公开(公告)号：US06372699B1

公开(公告)日：2002-04-16

申请号：US09215872

申请日：1998-12-18

Applicant: Hiroshi Morita ,  Tetsuo Mizuniwa ,  Junichi Ida

Inventor： Hiroshi Morita ,  Tetsuo Mizuniwa ,  Junichi Ida

IPC: C11D1310

CPC classification number: H01L21/02052 ,  C11D3/0042 ,  C11D3/3947 ,  C11D7/06 ,  C11D11/0047 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: A cleaning solution for electronic materials contains dissolved oxygen gas at a concentration greater than atmospheric saturation concentration, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000 mg/liter of hydrogen peroxide in water. Alternatively, the cleaning solution contains dissolved reducing agents, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000 mg/liter of hydrogen peroxide in water. A method for making the cleaning solution of the present invention is provided. A method for cleaning electronic materials using the cleaning solution of the present invention is also provided.

Abstract translation: 用于电子材料的清洁溶液含有浓度大于大气饱和浓度的溶解氧气，0.1-10,000mg /升氨和0.1-10,000mg /升过氧化氢水溶液。 或者，清洁溶液含有溶解的还原剂，0.1-10,000mg /升氨和0.1-10,000mg /升过氧化氢在水中。 提供了制造本发明的清洗溶液的方法。 还提供了使用本发明的清洁溶液清洁电子材料的方法。

公开(公告)号：US20010040047A1

公开(公告)日：2001-11-15

申请号：US09917701

申请日：2001-07-31

Inventor： John Joseph Konrad ,  Konstantinos I. Papathomas ,  Timothy Leroy Wells ,  James Warren Wilson

IPC: H05K001/00 ,  B05D005/12 ,  H02B001/24

CPC classification number: C23C18/1651 ,  C23C18/1844 ,  H05K3/184 ,  H05K3/244 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/0796 ,  Y10T428/24917

Abstract: Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.

公开(公告)号：US6040530A

公开(公告)日：2000-03-21

申请号：US986078

申请日：1997-12-05

Applicant: Robert J. Wharton ,  Eric R. Daniel ,  Joseph D. Brown

Inventor： Robert J. Wharton ,  Eric R. Daniel ,  Joseph D. Brown

IPC: G01R31/02 ,  G01R31/316 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K13/08 ,  H01R9/09

CPC classification number: G01R31/316 ,  H05K1/0268 ,  H05K1/111 ,  H05K13/08 ,  H05K2201/0761 ,  H05K2201/09345 ,  H05K2201/09772 ,  H05K2201/10106 ,  H05K2201/10734 ,  H05K3/3436 ,  Y02P70/611

Abstract: A printed circuit board can be used as a test card. The printed circuit board has a first image and a second image. The first image includes a first array pattern for attaching a package, a first power plane, and a first ground plane. The second image includes a second array pattern for attaching a package, a second power plane, and a second ground plane. A first routing area between the first image and the second image electrically and physically isolates the first power plane from the second power plane. The first routing area also physically isolates the first ground plane from the second ground plane. A first single trace extends through the first routing area. The first single trace electrically connects the first ground plane to the second ground plane.

Abstract translation: 印刷电路板可用作测试卡。 印刷电路板具有第一图像和第二图像。 第一图像包括用于附接封装的第一阵列图案，第一电源平面和第一接地平面。 第二图像包括用于附接封装的第二阵列图案，第二电源平面和第二接地平面。 第一图像和第二图像之间的第一路由区域电和物理地隔离第一电力平面与第二电力平面。 第一布线区域还将第一接地平面与第二接地平面物理隔离。 第一个单一轨迹延伸穿过第一个路线区域。 第一单个迹线将第一接地平面电连接到第二接地平面。

公开(公告)号：US5604191A

公开(公告)日：1997-02-18

申请号：US218903

申请日：1994-03-28

Applicant: Greg R. Unruh

Inventor： Greg R. Unruh

IPC: C11D7/24 ,  C11D7/26 ,  C11D7/28 ,  C11D7/32 ,  C11D7/34 ,  C11D7/50 ,  C23G5/02 ,  H05K3/26 ,  C07D215/14 ,  C23C18/30

CPC classification number: C11D7/261 ,  C11D7/262 ,  C11D7/5004 ,  C23G5/02 ,  H05K3/26 ,  C11D7/24 ,  C11D7/267 ,  C11D7/28 ,  C11D7/32 ,  C11D7/34 ,  H05K2201/0761 ,  H05K2203/121 ,  Y10T428/31663

Abstract: A composition and method for the removal of ionic salt deposits from a surface using an organic solvent of low polarity and a complexing agent. The complexing agent is chosen from a group which includes podands, cryptands, and coronands. The method provides nearly complete removal of ionic salt deposits with a single washing of the surface with the low polar cleaning mixture.

