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    Capacitive acceleration sensor with a bending elastic beam and preparation method thereof
    33.
    发明授权
    Capacitive acceleration sensor with a bending elastic beam and preparation method thereof 有权

    公开(公告)号：US09625487B2

    公开(公告)日：2017-04-18

    申请号：US14387364

    申请日：2012-12-04

    Applicant: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES

    Inventor： Lufeng Che ,  Xiaofeng Zhou ,  Yuelin Wang

    IPC: G01P15/125 ,  B81C1/00 ,  G01P15/08

    CPC classification number: G01P15/125 ,  B81C1/00341 ,  B81C1/00531 ,  G01P2015/0871 ,  G01P2015/0882

    Abstract: The present invention provides a capacitive acceleration sensor with a bending elastic beam and a preparation method. The sensor at least includes a first electrode structural layer, a middle structural layer and a second electrode structural layer; wherein the first electrode structural layer and the second electrode structural layer are provided with an electrode lead via-hole, respectively; the middle structural layer includes: a frame formed on a SOI silicon substrate with a double device layers, a seismic mass whose double sides are symmetrical and a bending elastic beam with one end connected to the frame and the other end connected to the seismic mass, wherein anti-overloading bumps and damping grooves are symmetrically provided on two sides of the seismic mass, and the bending elastic beams at different planes are staggered distributed and are not overlapped with each other in space. Since the bending times, the total length and the total width of the bending elastic beam can be prepared as needed, capacitive acceleration sensors with different sensitivities can be manufactured according to the present invention, and the manufacturing has high flexibility.

    Mechanical Low Pass Filter for Motion Sensors
    34.
    发明申请
    Mechanical Low Pass Filter for Motion Sensors 审中-公开

    公开(公告)号：US20170089942A1

    公开(公告)日：2017-03-30

    申请号：US14866378

    申请日：2015-09-25

    Applicant: Apple Inc.

    Inventor： Kuan-Lin Chen ,  Yun-Ju Lai

    IPC: G01P15/08 ,  G01C19/5783 ,  G01P15/097

    CPC classification number: G01P15/0802 ,  G01C19/5783 ,  G01P15/08 ,  G01P2015/0882

    Abstract: Mechanical low pass filters for motion sensors and methods for making same are disclosed. In some implementations, a motion sensor package comprises: a substrate; one or more mechanically compliant dampers formed on the substrate; one or more mechanically compliant metal springs formed on the one or more dampers and the substrate; and a sensor stack attached to the one or more metal springs, wherein the one or more metal springs and dampers provide a mechanical suspension system having a resonant frequency that is higher than a sensing bandwidth of a motion sensor in the sensor stack and lower than a resonant frequency of the motion sensor.

    FORCE FEEDBACK ELECTRODES IN MEMS ACCELEROMETER
    35.
    发明申请
    FORCE FEEDBACK ELECTRODES IN MEMS ACCELEROMETER 有权
    力学反馈电极在MEMS加速度计

    公开(公告)号：US20160202366A1

    公开(公告)日：2016-07-14

    申请号：US14295080

    申请日：2014-06-03

    Applicant: PGS Geophysical AS ,  Agency for Science Technology and Research (A*STAR)

    Inventor： Ilker Ender Ocak ,  Chengliang Sun ,  Julius Ming-Lin Tsai ,  Sanchitha Nirodha Fernando

    IPC: G01V1/18 ,  G01P15/125 ,  G01V1/09 ,  G01V1/38

    CPC classification number: G01V1/18 ,  G01P15/125 ,  G01P15/131 ,  G01P2015/0837 ,  G01P2015/0862 ,  G01P2015/0882 ,  G01V1/09 ,  G01V1/38

    Abstract: A microelectromechanical system (MEMS) accelerometer having separate sense and force-feedback electrodes is disclosed. The use of separate electrodes may in some embodiments increase the dynamic range of such devices. Other possible advantages include, for example, better sensitivity, better noise suppression, and better signal-to-noise ratio. In one embodiment, the accelerometer includes three silicon wafers, fabricated with sensing electrodes forming capacitors in a fully differential capacitive architecture, and with separate force feedback electrodes forming capacitors for force feedback. These electrodes may be isolated on a layer of silicon dioxide. In some embodiments, the accelerometer also includes silicon dioxide layers, piezoelectric structures, getter layers, bonding pads, bonding spacers, and force feedback electrodes, which may apply a restoring force to the proof mass region. MEMS accelerometers with force-feedback electrodes may be used in geophysical surveys, e.g., for seismic sensing or acoustic positioning.

