公开(公告)号：US20150282323A1

公开(公告)日：2015-10-01

申请号：US14663921

申请日：2015-03-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi Shimizu ,  Wataru Kaneda ,  Akio Rokugawa

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/0222 ,  H05K1/0225 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/116 ,  H05K3/26 ,  H05K3/381 ,  H05K3/4673 ,  H05K3/4676 ,  H05K2201/0191 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09227 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2203/0514

Abstract: A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

Abstract translation: 布线基板包括形成在芯层的一个表面上的第一布线层，形成在芯层的一个表面上以覆盖第一布线层的第一绝缘层，嵌入第一绝缘层中的通孔布线， 第二布线层，形成在第一绝缘层的第一表面上，以及比形成在第一绝缘层的第一表面上的第一绝缘层更薄的第二绝缘层，以覆盖第二布线层。 第一布线层包括焊盘和设置在焊盘周围的平面层。 通孔布线的一个端面从第一绝缘层的第一表面露出并直接接合到第二布线层。 通孔布线的另一个端面直接接合到第一绝缘层中的焊盘。

公开(公告)号：US20150259489A1

公开(公告)日：2015-09-17

申请号：US14640507

申请日：2015-03-06

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki UMEHARA ,  Hiroharu INOUE

IPC: C08J5/24 ,  H05K1/05

CPC classification number: C08J5/24 ,  C08J2315/00 ,  C08J2333/00 ,  C08J2371/12 ,  C08J2433/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08L71/12 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/249921 ,  Y10T442/2951 ,  C08L33/06 ,  C08L33/20 ,  C08L63/00

Abstract: Provided is a prepreg that is formed by impregnating a fabric base material with a resin composition, then heating and drying. The resin composition includes (A) a polymer which has a specific structure, has no unsaturated bond between carbon atoms, has an epoxy number of from 0.2 to 0.8 eq/kg, and has a weight-average molecular weight of from 200,000 to 1,000,000; (B) a polyarylene-ether copolymer (PAE); and (C) an epoxy resin having two or more epoxy groups on a molecule. The component (B) is compatible with the component (A), and the component (C) is an epoxy resin that is incompatible with the component (A).

Abstract translation: 提供了通过用树脂组合物浸渍织物基材，然后加热和干燥而形成的预浸料。 树脂组合物包含（A）具有特定结构的聚合物，在碳原子之间不具有不饱和键，环氧基数为0.2〜0.8当量/ kg，重均分子量为20万〜100万。 （B）聚亚芳基醚共聚物（PAE）; 和（C）在分子上具有两个以上环氧基的环氧树脂。 组分（B）与组分（A）相容，组分（C）是与组分（A）不相容的环氧树脂。

公开(公告)号：US20150230342A1

公开(公告)日：2015-08-13

申请号：US14244299

申请日：2014-04-03

Applicant: Apple Inc.

Inventor： Jun Chung Hsu ,  Jun Zhai

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/115 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/029 ,  H05K2201/09581 ,  Y10T29/49124 ,  H01L2924/00

Abstract: In some embodiments, a carrier substrate for an integrated circuit may include a core, a first plurality of openings, and a first insulating material. The core may include a first surface and a second surface substantially opposing the first surface. The first plurality of openings may extend from the first surface to the second surface of the core. In some embodiments, the first insulating material may be applied to a surface of the first plurality of openings. In some embodiments, the first plurality of openings may include a first conductor extending through each of the first plurality of openings from the first surface to the second surface. In some embodiments, at least a first subset of the first plurality of openings may include a first charge and at least a second subset of the first plurality of openings may include a second charge. The first charge and the second charge may be different.

Abstract translation: 在一些实施例中，用于集成电路的载体衬底可以包括芯，第一多个开口和第一绝缘材料。 芯可以包括基本上与第一表面相对的第一表面和第二表面。 第一多个开口可以从芯的第一表面延伸到第二表面。 在一些实施例中，第一绝缘材料可以施加到第一多个开口的表面。 在一些实施例中，第一多个开口可以包括延伸穿过第一多个开口中的每一个从第一表面到第二表面的第一导体。 在一些实施例中，第一多个开口的至少第一子集可以包括第一电荷，并且第一多个开口的至少第二子集可以包括第二电荷。 第一次充电和第二次充电可能不同。

公开(公告)号：US20150156863A1

公开(公告)日：2015-06-04

申请号：US14555227

申请日：2014-11-26

Applicant: Dell Products L.P.

Inventor： Joel R. Goergen ,  Yi Zheng

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/0216 ,  B32B2305/076 ,  B32B2309/08 ,  B32B2457/08 ,  H01P3/081 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/0366 ,  H05K3/0091 ,  H05K3/46 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09745 ,  H05K2201/098 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.