Abstract translation: 使用低极性的有机溶剂和络合剂从表面除去离子盐沉积物的组合物和方法。 络合剂选自包括podands，cryptands和coronand的组。 该方法通过用低极性清洗混合物对表面进行单次洗涤，几乎完全除去离子盐沉积物。

公开(公告)号：US09049783B2

公开(公告)日：2015-06-02

申请号：US13446783

申请日：2012-04-13

Applicant: Dejan Teofilovic

Inventor： Dejan Teofilovic

IPC: G02B6/26 ,  G02B6/42 ,  H05K1/02

CPC classification number: H05K1/0256 ,  H05K1/0227 ,  H05K2201/0761 ,  H05K2201/09781 ,  H05K2201/09972 ,  H05K2201/10121

Abstract: An electrical circuit with large creepage isolation distances is provided. In some embodiments, the electrical circuit is capable of increasing creepage isolation distances by many multiples over traditional electrical circuits. In one embodiment, an electrical circuit comprises a ground circuit optically coupled to a floating circuit, and an isolated circuit optically coupled to the floating circuit. The circuits can be optically coupled with opto-isolators, for example. The isolated circuit can have a creepage isolation distance at least twice as large as a traditional circuit. In some embodiments, “n” number of floating circuits can be optically coupled between the ground circuit and the isolated circuit to increase the total creepage isolation distance by a factor of “n”. Methods of use are also described.

Abstract translation: 提供了具有大爬电隔离距离的电路。 在一些实施例中，电路能够在传统电路上增加多个倍数的爬电隔离距离。 在一个实施例中，电路包括光耦合到浮置电路的接地电路和与浮动电路光耦合的隔离电路。 例如，电路可以与光隔离器光学耦合。 隔离电路的爬电隔离距离至少为传统电路的两倍。 在一些实施例中，“n”个浮动电路可以在接地电路和隔离电路之间光学耦合，以将总爬电隔离距离提高因子“n”。 还描述了使用方法。

公开(公告)号：US08853559B2

公开(公告)日：2014-10-07

申请号：US13388450

申请日：2010-02-24

Applicant: Hironori Matsumoto ,  Jumpei Kusukawa

Inventor： Hironori Matsumoto ,  Jumpei Kusukawa

IPC: H05K1/11 ,  H01L23/62 ,  H01L25/18 ,  H05K1/02 ,  H01L23/64 ,  H01L23/14 ,  H01L25/07 ,  H05K1/05 ,  H05K1/03 ,  H05K7/00 ,  H05K1/18 ,  H01L23/498

CPC classification number: H05K1/056 ,  H01L23/142 ,  H01L23/49844 ,  H01L23/62 ,  H01L23/647 ,  H01L25/072 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0257 ,  H05K1/0262 ,  H05K1/053 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0761 ,  H05K2201/09781 ,  H05K2201/10022 ,  H01L2924/00

Abstract: The invention relates to a high-voltage insulation circuit board which is used in an electric power apparatus such as an electric power converter or the like such as power semiconductor device, inverter module, or the like and provides an insulation circuit board in which electric field concentration at the end sections of a wiring pattern is reduced, partial discharging is suppressed, and a reliability is high. According to the invention, there is provided an insulation circuit board having: a metal base substrate; and wiring patterns which are formed onto at least one of the surfaces of the metal base substrate through an insulation layer, characterized in that between two adjacent wiring patterns in which an electric potential difference exists among the wiring patterns, at least one or more wiring patterns or conductors which are in contact with the insulation layer and have an electric potential in a range of the electric potential difference between the adjacent wiring patterns are arranged. According to the invention, the electric field concentration at the end sections of the wiring pattern to which a high voltage is applied is reduced and partial-discharge-resistant characteristics are improved.

Abstract translation: 本发明涉及一种用于诸如功率半导体器件，逆变器模块等的电力转换器等的电力设备中使用的高压绝缘电路板，​​并且提供了一种绝缘电路板，​​其中电场 在布线图案的端部处的浓度降低，部分放电被抑制，可靠性高。 根据本发明，提供了一种绝缘电路板，​​其具有：金属基底; 以及通过绝缘层形成在金属基底基板的至少一个表面上的布线图案，其特征在于，在布线图案之间存在电位差的两个相邻布线图案之间，至少一个或多个布线图案 或与绝缘层接触并且在相邻布线图案之间的电位差范围内具有电位的导体。 根据本发明，施加高电压的布线图案的端部处的电场浓度降低，并且提高耐局部放电特性。

公开(公告)号：US08823535B2

公开(公告)日：2014-09-02

申请号：US13705224

申请日：2012-12-05

Applicant: International Business Machines Corporation

Inventor： Levente Klein ,  Prabjit Singh ,  Jing Zhang

IPC: G08B21/00

CPC classification number: H05K1/0268 ,  G01N17/04 ,  H05K2201/0761

Abstract: Apparatus and method for directly detecting the atmospheric conditions leading to creep corrosion of printed circuit boards (PCBs) well before the PCBs in the computers start suffering from creep corrosion. The embodiment indicates the propensity of the air towards creep corrosion on PCBs. Additionally, to avoid the false reading due to condensed moisture, condensed moisture may be avoided by using a heater attached to the creep corrosion monitor that keeps the creep corrosion monitor above the dew point temperature.