    Abstract translation: 公开了具有分离的感测和力反馈电极的微机电系统（MEMS）加速计。 在一些实施例中，单独电极的使用可以增加这种装置的动态范围。 其他可能的优点包括例如更好的灵敏度，更好的噪声抑制和更好的信噪比。 在一个实施例中，加速度计包括三个硅晶片，由感应电极制成，其形成全差分电容结构的电容器，并且具有单独的力反馈电极，形成用于力反馈的电容器。 这些电极可以分离在二氧化硅层上。 在一些实施例中，加速度计还包括二氧化硅层，压电结构，吸气剂层，接合垫，粘合间隔物和力反馈电极，其可以对检测质量区域施加恢复力。 具有力反馈电极的MEMS加速度计可用于地球物理勘测，例如用于地震检测或声学定位。

    Method for manufacturing a micromechanical structure, and micromechanical structure
    37.
    发明授权
    Method for manufacturing a micromechanical structure, and micromechanical structure 有权
    微机械结构的制造方法和微机械结构

    公开(公告)号：US08956544B2

    公开(公告)日：2015-02-17

    申请号：US13586226

    申请日：2012-08-15

    Applicant: Johannes Classen ,  Jochen Reinmuth ,  Sebastian Guenther ,  Pia Bustian-Todorov

    Inventor： Johannes Classen ,  Jochen Reinmuth ,  Sebastian Guenther ,  Pia Bustian-Todorov

    IPC: C23F1/00 ,  G01C19/5783 ,  B81C1/00 ,  G01P15/08

    CPC classification number: G01C19/5783 ,  B81B2201/025 ,  B81C1/00182 ,  G01P15/0802 ,  G01P2015/0882

    Abstract: A method for manufacturing a micromechanical structure, and a micromechanical structure. The micromechanical structure encompasses a first micromechanical functional layer, made of a first material, that comprises a buried conduit having a first end and a second end; a micromechanical sensor structure having a cap in a second micromechanical functional layer that is disposed above the first micromechanical functional layer; an edge region in the second micromechanical functional layer, such that the edge region surrounds the sensor structure and defines an inner side containing the sensor structure and an outer side facing away from the sensor structure; such that the first end is located on the outer side and the second end on the inner side.

    Abstract translation: 微机械结构的制造方法和微机械结构。 微机械结构包括由第一材料制成的第一微机械功能层，其包括具有第一端和第二端的埋管; 微机械传感器结构，其具有位于第一微机械功能层上方的第二微机械功能层中的盖; 所述第二微机械功能层中的边缘区域使得所述边缘区域围绕所述传感器结构并限定包含所述传感器结构的内侧和远离所述传感器结构的外侧; 使得第一端位于内侧的外侧和第二端。

    MICROPATTERNED COMPONENT AND METHOD FOR MANUFACTURING A MICROPATTERNED COMPONENT
    38.
    发明申请
    MICROPATTERNED COMPONENT AND METHOD FOR MANUFACTURING A MICROPATTERNED COMPONENT 有权
    用于制造微波组件的微波组件和方法

    公开(公告)号：US20140339654A1

    公开(公告)日：2014-11-20

    申请号：US14120386

    申请日：2014-05-14

    Applicant: Johannes Classen

    Inventor： Johannes Classen

    IPC: G01P1/00 ,  G01P15/08

    CPC classification number: G01P1/003 ,  B81B3/0078 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/04 ,  B81B2203/051 ,  G01C19/5755 ,  G01P15/0802 ,  G01P15/0888 ,  G01P15/097 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0877 ,  G01P2015/088 ,  G01P2015/0882

    Abstract: A micropatterned component, for measuring accelerations and/or yaw rates, including a substrate having a principal plane of extension of the substrate, an electrode, and a further electrode; the electrode having a principal plane of extension of the electrode, and the further electrode having a principal plane of extension of the further electrode; the principal plane of extension of the electrode being set parallelly to a normal direction perpendicular to the principal plane of extension of the substrate; the principal plane of extension of the further electrode being set parallelly to the normal direction; the electrode having an electrode height extending in the normal direction; the electrode having a flow channel extending completely through the electrode in a direction parallel to the principal plane of extension of the substrate; the flow channel having a channel depth extending parallelly to the normal direction; the channel depth being less than the electrode height.