Abstract translation: 公开了电路板及其制造方法。 电路板使用形成为包括纵向通道的导体承载高速信号。 通道增加了导体的表面积，从而增强了导体承载高速信号的能力。 在至少一些实施例中，通道内的介电常数和通道之外的介质常数之间也存在不连续性，这被认为可减少信号损耗。

公开(公告)号：US09049794B2

公开(公告)日：2015-06-02

申请号：US13075865

申请日：2011-03-30

Applicant: Yoshihiro Morita ,  Takahiro Ooi ,  Tetsuro Yamada ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama

Inventor： Yoshihiro Morita ,  Takahiro Ooi ,  Tetsuro Yamada ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama

IPC: H05K1/09 ,  H05K7/00 ,  H05K1/03 ,  D03D15/00 ,  H05K1/02

CPC classification number: H05K1/0366 ,  D03D1/0088 ,  D03D15/0011 ,  D03D15/0088 ,  D10B2401/18 ,  D10B2505/02 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0248 ,  H05K2201/029 ,  H05K2201/091 ,  H05K2203/0195 ,  Y10T29/49124

Abstract: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

Abstract translation: 布线基板包括：绝缘层，包括热固性树脂和具有多个第一纤维束的加强件和编织在一起的多个第二纤维束，第二纤维束与第一纤维束相交，以及一对彼此并排设置的差动布线 在绝缘层上。 第一纤维束和第二纤维束在布置有一对差动布线的区域中相对于绝缘层的平面方向具有弯曲部分。

公开(公告)号：US20150122532A1

公开(公告)日：2015-05-07

申请号：US14527124

申请日：2014-10-29

Applicant: Teledyne Technologies Incorporated

Inventor： Robert A. Nelson ,  Raymond L. Dubois ,  Michael A. Collier ,  James E. Keating

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0366 ,  H05K1/0271 ,  H05K1/0393 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/029

Abstract: In various embodiments, high temperature printed circuit boards are disclosed. In one embodiment, a high temperature printed circuit board (PCB) comprises a first reinforced pre-impregnated layer and a second reinforced pre-impregnated layer. The first reinforced pre-impregnated layer and the second reinforced pre-impregnated layer comprise a plurality of glass fibers having a warp and a weft and impregnated with a polyimide high-temperature resin adhesive. A flexible metal-clad polyimide laminate material is located between the first reinforced pre-impregnated layer and the reinforced second pre-impregnated layer. The flexible metal-clad polyimide laminate material comprises a plurality of conductive traces. A polyimide film is disposed over the first pre-impregnated layer and the second pre-impregnated layer.

Abstract translation: 在各种实施例中，公开了高温印刷电路板。 在一个实施例中，高温印刷电路板（PCB）包括第一增强预浸渍层和第二增强预浸渍层。 第一增强预浸渍层和第二增强预浸渍层包括具有经纱和纬纱的多个玻璃纤维，并用聚酰亚胺高温树脂粘合剂浸渍。 柔性金属包覆的聚酰亚胺层压材料位于第一增强预浸渍层和增强的第二预浸渍层之间。 柔性金属包覆聚酰亚胺层压材料包括多个导电迹线。 聚酰亚胺膜设置在第一预浸渍层和第二预浸渍层上。

公开(公告)号：US20150104630A1

公开(公告)日：2015-04-16

申请号：US14149567

申请日：2014-01-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Seok Moon ,  Sa Yong Lee ,  Keun Yong Lee ,  Seong Hyun Yoo

IPC: H05K1/03 ,  B32B38/10 ,  B32B38/08 ,  H05K3/00 ,  B32B37/24

CPC classification number: H05K1/0366 ,  B32B37/26 ,  B32B38/08 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/12 ,  B32B2457/08 ,  H05K3/007 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2203/0191

Abstract: Disclosed herein are a prepreg for a printed circuit board, a manufacturing method thereof, and a printed circuit board including the same. More particularly, the manufacturing method of a prepreg for a printed circuit board includes: coating an insulating composition on each of the two carrier films to form an insulating layer and drying the coated insulating composition to form first and second carrier substrates; disposing glass fiber between the insulating layers of the first and second carrier substrates and bonding the first and second carrier substrates to each other to form a laminated substrate; pressing the laminated substrate; and removing the carrier film from the laminated substrate subjected to the pressing.The prepreg may be manufactured so as to have the desired thickness or maintain a uniform thickness, such that thickness quality may be stabilized, and a coefficient of thermal expansion property may be improved.

