公开(公告)号：US20020079134A1

公开(公告)日：2002-06-27

申请号：US10028624

申请日：2001-12-20

Inventor： Yutaka Kaneda

IPC: H05K001/16 ,  H05K003/02

CPC classification number: H05K3/0002 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/0166 ,  H05K2201/0367 ,  H05K2203/056 ,  H05K2203/0733 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: In one embodiment, the present invention provides a process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.

Abstract translation: 在一个实施例中，本发明提供一种制造多层挠性布线板的方法，其允许各层布线板精确定位并容易堆叠。 制备用于曝光的掩模，其中与垂直于基板的传送方向P的方向布置与多层柔性布线板的布线板的各层相对应的多个图案孔。 该曝光用掩模用于形成与同一片状基板上的多层柔性布线基板的各层布线基板对应的多个布线图案。

公开(公告)号：US20020066672A1

公开(公告)日：2002-06-06

申请号：US09997665

申请日：2001-11-26

Inventor： Takahiro Iijima ,  Akio Rokugawa ,  Yasuyoshi Horikawa

IPC: H05K003/00 ,  C25D005/02 ,  C25D005/48

CPC classification number: H05K3/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/005 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/426 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0108

Abstract: A resin plate having wiring pattern recesses and via through holes is made. All of the surfaces of the resin plate including inner walls of said wiring pattern recesses and via through holes are coated with a metal film. An electroplating is applied using the metal film as a power-supply layer to fill a plated metal into the wiring pattern recesses and via through holes. The metal film formed on the resin plate except for the inner walls of the wiring pattern recesses and via through holes is removed, so that wiring pattern and via are exposed on a surface the same as that of the resin plate.

Abstract translation: 制成具有布线图形凹部和通孔的树脂板。 包括所述布线图案凹槽的内壁和通孔的树脂板的所有表面均涂覆有金属膜。 使用金属膜作为电源层施加电镀，以将电镀金属填充到布线图案凹部中并经由通孔。 去除了除了布线图形凹部和通路孔的内壁之外的树脂板上形成的金属膜，使得布线图案和通路露出在与树脂板相同的表面上。

公开(公告)号：US20020066590A1

公开(公告)日：2002-06-06

申请号：US10000010

申请日：2001-12-04

Inventor： Aharon Korem

IPC: H05K001/00 ,  H05K003/00 ,  H01R009/00

CPC classification number: H01R13/2414 ,  B41J2/14072 ,  H01R12/592 ,  H01R12/61 ,  H05K1/095 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  Y10T29/49147

Abstract: According to some embodiments of the present invention, a connectable electronic component-carrying board is provided. The connectable electronic board comprises at least one resilient conductive element integrally molded onto at least part of a contact of the connectable board. The resilient conductive element is able to provide an electrical pathway between the contact it is molded to and a corresponding contact on another electronic component-carrying board. A method of fabricating the connectable electronic component-carrying board is also provided.

Abstract translation: 根据本发明的一些实施例，提供了一种可连接的电子部件承载板。 可连接电子板包括至少一个弹性导电元件，其一体地模制在可连接板的触点的至少一部分上。 弹性导电元件能够在其被模制的触点与另一个电子元件承载板上的相应触点之间提供电路径。 还提供了制造可连接电子部件承载板的方法。

公开(公告)号：US06396665B1

公开(公告)日：2002-05-28

申请号：US09483497

申请日：2000-01-14

Applicant: Takahiro Asano

Inventor： Takahiro Asano

IPC: G11B548

CPC classification number: G11B5/4833 ,  G11B5/484 ,  G11B5/486 ,  H05K3/3457 ,  H05K3/363 ,  H05K3/4092 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09181 ,  H05K2201/09663

Abstract: A plurality of connecting pads are provided at an extended end portion of a main FPC, and a solder bump is formed on each connecting pad. A plurality of openings corresponding to the solder bumps are formed on a connecting end portion of a relay FPC. Second electrode pads of the connecting end portion project into the respective openings so as to close a part of each opening. Each of the second electrode pads contacts with the corresponding bump through the opening. By directly heating the second electrode pad through the opening, so that the solder bump is melted and each electrode pad is soldered to the corresponding connecting pad.

