公开(公告)号：US10589310B2

公开(公告)日：2020-03-17

申请号：US15502886

申请日：2015-08-12

Applicant: KAHLA THÜRINGEN PORZELLAN GMBH ,  TOMABOND GMBH

Inventor： Tobias Stephan Maier ,  Holger Raithel

IPC: B05D1/00 ,  B05D1/02 ,  B05C13/00 ,  B05C13/02 ,  B05B13/02 ,  B05D1/18

Abstract: The invention relates to a device for arranging objects in particular tableware, in a system for coating including a base element, an adapter element and a support element, each of which are designed in such a manner that they can be plugged together in a direction (z). In the plugged-together state, the adapter element is arranged between the base element and the support element with the object disposed in a predetermined position on the adapter element. The adapter element, the base element and the support element are locked relative to one another with the object in such a manner that only a relative movement in the direction (z) is possible amongst each other. The invention further relates to a method for the arrangement of objects, in particular tableware with the device, in a system for coating.

公开(公告)号：US10537273B2

公开(公告)日：2020-01-21

申请号：US16504636

申请日：2019-07-08

Applicant: SIO2 MEDICAL PRODUCTS, INC.

Inventor： John T. Felts ,  Thomas E. Fisk ,  Robert S. Abrams ,  John Ferguson ,  Jonathan R. Freedman ,  Robert J. Pangborn ,  Peter J. Sagona

IPC: A61L31/10 ,  A61B5/15 ,  C23C16/505 ,  C23C16/52 ,  C23C16/54 ,  G01N33/00 ,  A61B5/154 ,  A61L31/14 ,  C23C16/04 ,  C23C16/50 ,  G01N23/2273 ,  C23C16/458 ,  G01N15/08 ,  G01N30/72 ,  A61L31/08 ,  B05C13/02 ,  C23C16/40 ,  B23Q7/04 ,  B05C13/00 ,  B23Q7/14

Abstract: Methods for processing a vessel, for example to provide a gas barrier or lubricity, are disclosed. First and second PECVD or other vessel processing stations or devices and a vessel holder comprising a vessel port are provided. An opening of the vessel can be seated on the vessel port. The interior surface of the seated vessel can be processed via the vessel port by the first and second processing stations or devices. Vessel barrier and lubricity coatings and coated vessels, for example syringes and medical sample collection tubes are disclosed. A vessel processing system is also disclosed.

公开(公告)号：US20190304825A1

公开(公告)日：2019-10-03

申请号：US16443185

申请日：2019-06-17

Applicant: Applied Materials, Inc.

Inventor： Dale R. Du BOIS ,  Juan Carlos ROCHA-ALVAREZ ,  Sanjeev BALUJA ,  Ganesh BALASUBRAMANIAN ,  Lipyeow YAP ,  Jianhua ZHOU ,  Thomas NOWAK

IPC: H01L21/68 ,  H01L21/687 ,  H01L21/67 ,  H01L21/324 ,  B05C13/00 ,  H01J37/32 ,  C23C16/458

Abstract: A method and apparatus for heating a substrate in a chamber are provided. an apparatus for positioning a substrate in a processing chamber. In one embodiment, the apparatus comprises a substrate support assembly having a support surface adapted to receive the substrate and a plurality of centering fingers for supporting the substrate at a distance parallel to the support surface and for centering the substrate relative to a reference axis substantially perpendicular to the support surface. The plurality of the centering fingers are movably disposed along a periphery of the support surface, and each of the plurality of centering fingers comprises a first end portion for either contacting or supporting a peripheral edge of the substrate.

公开(公告)号：US10328446B2

公开(公告)日：2019-06-25

申请号：US15363176

申请日：2016-11-29

Applicant: Shawcor Ltd.

Inventor： Brian Baker

IPC: B05B13/06 ,  B05C9/14 ,  B05D7/14 ,  B05C5/02 ,  C21D1/667 ,  C21D9/08 ,  F27D9/00 ,  B05D3/00 ,  B05C13/00 ,  B29C35/16 ,  B29L23/00

Abstract: An internal quench system for cooling pipes being coated is provided. The system comprises an internal quench lance having spray nozzles configured at one end of the internal quench lance. There is also provided wheels and retractable supports to support the internal quench lance without hindering the movement of the pipes. Each retract support is provided with a liquid coolant supplying means to provide liquid coolant to the internal quench lance. A process for using the internal quench system for cooling pipes being coated is also provided.

