公开(公告)号：US20240098912A1

公开(公告)日：2024-03-21

申请号：US18373776

申请日：2023-09-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhwan JEON ,  Kwangho Jung ,  Chihyun Cho ,  Sangwon Ha

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K5/0069 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/284 ,  H05K3/341 ,  H05K5/0086 ,  H05K2201/09372 ,  H05K2201/10007

Abstract: An electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. In the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.

公开(公告)号：US20240064903A1

公开(公告)日：2024-02-22

申请号：US18450795

申请日：2023-08-16

Applicant: Alcon Inc.

Inventor： Horst Keiler ,  Martin Eil

IPC: H05K1/16 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/167 ,  H05K3/306 ,  H05K1/0286 ,  H05K2201/10007

Abstract: A printed circuit board comprises a substrate as well as resistors and electrical connections disposed on the substrate. The substrate couples to a video graphics array connector that has pins, including video pins and return pins. A video pin transmits a video signal, and a return pin provides a ground for a corresponding video pin. The substrate has openings, where each opening can receive a pin. The resistors and the electrical connections couple to a subset of the pins to mimic an external video graphics array monitor. The resistors comprise: a red connection resistor that can couple a red video pin with a red return pin; a green connection resistor that can couple a green video pin with a green return pin; and a blue connection resistor that can couple a blue video pin with a blue return pin.

公开(公告)号：US09974165B2

公开(公告)日：2018-05-15

申请号：US15418918

申请日：2017-01-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki Gouchi

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H05K3/40 ,  H05K3/24

CPC classification number: H05K1/0287 ,  H05K1/0292 ,  H05K1/0293 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/24 ,  H05K3/4007 ,  H05K3/4092 ,  H05K3/4632 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10007 ,  H05K2201/10159 ,  H05K2201/10984 ,  H05K2201/2072 ,  H05K2203/0271 ,  H05K2203/063 ,  H05K2203/08

Abstract: To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

公开(公告)号：US09596764B2

公开(公告)日：2017-03-14

申请号：US14577333

申请日：2014-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki Gouchi

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0287 ,  H05K1/0292 ,  H05K1/0293 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/24 ,  H05K3/4007 ,  H05K3/4092 ,  H05K3/4632 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10007 ,  H05K2201/10159 ,  H05K2201/10984 ,  H05K2201/2072 ,  H05K2203/0271 ,  H05K2203/063 ,  H05K2203/08

Abstract: To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

Abstract translation: 为了防止电子部件和多层基板的接合强度的降低，电子部件嵌入式模块可以包括具有多个焊盘的电子部件和包括多个树脂层的多层基板和用于容纳电子部件的空腔 零件。 多层基板可以包括具有多个第一图案导体和空间的第一树脂层和具有第二图案导体和多个第三图案导体的第二树脂层。 多个第三图案导体可以与第一图案导体或垫中的任一个导通，其中第二树脂层被放置在第一树脂层上。 第二图案导体可以布置在具有间隙的第一衬垫周围，并且第二树脂层存在于第二图案导体和至少一个第一衬垫之间。

公开(公告)号：US20160120036A1

公开(公告)日：2016-04-28

申请号：US14891108

申请日：2014-04-29

Applicant: GIESECKE & DEVRIENT GMBH

Inventor： Thomas TARANTINO

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/20 ,  G06K19/077 ,  H05K3/14

CPC classification number: H05K1/186 ,  G06K19/07718 ,  G06K19/07722 ,  G06K19/07732 ,  G06K19/07747 ,  H05K3/0014 ,  H05K3/0052 ,  H05K3/10 ,  H05K3/14 ,  H05K3/202 ,  H05K3/32 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/033

Abstract: A method for producing a portable data carrier includes a spatial structure printed on a first foil. Electroconductive lines are applied first, and components are subsequently inserted in the structure, wherein the structure corresponds to the dimensions or the shape and size of the inserted components. The components are electroconductively connected to the lines therein. A cover is printed over the components. A second foil can be applied to the cover, wherein a design print can be applied to both foils. A gap can be incorporated in the structure and the foils, in order to insert a chip module.

Abstract translation: 制造便携式数据载体的方法包括印刷在第一箔上的空间结构。 首先施加导电线，然后将部件插入结构中，其中该结构对应于插入部件的尺寸或形状和尺寸。 这些部件与其中的线电导连接。 在组件上打印一个盖子。 第二箔可以应用于盖，其中设计印刷可以应用于两个箔。 为了插入芯片模块，可以在结构和箔中并入间隙。

公开(公告)号：US09299494B2

公开(公告)日：2016-03-29

申请号：US14479984

申请日：2014-09-08

Applicant: Elwha LLC

Inventor： Alistair K. Chan ,  Geoffrey F. Deane ,  Roderick A. Hyde ,  Jeffrey A. Bowers ,  Nathan Kundtz ,  Nathan P. Myhrvold ,  David R. Smith ,  Lowell L. Wood, Jr.