Abstract translation: 在计算机中PCBs开始遭受蠕变腐蚀之前，直接检测导致印刷电路板（PCB）蠕变腐蚀的大气条件的装置和方法。 该实施例表示空气在PCB上的蠕变腐蚀倾向。 另外，为了避免由于冷凝水分引起的错误读数，可以通过使用附着在蠕变腐蚀监测器上的加热器来避免冷凝的水分，从而使蠕变腐蚀监测器保持在露点温度以上。

公开(公告)号：US20130092417A1

公开(公告)日：2013-04-18

申请号：US13654253

申请日：2012-10-17

Applicant: General Electric Corporation

Inventor： Khanh Q. Nguyen

IPC: H05K7/10

CPC classification number: H05K3/306 ,  H01L23/32 ,  H01L23/49562 ,  H01L2924/0002 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/0761 ,  H05K2201/10424 ,  H01L2924/00

Abstract: A sleeve structure includes an electrically insulating protective sleeve having clips that retain and capture component pins and regulate a mounting distance of the electrical component from a wiring structure. A method of component wiring assembly is also included.

Abstract translation: 套筒结构包括电绝缘保护套筒，其具有保持并捕获部件销并且调节电气部件与布线结构的安装距离的夹子。 还包括组件接线组件的方法。

公开(公告)号：US20110226514A1

公开(公告)日：2011-09-22

申请号：US13048904

申请日：2011-03-16

Applicant: Yasunori YAMANAKA

Inventor： Yasunori YAMANAKA

IPC: H05K1/00 ,  H05K1/16

CPC classification number: H05K3/306 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/0761 ,  H05K2201/09063 ,  H05K2203/1572

Abstract: An electronic device includes an electronic component provided with leads. A printed circuit board has a front surface and a back surface and is provided with through holes and a groove hole. The through holes are capable of receiving the leads, respectively. The groove hole is formed so as to cross straight lines that connect the through holes. A first insulating spacer is provided on the groove hole between the leads so as to isolate the leads from each other and is positioned between the electronic component and the front surface of the printed circuit board. A second insulating spacer is inserted through the groove hole from the back surface of the printed circuit board and engages with the first insulating spacer so as to isolate end portions of the leads from each other.

Abstract translation: 电子设备包括具有引线的电子部件。 印刷电路板具有前表面和后表面，并且设置有通孔和凹槽。 通孔能够分别接收引线。 凹槽形成为穿过连接通孔的直线。 在引线之间的槽孔中设置第一绝缘隔离物，以将引线彼此隔离并且位于电子部件和印刷电路板的前表面之间。 第二绝缘隔离物从印刷电路板的后表面穿过槽孔插入，并与第一绝缘垫片接合，以使导线的端部彼此隔离。

公开(公告)号：US20110171367A1

公开(公告)日：2011-07-14

申请号：US13120017

申请日：2009-09-22

Applicant: Hannes Voraberger

Inventor： Hannes Voraberger

IPC: B05D5/00 ,  B05D3/10

CPC classification number: C11D11/0047 ,  C11D3/0073 ,  C11D7/06 ,  C11D7/08 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D7/34 ,  H05K3/26 ,  H05K3/282 ,  H05K2201/0761 ,  H05K2203/0789 ,  H05K2203/1157

Abstract: In a method for improving the corrosion resistance of an electronic component, particularly of conductors of a printed circuit board, wherein after the conductors are produced out of copper a further treatment follows, the conductors are subjected to a pretreatment prior to the further treatment, wherein ions or ion impurities present on the surface of the conductors are removed by a purifying treatment and/or treated with at least one complexing composition, whereby the production of conductors and/or printed circuit boards having improved corrosion resistance, particularly when used in surroundings having higher moisture and optionally higher temperatures, becomes possible.

Abstract translation: 在提高电子部件，特别是印刷电路板的导体的耐腐蚀性的方法中，其中在由铜制成导体之后，进一步处理如下，在进一步处理之前对导体进行预处理，其中 存在于导体表面上的离子或离子杂质通过净化处理除去和/或用至少一种络合组合物处理，由此生产具有改善的耐腐蚀性的导体和/或印刷电路板，特别是当在具有 更高的湿度和任选的更高的温度成为可能。