Abstract translation: 本发明公开了一种用于印刷电路板的预浸料，其制造方法和包括该预浸料的印刷电路板。 更具体地，印刷电路板用预浸料的制造方法包括：在两个载体膜的每一个上涂覆绝缘组合物以形成绝缘层，并干燥涂覆的绝缘组合物以形成第一和第二载体基板; 在第一和第二载体基板的绝缘层之间布置玻璃纤维，并将第一和第二载体基板彼此接合以形成层压基板; 按压层压基板; 并从经受压制的叠层基板上除去载体膜。 可以制造预浸料以具有期望的厚度或保持均匀的厚度，使得厚度质量可以稳定，并且可以提高热膨胀性能。

公开(公告)号：US20150101846A1

公开(公告)日：2015-04-16

申请号：US14160209

申请日：2014-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ho Shik Kang ,  Jong Tae Park

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/4647 ,  H05K3/007 ,  H05K2201/029 ,  H05K2201/09136 ,  H05K2203/025

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to the present invention may include: a plurality of circuit layers; and a plurality of insulating layers interposed between the plurality of circuit layers, wherein two adjacent insulating layers of the plurality of insulating layers have different thicknesses.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的印刷电路板可以包括：多个电路层; 以及插入在所述多个电路层之间的多个绝缘层，其中所述多个绝缘层中的两个相邻的绝缘层具有不同的厚度。

公开(公告)号：US08974888B2

公开(公告)日：2015-03-10

申请号：US13221268

申请日：2011-08-30

Applicant: Gregory E. Balcome ,  Brett P. Krull ,  Joseph Kuczynski ,  Terry G. Ryks ,  Timothy J. Tofil

Inventor： Gregory E. Balcome ,  Brett P. Krull ,  Joseph Kuczynski ,  Terry G. Ryks ,  Timothy J. Tofil

IPC: B32B3/24 ,  B32B3/10 ,  H05K3/28 ,  B32B5/02

CPC classification number: B32B3/10 ,  B32B5/02 ,  B32B2262/101 ,  B32B2383/00 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/0055 ,  H05K3/28 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/029 ,  H05K2203/1147 ,  H05K2203/124 ,  H05K2203/1338 ,  Y10T428/24273 ,  Y10T428/24322

Abstract: An enhanced substrate for making a printed circuit board (PCB) includes a silane applied to the ends of glass fibers in via holes. In one embodiment, during a plated through-hole (PTH) via fabrication process, glass fiber bundles exposed in a drilled through-hole are selectively sealed. For example, after the through-hole is drilled in a substrate, the substrate may be subjected to an aqueous silane bath (e.g., an organo trialkoxysilane in an aqueous solution of an acid that acts as a catalyst) to deposit a layer of silane on the exposed glass fiber bundle ends. For example, trialkoxy groups of the silane may react with exposed silanols on the glass to form a siloxane, which is further polymerized to form a silane polymer barrier layer on the exposed glass fiber ends. The barrier layer effectively seals the glass fiber bundles and eliminates the conductive anodic filament (CAF) pathway between PTH vias.

Abstract translation: 用于制造印刷电路板（PCB）的增强基板包括在通孔中施加到玻璃纤维端部的硅烷。 在一个实施例中，在通过制造工艺的电镀通孔（PTH）期间，暴露在钻孔中的玻璃纤维束被选择性地密封。 例如，在通孔在衬底中钻孔之后，衬底可以经受水性硅烷浴（例如，作为催化剂的酸的水溶液中的有机三烷氧基硅烷），以沉积一层硅烷 暴露的玻璃纤维束结束。 例如，硅烷的三烷氧基可以与玻璃上暴露的硅烷醇反应形成硅氧烷，其进一步聚合以在暴露的玻璃纤维端部形成硅烷聚合物阻挡层。 阻挡层有效地密封玻璃纤维束并消除PTH通孔之间的导电阳极丝（CAF）通路。

公开(公告)号：US20140357147A1

公开(公告)日：2014-12-04

申请号：US14068389

申请日：2013-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong MIN ,  Sang Hoon KIM ,  Hye Jin KIM

IPC: H05K1/02 ,  H05K3/02 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/0306 ,  H05K1/038 ,  H05K3/022 ,  H05K3/4605 ,  H05K2201/0212 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2203/1545 ,  Y10T428/249921 ,  Y10T442/2861 ,  Y10T442/2902

Abstract: Disclosed herein is a core made of a glass material so as to be capable of preventing generation of warpage in a printed circuit board due to a difference in a coefficient of thermal expansion at the time of manufacturing the printed circuit board. The core includes: an organic cloth; and a glass having the organic cloth formed therein. The core is manufactured in a form in which rigidity thereof is increased by impregnating the organic cloth having a negative coefficient of thermal expansion is impregnated in a liquid-phase glass, thereby making it possible to effectively prevent generation of warpage in the printed circuit board due to the difference in a coefficient of thermal expansion.

Abstract translation: 这里公开了一种由玻璃材料制成的芯体，以便能够防止由于印刷电路板制造时的热膨胀系数的差异而在印刷电路板中产生翘曲。 核心包括：有机布; 以及其中形成有机布的玻璃。 通过将具有负的热膨胀系数的有机布浸渍浸渍在液相玻璃中，使其硬度提高的形式制造芯，由此能够有效地防止由于印刷电路板产生翘曲 到热膨胀系数的差异。