Abstract translation: 多个连接焊盘设置在主FPC的延伸端部，并且在每个连接焊盘上形成焊料凸块。 在继电器FPC的连接端部形成有与焊料凸块对应的多个开口部。 连接端部的第二电极焊盘突出到相应的开口中，以封闭每个开口的一部分。 每个第二电极焊盘通过开口与相应的凸块接触。 通过直接加热第二电极焊盘穿过开口，使得焊料凸块熔化，每个电极焊盘焊接到相应的连接焊盘。

公开(公告)号：US06395993B1

公开(公告)日：2002-05-28

申请号：US09671260

申请日：2000-09-28

Applicant: Masayuki Nakamura ,  Mitsuhiro Fukuda

Inventor： Masayuki Nakamura ,  Mitsuhiro Fukuda

IPC: H05K100

CPC classification number: H05K3/4635 ,  H01L2224/16237 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/099

Abstract: The present invention aims to manufacture a reliable multilayer flexible wiring board at high yield. Flexible wiring board 10 used for multilayer flexible wiring board 40 of the present invention has metal coating 14 on the surface of metal wiring film 19, and metal coating 14 is exposed within the contact region. A wall member rising above the surface of metal coating 14 is provided around the exposed metal coating 14. The wall member is formed of wall face 23 of opening 17 in resin film 15 at the top of metal wiring film 19, for example. When bump 34 having low-melting metal coating 36 is contacted with metal coating 14 in said contact region and heated above the melting point of the solder metal under pressure, low-melting metal coating 36 melts. The molten low-melting metal is stopped by wall face 23 from overflowing outside the contact region so that any bridge cannot be formed by the solder metal between metal wiring film 19.

Abstract translation: 本发明旨在以高产量制造可靠的多层柔性布线板。用于本发明的多层柔性布线板40的柔性布线板10在金属布线膜19的表面上具有金属涂层14，金属涂层14暴露 在接触区域内。 在露出的金属涂层14周围设置有在金属涂层14的上方上升的壁部件。壁部件例如由金属布线膜19的顶部的树脂膜15的开口17的壁面23形成。 当具有低熔点金属涂层36的凸块34与所述接触区域中的金属涂层14接触并在压力下加热到焊料金属的熔点以上时，低熔点金属涂层36熔化。 熔融的低熔点金属被壁面23阻止在接触区域外部溢出，使得任何桥接件不能由金属布线膜19之间的焊料金属形成。

公开(公告)号：US20020039847A1

公开(公告)日：2002-04-04

申请号：US09912111

申请日：2001-07-23

Inventor： Gary A. Clayton

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H01R13/2414 ,  G01R1/0466 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/027 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A grid interposer for testing electrical circuits and a method of making a grid interposer. The grid interposer includes upper and lower conductive surfaces sandwiched on either side of an insulating later, connected to each other by a plurality of vias filled with conductive material. The conductive surfaces are flat topped, and incised with a grid of flat topped peaks which are small enough to cut through oxidation of electrical contacts, and ensure good electrical contact with a variety of electrode shapes.

Abstract translation: 用于测试电路的栅格插入器和制作栅格插入器的方法。 栅格插入件包括夹在绝缘层之后的任一侧的上下导电表面，通过填充有导电材料的多个通孔彼此连接。 导电表面是平坦的，并且具有平坦的顶部峰的栅格，该栅格足够小以切割电触点的氧化，并且确保与各种电极形状的良好的电接触。

公开(公告)号：US20020033532A1

公开(公告)日：2002-03-21

申请号：US09877252

申请日：2001-06-11

Inventor： Jiun-Han Wu ,  Tzeng-Shii Tsai ,  Po-Cheng Chen

IPC: H01L023/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09709 ,  H01L2924/00

Abstract: An electrode bonding structure is disclosed for reducing the thermal expansion of a circuit board during the bonding process of the circuit board and a substrate of a flat display. The electrode bonding structure includes a substrate, a circuit board, and an anisotropic conductive film ACF. A substrate dielectric layer and an indenting pad are formed on the surface of the substrate, and the inner surface of the indenting pad is lower than the surface of the substrate dielectric layer by an indenting depth H3. The circuit board is placed parallel to the substrate, and a circuit dielectric layer and a bump pad are formed on the surface of the circuit board. The bump pad is higher than the surface of the circuit dielectric layer by a height H1. The ACF is placed between the substrate and the circuit board, and the thickness of the ACF is a thickness H2. The position of the indenting pad is corresponded to that of the bump pad, and the height H1 is not less than the sum of the thickness H2 and the depth H3, that is, H1>nullH2nullH3. The thermal expansion of the circuit board can be reduced during the bonding process of the substrate and the circuit board and the quality of the display can also be improved.

