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    CIRCUIT BOARD, CONNECTION STRUCTURE, AND APPARATUS
    22.
    发明申请
    CIRCUIT BOARD, CONNECTION STRUCTURE, AND APPARATUS 有权
    电路板，连接结构和装置

    公开(公告)号：US20090016030A1

    公开(公告)日：2009-01-15

    申请号：US11720120

    申请日：2005-08-31

    Applicant: Kozo Takahashi

    Inventor： Kozo Takahashi

    IPC: H05K1/00

    CPC classification number: H05K1/118 ,  H01R12/592 ,  H01R12/79 ,  H05K1/117 ,  H05K2201/09672 ,  H05K2201/09781 ,  H05K2201/10386 ,  H05K2203/1572 ,  Y10S439/951

    Abstract: A circuit board is connected to a connector including a connection port and contact portions located at upper and lower positions of the connection port. The contact portions face each other in the vertical direction, and each contact portion is connected electrically to the opposite contact portion. The circuit board includes a base substrate, a first wiring layer, and a second wiring layer. First terminals connected to the first wiring layer are provided on one principal surface of the base substrate, and second terminals connected to the second wiring layer are provided on the other principal surface. The first terminals and the second terminals come into contact with the contact portions and are arranged so as not to overlap each other in the vertical direction.

    Abstract translation: 电路板连接到包括连接端口的连接器和位于连接端口的上部和下部位置的接触部分。 接触部分在垂直方向上彼此面对，并且每个接触部分电连接到相对的接触部分。 电路板包括基底基板，第一布线层和第二布线层。 连接到第一布线层的第一端子设置在基底基板的一个主表面上，而在第二布线层上连接的第二端子设置在另一个主表面上。 第一端子和第二端子与接触部分接触并且被布置成在垂直方向上彼此不重叠。

    Optically coupled semiconductor device and electronic device
    24.
    发明申请
    Optically coupled semiconductor device and electronic device 审中-公开
    光耦半导体器件和电子器件

    公开(公告)号：US20070272881A1

    公开(公告)日：2007-11-29

    申请号：US11714115

    申请日：2007-03-06

    Applicant: Yasushi Hasegawa

    Inventor： Yasushi Hasegawa

    IPC: G02B27/00

    CPC classification number: H04B10/801 ,  H01L2224/0603 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/181 ,  H05K1/0203 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10386 ,  H05K2201/10553 ,  H05K2201/1056 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: In an embodiment of an optically coupled semiconductor device of the present invention, the optically coupled semiconductor device is provided with a resin sealing portion and lead drawing portions. The resin sealing portion integrally seals a power control semiconductor element chip, an firing light-receiving element chip for firing the power control semiconductor element chip, and a light-emitting element chip optically coupled with the firing light-receiving element, for converting an electric signal into an optical signal. The lead drawing portions are connected to the power control semiconductor element chip, the firing light-receiving element, and the light-emitting element chip, and are drawn out of the resin sealing portion. The optically coupled semiconductor device is further provided with a U-shaped radiator having extended portions that extend in an extending direction intersecting a drawing direction of the lead drawing portions and that are operable to hold the resin sealing portion therebetween.

    Abstract translation: 在本发明的光耦合半导体器件的实施例中，光耦合半导体器件设置有树脂密封部分和引线引出部分。 树脂密封部分一体地密封功率控制半导体元件芯片，用于点燃功率控制半导体元件芯片的点火光接收元件芯片和与点火光接收元件光学耦合的发光元件芯片，用于转换电 信号变成光信号。 引线部分连接到功率控制半导体元件芯片，点火光接收元件和发光元件芯片，并从树脂密封部分拉出。 所述光耦合半导体器件还具有U形散热器，所述U形散热器具有延伸部分，所述延伸部分沿与所述引线引导部分的拉出方向相交的延伸方向延伸，并且可操作以将所述树脂密封部分保持在其间。

    SHIELDING APPARATUS FOR ELECTRONIC DEVICE
    26.
    发明申请
    SHIELDING APPARATUS FOR ELECTRONIC DEVICE 失效
    电子设备的屏蔽装置

    公开(公告)号：US20050194171A1

    公开(公告)日：2005-09-08

    申请号：US10833788

    申请日：2004-04-27

    Applicant: Hui-Tsang Chang

    Inventor： Hui-Tsang Chang

    IPC: H05K9/00 ,  H05K1/02 ,  H05K5/02

    CPC classification number: H05K1/0243 ,  H05K2201/10295 ,  H05K2201/10371 ,  H05K2201/10386

    Abstract: A shielding apparatus for an electric device comprises a first lead, a second lead and an inverted U-shaped cover, constituting a metallic inserting component. The first and second leads insert into two sides of the electric device, respectively, and electrically connect with a ground terminal of a circuit board. The inverted U-shaped cover contacts with the top of a metallic shell of the electric device and clips on the two sides of the metallic shell. Functionally, the metallic inserting component can reduce noises from electromagnetic interference, and tightly fix on the metallic shell without electrical welding so that the reliability of assembly will be improved.