IPC: H01G4/008 ,  B32B37/14 ,  H05K1/02 ,  H05K3/00 ,  B32B9/00 ,  B32B5/18 ,  H01L29/16 ,  H01G4/005 ,  H01G4/002 ,  H01L29/786 ,  H01L27/12 ,  H05K1/09 ,  B82Y30/00

CPC classification number: H01G4/008 ,  B32B5/18 ,  B32B9/007 ,  B32B37/14 ,  B32B2266/04 ,  B32B2266/057 ,  B32B2266/126 ,  B32B2307/202 ,  B32B2457/08 ,  B82Y30/00 ,  H01G4/002 ,  H01G4/005 ,  H01L27/12 ,  H01L29/1606 ,  H01L29/78603 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/09 ,  H05K1/097 ,  H05K1/181 ,  H05K3/00 ,  H05K2201/0323 ,  H05K2201/10007 ,  H05K2201/10121 ,  Y10S977/734 ,  Y10T29/49128 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24996 ,  Y10T428/249981 ,  Y10T428/24999 ,  Y10T428/30

Abstract: An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

公开(公告)号：US09226393B2

公开(公告)日：2015-12-29

申请号：US14512179

申请日：2014-10-10

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Francis Steffen ,  Gilbert Assaud

IPC: B41J2/14 ,  B41J2/175 ,  H05K1/00 ,  H05K1/02 ,  G06K19/073 ,  G06K19/077 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/20 ,  H05K3/30

CPC classification number: H05K1/028 ,  B41J2/1753 ,  B41J2/17546 ,  B41J2/17559 ,  G06K19/0739 ,  G06K19/07798 ,  H05K1/0283 ,  H05K1/0313 ,  H05K1/118 ,  H05K1/181 ,  H05K3/20 ,  H05K3/30 ,  H05K2201/10007 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.

Abstract translation: 一种电路，包括柔性基板和至少一个附着到基板的电气元件，所述基板包括布置在所述电气元件附近的至少一个空腔，并且有助于响应于所述基板的弯曲或拉伸来破坏或变形所述电气元件。 尤其适用于制造防撕裂电子微型模块。

公开(公告)号：US20150201494A1

公开(公告)日：2015-07-16

申请号：US14155920

申请日：2014-01-15

Applicant: Honeywell International Inc.

Inventor： Nan Wang ,  Orville Nyhus ,  Chao Wang

IPC: H05K1/14 ,  H05K3/10 ,  H05K1/11 ,  H05K3/46 ,  H01Q21/00 ,  H05K1/02

CPC classification number: H05K1/144 ,  H01L2224/00 ,  H01P3/084 ,  H01Q1/002 ,  H01Q1/246 ,  H01Q1/50 ,  H01Q21/0081 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K3/10 ,  H05K3/46 ,  H05K2201/10007 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: Systems and methods for a feeding structure for an antenna array are provided. In at least one embodiment, the feeding structure for an antenna array comprises one or more circuit boards with one or more circuits formed thereon, one or more conductive layers wherein the one or more circuit boards are mounted to the one or more conductive layers, and one or more connectors coupled to the one or more circuits through an opening in the one or more conductive layers. Furthermore, the one or more conductive layers are separated by a dielectric from the one or more circuits and the one or more conductive layers contact the one or more circuit boards such that the one or more circuits are isolated from the one or more conductive layers.

Abstract translation: 提供了一种用于天线阵列馈电结构的系统和方法。 在至少一个实施例中，天线阵列的馈电结构包括一个或多个电路板，其上形成有一个或多个电路，一个或多个导电层，其中一个或多个电路板安装到一个或多个导电层，以及 一个或多个通过所述一个或多个导电层中的开口耦合到所述一个或多个电路的连接器。 此外，一个或多个导电层由电介质与一个或多个电路隔开，并且一个或多个导电层接触一个或多个电路板，使得一个或多个电路与一个或多个导电层隔离。

公开(公告)号：US20150103499A1

公开(公告)日：2015-04-16

申请号：US14577333

申请日：2014-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki GOUCHI

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0287 ,  H05K1/0292 ,  H05K1/0293 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/24 ,  H05K3/4007 ,  H05K3/4092 ,  H05K3/4632 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10007 ,  H05K2201/10159 ,  H05K2201/10984 ,  H05K2201/2072 ,  H05K2203/0271 ,  H05K2203/063 ,  H05K2203/08

Abstract: To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

Abstract translation: 为了防止电子部件和多层基板的接合强度的降低，电子部件嵌入式模块可以包括具有多个焊盘的电子部件和包括多个树脂层的多层基板和用于容纳电子部件的空腔 零件。 多层基板可以包括具有多个第一图案导体和空间的第一树脂层和具有第二图案导体和多个第三图案导体的第二树脂层。 多个第三图案导体可以与第一图案导体或垫中的任一个导通，其中第二树脂层被放置在第一树脂层上。 第二图案导体可以布置在具有间隙的第一衬垫周围，并且第二树脂层存在于第二图案导体和至少一个第一衬垫之间。

公开(公告)号：US20140313681A1

公开(公告)日：2014-10-23

申请号：US14321030

申请日：2014-07-01

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takaharu YAMANO ,  Hajime IIZUKA ,  Hideaki SAKAGUCHI ,  Toshio KOBAYASHI ,  Tadashi ARAI ,  Tsuyoshi KOBAYASHI ,  Tetsuya KOYAMA ,  Kiyoaki IIDA ,  Tomoaki MASHIMA ,  Koichi TANAKA ,  Yuji KUNIMOTO ,  Takashi YANAGISAWA

IPC: H05K1/18

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract translation: 公开了一种电子部件嵌入式基板。 电子部件嵌入式基板包括第一基板，第二基板，电子部件，电连接部件和密封部件。 还公开了一种制造电子部件嵌入式基板的方法。 该方法包括将电子部件安装到第一基板上，通过电连接部件将第二基板层压在第一基板上; 以及用密封构件填充第一基板和第二基板之间的空间以密封电子部件。