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    Antenna feed integrated on multi-layer PCB
    24.
    发明授权
    Antenna feed integrated on multi-layer PCB 有权
    天线馈电集成在多层PCB上

    公开(公告)号：US09391370B2

    公开(公告)日：2016-07-12

    申请号：US14752531

    申请日：2015-06-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ioannis Tzanidis ,  Robert Monroe

    IPC: H04M1/00 ,  H01Q9/18 ,  H01Q1/50 ,  H01Q1/48

    CPC classification number: H01Q9/18 ,  H01L2924/0002 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q9/0457 ,  H01Q9/20 ,  H01Q21/24 ,  H01Q23/00 ,  H05K1/0243 ,  H05K2201/0969 ,  H05K2201/10098 ,  H01L2924/00

    Abstract: A transmitter includes apparatus for integrating the antenna feed into a multilayer PCB. The apparatus includes an antenna element disposed over the multilayer PCB having slot openings that substantially overlap and that enable an RF signal to be coupled from a printed transmission line located on one of the multilayer PCB conductive layers. The multilayer PCB board hosts at least one transceiver unit and a baseband unit such that the antenna feed, transceiver and baseband units are integrated on a single multilayer PCB board without degradation of antenna bandwidth and efficiency.

    Abstract translation: 发射机包括用于将天线馈送集成到多层PCB中的装置。 该装置包括设置在多层PCB上的天线元件，其具有基本上重叠的槽开口，并且使RF信号能够从位于多层PCB导电层之一上的印刷传输线耦合。 多层PCB板承载至少一个收发器单元和基带单元，使得天线馈电，收发器和基带单元集成在单个多层PCB板上，而不会降低天线带宽和效率。

    TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS
    27.
    发明申请
    TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS 审中-公开
    电子电路纺织整合

    公开(公告)号：US20160100480A1

    公开(公告)日：2016-04-07

    申请号：US14752576

    申请日：2015-06-26

    Applicant: IMEC vzw

    Inventor： Bjorn Van Keymeulen ,  Frederick Bossuyt ,  Thomas Vervust

    IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K3/32

    CPC classification number: H05K1/038 ,  A41D1/002 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/0026 ,  H05K3/321 ,  H05K3/46 ,  H05K2201/0263 ,  H05K2201/0969 ,  H05K2201/10977 ,  H05K2203/107

    Abstract: The present disclosure relates to a method of integrating a interposer device with a textile layer, wherein the interposer device is a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards the textile layer. The interposer device is arranged to be mechanically attached to a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn. An electrical connection is established between the at least one conductive yarn of the textile layer and the at least one contact pad, which electrical connection is established after the interposer device has been mechanically attached to the textile layer.

    Abstract translation: 本公开涉及一种将插入器装置与织物层整合的方法，其中所述插入器装置是可拉伸插入器装置，其包括具有至少一个接触垫的可拉伸导电结构，用于建立至少一个朝向织物层的导电路径 。 插入器装置被布置成机械地附接到包括多根纱线的织物层，其中至少一个是导电纱线。 在织物层的至少一个导电纱线和至少一个接触垫片之间建立电连接，在插入器装置机械地附接到织物层之后，建立电连接。

    METHOD OF PRODUCING SUSPENSION BOARD WITH CIRCUIT
    28.
    发明申请
    METHOD OF PRODUCING SUSPENSION BOARD WITH CIRCUIT 审中-公开
    制造带电路的悬挂板的方法

    公开(公告)号：US20160057867A1

    公开(公告)日：2016-02-25

    申请号：US14753433

    申请日：2015-06-29

    Applicant: NITTO DENKO CORPORATION

    Inventor： Daisuke YAMAUCHI ,  Takatoshi SAKAKURA

    IPC: H05K3/10 ,  H05K3/00 ,  H05K3/46

    CPC classification number: H05K1/056 ,  G11B5/484 ,  H05K3/0082 ,  H05K3/027 ,  H05K3/064 ,  H05K3/44 ,  H05K2201/0969 ,  H05K2203/0323

    Abstract: A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer; forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening.

    Abstract translation: 具有电路的悬挂板的制造方法包括准备金属支撑层的工序; 在所述金属支撑层上形成可固化绝缘层，使用光敏固化绝缘组合物，使得在所述可固化绝缘层中形成开口，固化所述可固化绝缘层以形成绝缘层，使从所述开口露出的所述金属支撑层经受微波 等离子体处理，并且在从开口露出的金属支撑层上形成金属导电部分。

    FLAT CABLE
    30.
    发明申请
    FLAT CABLE 有权
    扁平电缆

    公开(公告)号：US20150333388A1

    公开(公告)日：2015-11-19

    申请号：US14807925

    申请日：2015-07-24

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Noboru KATO

    IPC: H01P3/08

    CPC classification number: H01P3/08 ,  H01P3/085 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727

    Abstract: A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings.

    Abstract translation: 扁平电缆包括介质元件组件，其包括彼此层叠的多个电介质层，设置在电介质元件组件中的线性信号线，设置在相对于信号线的层叠方向的一侧上的第一接地导体， 沿着信号线布置的多个第一开口以及设置在相对于信号线的层叠方向的另一侧的第二接地导体，并且包括沿信号线布置的多个第二开口。 第一接地导体在层叠方向比信号线远离第二接地导体。 第一开口大于第二开口。

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