2

公开(公告)日：2017-01-10

申请号：US14192178

申请日：2014-02-27

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Kensuke Yoshizumi

IPC: H05K1/00 ,  H01L51/00 ,  H05K7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/14

CPC classification number: H01L27/3276 ,  G04G9/0088 ,  H01L27/1244 ,  H01L27/3262 ,  H01L51/0097 ,  H01L2227/323 ,  H01L2251/5338 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/051 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  Y02E10/549

Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

Abstract translation: 本发明的一个实施例提供了一种高度可靠的显示装置。 特别地，提供可以稳定地供给信号或电源电位的显示装置。 此外，提供了可稳定地供给信号或电源电位的可弯曲显示装置。 显示装置在柔性基板上包括显示部分，可以输入来自外部的信号的多个连接端子和多个布线。 多个布线中的一个将多个连接端子中的一个电连接到显示部分。 多个布线中的一个布线包括包括多条单独的线的第一部分和多条线会聚的第二部分。