    Abstract translation: 电气装置的屏蔽装置包括构成金属插入部件的第一引线，第二引线和倒U形盖。 第一和第二引线分别插入电气设备的两侧，并与电路板的接地端子电连接。 倒置的U形盖与电气设备的金属外壳的顶部接触，并在金属外壳的两侧夹紧。 在功能上，金属插入部件可以减少电磁干扰的噪音，并且在没有电焊的情况下紧紧地固定在金属外壳上，从而提高组装的可靠性。

    Converter device
    28.
    发明授权
    Converter device 失效
    转换器设备

    公开(公告)号：US06813163B2

    公开(公告)日：2004-11-02

    申请号：US10209593

    申请日：2002-08-01

    Applicant: Keiji Inoue ,  Yosuo Ohashi

    Inventor： Keiji Inoue ,  Yosuo Ohashi

    IPC: H05K111

    CPC classification number: H05K1/144 ,  H05K1/029 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10416 ,  Y10T307/492

    Abstract: A plurality of converter circuits is connected in parallel while reducing conduction loss. A converter circuit is formed on each of a plurality of circuit boards, and a plurality of types of terminal connection patterns containing power input terminal connection patterns and power output terminal connection patterns are formed on the end portions of each of the circuit boards with the disposition positions substantially matching each other. The terminal connection patterns at the same position of each circuit board are sandwiched by each of clips of a common terminal member, each of the circuit boards is laminated and fixed, and the converter circuits of each of the circuit boards are connected in parallel. The conduction path for electrically connecting the converter circuit of each circuit board becomes short, making it possible to reduce conduction loss. Also, it is possible to mount a plurality of converter circuits without increasing the occupied area of a motherboard to be mated therewith in comparison with a case in which the circuit boards are provided side-by-side.

    Abstract translation: 多个转换器电路并联连接，同时减少传导损耗。 A转换器电路形成在多个电路板中的每一个上，并且在每个电路板的端部上形成包含电力输入端子连接图案和功率输出端子连接图案的多种类型的端子连接图案，其配置 位置基本上彼此匹配。 每个电路板的相同位置处的端子连接图案被公共端子构件的每个夹子夹持，每个电路板被层压和固定，并且每个电路板的转换器电路并联连接。 用于电连接每个电路板的转换器电路的传导路径变短，使得可以减少传导损耗。 此外，与并排设置电路板的情况相比，可以安装多个转换器电路而不增加与其配合的母板的占用面积。

    Mounting structure for module substrates
    30.
    发明授权
    Mounting structure for module substrates 有权
    模块底板的安装结构

    公开(公告)号：US06801440B2

    公开(公告)日：2004-10-05

    申请号：US09995643

    申请日：2001-11-29

    Applicant: Keiji Inoue ,  Yasuo Ohashi ,  Toru Yoshikawa

    Inventor： Keiji Inoue ,  Yasuo Ohashi ,  Toru Yoshikawa

    IPC: H05K111

    CPC classification number: H05K1/144 ,  H05K1/0269 ,  H05K1/141 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/09409 ,  H05K2201/10386 ,  H05K2203/082 ,  H05K2203/1572 ,  H05K2203/161 ,  H05K2203/168

    Abstract: A plurality of module substrates have circuit boards, respectively. The circuit boards are stacked with a space therebetween, and are connected to first end portions of connecting members. The second end portions of the connecting members are connected to connecting pads disposed on a motherboard. The module substrates are thus stacked and mounted on the motherboard so as to increase the mounting density. By causing the connecting members for the upper circuit board to project further than the connecting members for the lower circuit board, the connecting members for the upper and lower circuit boards are prevented from touching each other.

    Abstract translation: 多个模块基板分别具有电路板。 电路板在它们之间堆叠起来，并连接到连接件的第一端部。 连接构件的第二端部连接到设置在母板上的连接垫。 因此，模块基板堆叠并安装在母板上，以增加安装密度。 通过使上部电路基板的连接部件比下部电路基板的连接部件进一步突出，能够防止上下电路基板的连接部件相互接触。

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