    Abstract translation: 用于测量加速度和/或偏转速率的微图案化部件，包括具有基底的主平面延伸的基底，电极和另外的电极; 所述电极具有所述电极的延伸的主平面，并且所述另一电极具有所述另一电极的延伸的主平面; 电极的延伸主平面平行于垂直于衬底延伸主平面的法线方向设置; 另一电极的延伸主平面平行于法线方向设置; 该电极具有沿法线方向延伸的电极高度; 所述电极具有在平行于所述基板的延伸主平面的方向上完全穿过所述电极的流动通道; 所述流路具有平行于所述法线方向延伸的通道深度; 通道深度小于电极高度。

    Electronic damper circuit for MEMS sensors and resonators
    39.
    发明授权
    Electronic damper circuit for MEMS sensors and resonators 有权
    用于MEMS传感器和谐振器的电子阻尼器电路

    公开(公告)号：US08875578B2

    公开(公告)日：2014-11-04

    申请号：US13281928

    申请日：2011-10-26

    Applicant: Eric B. Smith

    Inventor： Eric B. Smith

    IPC: G01P15/13 ,  G01C19/56 ,  G01P15/125 ,  G01C19/5726 ,  G01P15/097 ,  G01P1/00 ,  G01P15/08

    CPC classification number: G01P15/097 ,  G01C19/5726 ,  G01P1/003 ,  G01P15/125 ,  G01P2015/0882

    Abstract: An apparatus includes a microelectromechanical system (MEMS) device including a mass anchored to a substrate. The MEMS device is configured to generate an output signal indicative of motion of the mass with respect to the substrate. The MEMS device includes a feedback module configured to provide a control signal to the MEMS device. The control signal is based on the output signal. The MEMS device is configured to apply a damping force to the mass in response to the control signal.

    Abstract translation: 一种装置包括微机电系统（MEMS）装置，其包括锚定到基板的质量。 MEMS器件被配置为产生指示质量相对于衬底的运动的输出信号。 MEMS器件包括被配置为向MEMS器件提供控制信号的反馈模块。 控制信号基于输出信号。 MEMS器件被配置为响应于控制信号向质量块施加阻尼力。

    ACCELERATION SENSOR
    40.
    发明申请
    ACCELERATION SENSOR 有权
    加速传感器

    公开(公告)号：US20140251013A1

    公开(公告)日：2014-09-11

    申请号：US14350806

    申请日：2012-11-12

    Applicant: FUJI ELECTRIC CO., LTD.

    Inventor： Satoru Sakaue ,  Hironobu Yao ,  Masami Kishiro ,  Takeshi Suzuki

    IPC: G01P15/125

    CPC classification number: G01P15/125 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0871 ,  G01P2015/0882

    Abstract: An acceleration sensor can ensure rigidity of its movable electrode despite a large number of through-holes formed in the movable electrode. The acceleration sensor has an SOI substrate in which a silicon oxide layer is formed on a silicon support layer and an active silicon layer is formed on the silicon oxide layer, wherein the active silicon layer of the SOI substrate has a movable electrode supported by elastic beams and configured with a weight, and also has fixed electrodes disposed in a fixed manner around the movable electrode to face the movable electrode, and wherein through-holes penetrating in a Z-axis direction are formed over the entire surface on the inner side of an outer circumference to which the elastic beams of the movable electrode are connected.

    Abstract translation: 尽管在可移动电极中形成了大量通孔，但是加速度传感器可以确保其可动电极的刚性。 加速度传感器具有在硅载体层上形成氧化硅层的SOI衬底，在氧化硅层上形成活性硅层，其中SOI衬底的有源硅层具有由弹性梁支撑的可动电极 并且配置有重物，并且还具有以可固定的方式设置在可动电极周围的可动电极的固定电极，并且其中在Z轴方向上贯穿的通孔形成在内侧的整个表面上 可动电极的弹性梁连接到的外周。

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