Abstract translation: 公开了一种用于在电路板和平板显示器的基板的接合工艺期间减小电路板的热膨胀的电极接合结构。 电极接合结构包括基板，电路板和各向异性导电膜ACF。 衬底介电层和压痕焊盘形成在衬底的表面上，并且压痕焊盘的内表面通过凹陷深度H3低于衬底介质层的表面。 电路板与基板平行放置，并且在电路板的表面上形成电路介质层和凸块焊盘。 凸块焊盘比电路电介质层的表面高一个高度H1。 ACF被放置在基板和电路板之间，ACF的厚度为厚度H2。 压痕垫的位置对应于凸块焊盘的位置，高度H1不小于厚度H2和深度H3的总和，即H1> = H2 + H3。 在基板和电路板的接合工艺期间，可以减少电路板的热膨胀，并且还可以提高显示器的质量。

公开(公告)号：US20020022383A1

公开(公告)日：2002-02-21

申请号：US09908545

申请日：2001-07-20

Inventor： Tsuyoshi Sakata ,  Takashi Nagawatari

IPC: H05K001/00

CPC classification number: H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H05K1/095 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378

Abstract: A compression connector (10) comprises an insulation sheet (11) having a plurality of retention holes, a plurality of elastic contacts (12) provided in the retention holes to make elastic contact with a pair of boards (20) and (30) and a printed line (13) provided on at least one face of the insulation sheet (11) to connect the elastic contacts (12).

Abstract translation: 压缩连接器（10）包括具有多个保持孔的绝缘片（11），设置在保持孔中以与一对板（20）和（30）弹性接触的多个弹性触点（12），以及 设置在所述绝缘片（11）的至少一个面上以连接所述弹性接触件（12）的印刷线（13）。

公开(公告)号：US06340894B1

公开(公告)日：2002-01-22

申请号：US08947087

申请日：1997-10-08

Applicant: Warren M. Farnworth ,  Alan G. Wood ,  Trung Tri Doan ,  David R. Hembree

Inventor： Warren M. Farnworth ,  Alan G. Wood ,  Trung Tri Doan ,  David R. Hembree

IPC: G01R3102

CPC classification number: H05K3/4007 ,  G01R1/0466 ,  G01R1/0483 ,  G01R3/00 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/16195 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A die contacting substrate establishes ohmic contact with the die by means of raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. The arrangement may be used for establishing electrical contact and with a burn-in oven and with a discrete die tester. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. A Z-axis anisotropic conductive interconnect material may be interposed between the die attachment surface and the die.

Abstract translation: 模具接触衬底通过接触构件上的凸起部分与模具建立欧姆接触。 凸起部分的尺寸被设计成使得对模具施加到基板上的压缩力导致接触构件有限地渗透到粘合垫中。 该装置可以用于建立电接触以及使用老化烘箱和离散模具测试仪。 这允许在组装之前对模具进行表征，从而可以以未包装的形式转移模具。 Z轴各向异性导电互连材料可以插入在模具附接表面和模具之间。

公开(公告)号：US20010054771A1

公开(公告)日：2001-12-27

申请号：US09935494

申请日：2001-08-23

Inventor： James M. Wark ,  Salman Akram

IPC: H01L023/48 ,  H01L023/52

CPC classification number: H01L24/10 ,  G01R1/06738 ,  H01L22/34 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10734 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.

Abstract translation: 公开了凸起的半导体器件接触结构，其包括至少一个非平面接触焊盘，其具有从其延伸的多个突起，用于接触凸起的集成电路（IC）器件的至少一个焊球，例如凸起的裸片和凸起的封装 IC设备。 突起被布置成与凸起的IC器件的焊球电接触，而不会使焊球基本上变形。 因此，本发明的接触焊盘不需要焊球的回流以重新形成焊球。 这样的接触垫可以设置在诸如探针等的各种测试设备上，并且可以用于临时和永久连接。 还公开了通过蚀刻和沉积形成接触焊盘的改进方法。