公开(公告)号：US10307724B2

公开(公告)日：2019-06-04

申请号：US15200408

申请日：2016-07-01

Applicant: Centrillion Technology Holdings Corporation

Inventor： Filip Crnogorac ,  Glenn McGall ,  Bolan Li

IPC: B05D3/12 ,  B01J19/00 ,  G03F7/16 ,  B05C11/02 ,  B05C11/08 ,  B05C11/10 ,  B05C13/00 ,  B05D1/00 ,  G03F7/30 ,  C40B50/18 ,  C40B60/14

Abstract: The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 μm to 2 mm.

公开(公告)号：US10290521B2

公开(公告)日：2019-05-14

申请号：US14952657

申请日：2015-11-25

Applicant: SCREEN Semiconductor Solutions Co., Ltd.

Inventor： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC: H01L21/67 ,  B05C13/02 ,  H01L23/34 ,  B05C13/00 ,  G03F7/26 ,  B05D3/04 ,  B05B14/43 ,  B05B14/44

Abstract: A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

公开(公告)号：US10257887B2

公开(公告)日：2019-04-09

申请号：US15840759

申请日：2017-12-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Alexander Matyushkin ,  Dan Katz ,  John Holland ,  Theodoros Panagopoulos ,  Michael D. Willwerth

IPC: B05C13/00 ,  H05B3/00 ,  H01L21/67 ,  H01L21/683

Abstract: A substrate support assembly comprises a ceramic puck comprising a substrate receiving surface, and having embedded therein: (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils. A compliant layer bonds the ceramic puck to a base, the compliant layer comprising a silicon material. The base comprises a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus.

公开(公告)号：US10195640B2

公开(公告)日：2019-02-05

申请号：US15196468

申请日：2016-06-29

Applicant: Building Materials Investment Corporation

Inventor： James A. Svec

IPC: B05C9/04 ,  B05C5/02 ,  B05D1/02 ,  B05C13/00 ,  E04D1/12 ,  B05C9/06 ,  E04D1/00 ,  E04D1/20 ,  B05C5/00

Abstract: A method for applying coating material to a moving substrate such as a glass mat web in shingle manufacturing includes conveying the web through a narrow channel and ejecting at least one coating material onto at least one surface of the web as it is conveyed through the channel. In a preferred embodiment, multiple coating materials may be applied to one surface of the web and multiple coating materials may be applied to the other surface of the web. The coating materials may be molten asphalt or other coating materials. The pressure of the coating material is controlled as a function of the line speed of the moving substrate to ensure consistently thick coatings at various speeds, including relatively high speeds, of the web. An apparatus in the form of a slot die is disclosed for carrying out the method of the invention.

公开(公告)号：US20180350594A1

公开(公告)日：2018-12-06

申请号：US16055975

申请日：2018-08-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke YOSHIHARA ,  Takafumi NIWA

IPC: H01L21/02 ,  H01L21/67 ,  B05C13/00 ,  G03F7/16 ,  B05C9/12 ,  H01L21/687 ,  B05C11/08

Abstract: A method of forming a coating film includes horizontally supporting a substrate, supplying a coating solution to a central portion of the substrate and spreading the coating solution by a centrifugal force by rotating the substrate at a first rotational speed, decreasing a speed of the substrate from the first rotational speed toward a second rotational speed and rotating the substrate at the second rotational speed to make a surface of a liquid film of the coating solution even, supplying a gas to a surface of the substrate when the substrate is rotated at the second rotational speed to reduce fluidity of the coating solution, and drying the surface of the substrate by rotating the substrate at a third rotational speed faster than the second rotational speed.

公开(公告)号：US10068763B2

公开(公告)日：2018-09-04

申请号：US15350150

申请日：2016-11-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Takafumi Niwa

IPC: H01L21/02 ,  B05C9/12 ,  B05C11/08 ,  B05C13/00 ,  H01L21/687 ,  H01L21/67

Abstract: A method of forming a coating film includes horizontally supporting a substrate, supplying a coating solution to a central portion of the substrate and spreading the coating solution by a centrifugal force by rotating the substrate at a first rotational speed, decreasing a speed of the substrate from the first rotational speed toward a second rotational speed and rotating the substrate at the second rotational speed to make a surface of a liquid film of the coating solution even, supplying a gas to a surface of the substrate when the substrate is rotated at the second rotational speed to reduce fluidity of the coating solution, and drying the surface of the substrate by rotating the substrate at a third rotational speed faster than the second rotational speed.