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    KEYBOARD
    22.
    发明申请
    KEYBOARD 有权

    公开(公告)号：US20180122596A1

    公开(公告)日：2018-05-03

    申请号：US15410943

    申请日：2017-01-20

    Applicant: PRIMAX ELECTRONICS LTD.

    Inventor： Chien-Hung Liu

    IPC: H01H13/81 ,  H01H3/12 ,  H01H13/52 ,  H05K1/18

    CPC classification number: H01H13/81 ,  H01H3/12 ,  H01H13/52 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10507

    Abstract: A keyboard includes a base plate, a pressure sensing layer, plural key structures, a circuit board, a flexible layer and a controlling unit. The pressure sensing layer is disposed on the base plate and located under the circuit board. The flexible layer is disposed on the pressure sensing layer and located under the circuit board. While a key structure is depressed, a part of the key structure is penetrated through the circuit board to press the flexible layer, and a force is transmitted from the flexible layer to the pressure sensing layer. The controlling unit compares the force with a predetermined force value. According to the comparing result, the controlling unit generates a corresponding pressure sensing signal. Consequently, the use of a single key structure can achieve the functions of multiple keys.

    VEHICLE-MOUNTED ANTENNA DEVICE
    25.
    发明申请
    VEHICLE-MOUNTED ANTENNA DEVICE 有权
    车载安装天线装置

    公开(公告)号：US20150229021A1

    公开(公告)日：2015-08-13

    申请号：US14425277

    申请日：2013-06-20

    Applicant: DENSO CORPORATION

    Inventor： Yasumune Yukizaki ,  Tadao Suzuki ,  Ryohei Kataoka ,  Yuji Sugimoto

    IPC: H01Q1/32 ,  H01Q1/24 ,  H01Q1/42 ,  H05K1/18 ,  H05K5/00

    CPC classification number: H01Q1/3275 ,  H01Q1/02 ,  H01Q1/241 ,  H01Q1/42 ,  H01Q9/42 ,  H05K1/181 ,  H05K5/003 ,  H05K2201/10098 ,  H05K2201/10507

    Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on a surface of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section implemented on the board at a position away from the base in the first direction.

    Abstract translation: 车载天线装置包括基座，板，电路部分和壳体。 基座可安装在车辆的屋顶上。 该电路板具有天线元件部分，并且站在基座的表面上。 电路部分用作电连接到天线元件部分的无线通信电路的至少一部分。 壳体由树脂材料制成并形成车辆外形的突起。 板和电路部分位于由基座和壳体形成的空间中。 板位于基座的表面上，使得垂直于基座表面的第一方向与等于板的厚度方向的第二方向不同。 电路部分在基板上在第一方向上远离基座的位置处实现。

    INTEGRATED CIRCUIT STRUCTURES HAVING OFF-AXIS IN-HOLE CAPACITOR AND METHODS OF FORMING
    26.
    发明申请
    INTEGRATED CIRCUIT STRUCTURES HAVING OFF-AXIS IN-HOLE CAPACITOR AND METHODS OF FORMING 有权
    具有离轴孔内电容器的集成电路结构及其形成方法

    公开(公告)号：US20150195914A1

    公开(公告)日：2015-07-09

    申请号：US14147225

    申请日：2014-01-03

    Applicant: International Business Machines Corporation

    Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

    IPC: H05K1/18 ,  H05K3/30 ,  H05K1/02

    CPC classification number: H05K1/183 ,  H05K1/0231 ,  H05K1/11 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/09645 ,  H05K2201/10015 ,  H05K2201/10507 ,  Y02P70/611 ,  Y10T29/49135

    Abstract: Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (IC) structure includes: a substrate layer having an upper surface; an IC chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the IC chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the IC chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the IC chip.

    Abstract translation: 各种实施例包括具有离轴孔内电容器的集成电路结构。 在一些实施例中，集成电路（IC）结构包括：具有上表面的基底层; 至少部分地包含在所述衬底层内并与垂直于所述衬底层的上表面的短轴对准的IC芯片; 所述基板层中的孔，所述孔与所述IC芯片物理分离; 以及孔中的电容器，并且至少部分地包含在所述衬底层内，所述电容器与所述IC芯片物理隔离，其中所述电容器与垂直于所述衬底层的上表面的轴线对准，并且偏离所述衬底层的短轴 IC芯片。

    Panel with Electric Devices
    27.
    发明申请
    Panel with Electric Devices 有权
    电气设备面板

    公开(公告)号：US20140355220A1

    公开(公告)日：2014-12-04

    申请号：US14464006

    申请日：2014-08-20

    Applicant: Ambianti B.V.

    Inventor： Georgios Metaxas

    IPC: H05K1/02

    CPC classification number: H05K1/0292 ,  G06F3/1446 ,  G09G3/20 ,  G09G3/2085 ,  G09G3/2088 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2310/0278 ,  G09G2310/0281 ,  G09G2330/08 ,  G09G2340/0492 ,  G09G2360/141 ,  G09G2370/18 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/09972 ,  H05K2201/10507

    Abstract: A panel of rectangular shape comprising a plurality of electric devices spread over the panel, a control unit including a microprocessor and a power supply, drivers for driving the electric devices based on control information received from the control unit and electric wiring connecting the control unit, the drivers and the electric devices, the shape of the panel being adaptable by removing one or more parts of the panel by cutting, sawing, milling, drilling or other suitable methods, wherein the control unit and the drivers are positioned closer to a first side of the panel than to a second side opposite the first side. The drivers and electric devices are partitioned into groups that each comprises one driver that exclusively drives the electric devices in that group.

    Abstract translation: 一种矩形形状的面板，包括分布在面板上的多个电气设备，包括微处理器和电源的控制单元，基于从控制单元接收的控制信息和连接控制单元的电线驱动电气设备的驱动器， 驱动器和电气设备，通过切割，锯切，铣削，钻孔或其它合适的方法来移除面板的一个或多个部分来适应面板的形状，其中控制单元和驱动器位于更靠近第一侧 与第一侧相对的第二侧。 驱动器和电气设备被分成组，每个组包括专门驱动该组中的电气设备的一个驱动器。

    MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED CIRCUIT COMPONENT WITHIN A SUPPORT STRUCTURE OF THE PACKAGE
    28.
    发明申请
    MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED CIRCUIT COMPONENT WITHIN A SUPPORT STRUCTURE OF THE PACKAGE 有权
    在包装的支持结构中制造包括嵌入式电路组件的半导体封装

    公开(公告)号：US20130122658A1

    公开(公告)日：2013-05-16

    申请号：US13296707

    申请日：2011-11-15

    Applicant: Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

    Inventor： Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

    IPC: H01L21/56

    CPC classification number: H05K1/183 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/095 ,  H05K2201/10492 ,  H05K2201/10507 ,  H01L2924/00

    Abstract: A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

    Abstract translation: 提供了一种方法和装置，其中空腔形成在支撑结构中，支撑结构可操作以支撑半导体器件，将电路元件的至少一部分设置在支撑结构中的空腔中，将空腔填充在 支撑结构，其具有不导电的填充材料，以至少部分地围绕电路元件与非导电填充材料，并将半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。

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