公开(公告)号：US4572859A

公开(公告)日：1986-02-25

申请号：US722762

申请日：1985-04-15

Applicant: Yasuo Fushiki ,  Masaharu Abe ,  Masayuki Oizumi

Inventor： Yasuo Fushiki ,  Masaharu Abe ,  Masayuki Oizumi

IPC: B32B27/04 ,  B32B27/10 ,  H01B3/48 ,  H05K1/03 ,  B32B7/00

CPC classification number: B32B27/04 ,  B32B27/10 ,  H01B3/48 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  Y10S428/901 ,  Y10T428/24967 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/31692 ,  Y10T428/3179 ,  Y10T428/3188 ,  Y10T428/31906 ,  Y10T428/31967

Abstract: An electrical laminate comprising a plurality of fibrous cellulosic substrate layers and alternately interposed layers of cured epoxy or unsaturated polyester resin between the adjacent substrate layers, wherein each of the substrate layers is embedded in a matrix of said cured resin which is substantially integral with said layers of cured resin, and consists essentially of cellulosic fibers having thereon a coating of methylol group-containing resin such as aminoplast resins. The laminate may be unclad or cladded with a metal foil.

Abstract translation: 一种电气层压板，包括多个纤维状纤维素基材层，并且在相邻的基材层之间交替插入固化的环氧树脂或不饱和聚酯树脂层，其中每个基材层嵌入所述固化树脂的基质中，所述基质与所述层基本上成一体 的固化树脂，并且基本上由其上具有含羟甲基基团的树脂如氨基塑料树脂的涂层的纤维素纤维组成。 层压体可以用金属箔未包覆或包覆。

公开(公告)号：US4518646A

公开(公告)日：1985-05-21

申请号：US557016

申请日：1983-12-01

Applicant: Roy F. Nichols, Jr.

Inventor： Roy F. Nichols, Jr.

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/00

CPC classification number: H05K1/036 ,  H05K1/0254 ,  H05K1/0268 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24934 ,  Y10T442/3455

Abstract: A high voltage arc-resistant laminate for printed circuit boards comprising a substrate and metallic foil bonded on one or both surfaces of the substrate. The substrate includes core sheets of cellulosic paper impregnated with a resin formulation comprising an admixture of resin solids including a major amount of phenolic resins, and minor amount of curing agents for the resins, and face sheets of glass fiber cloth impregnated with a resin formulation consisting substantially entirely of brominated aromatic epoxy resin solids, and minor amount of dicyandiamide curing agent and amine catalyst along with, antimony oxide, thixotropic agent, and pigments. Also disclosed is a process for manufacturing the laminate. A high temperature resistant embodiment is also disclosed in which the core sheet resin is brominated aromatic epoxy instead of phenolic resin.

Abstract translation: 一种用于印刷电路板的耐高压电弧层压板，包括基板和金属箔，所述金属箔接合在所述基板的一个或两个表面上。 基材包括浸渍有树脂配方的纤维素纸芯片，该树脂制剂包括含有大量酚醛树脂的树脂固体的混合物和少量用于树脂的固化剂，以及浸渍有树脂制剂的玻璃纤维布面片 基本上完全是溴化芳族环氧树脂固体，以及少量的双氰胺固化剂和胺催化剂以及氧化锑，触变剂和颜料。 还公开了一种制造层压体的方法。 还公开了耐高温的实施方案，其中芯片树脂是溴代芳族环氧树脂代替酚醛树脂。

公开(公告)号：US4501787A

公开(公告)日：1985-02-26

申请号：US490098

申请日：1983-04-29

Applicant: Joseph R. Marchetti ,  Wilbur R. Thomas

Inventor： Joseph R. Marchetti ,  Wilbur R. Thomas

IPC: C08L61/00 ,  B32B15/08 ,  B32B15/092 ,  C08G59/00 ,  C08J5/10 ,  C08J5/24 ,  C08L61/04 ,  C08L63/00 ,  C08L77/00 ,  H05K1/03 ,  B32B7/00 ,  B32B17/10 ,  H05K1/00

CPC classification number: B32B15/08 ,  H05K1/034 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/122 ,  Y10S428/901 ,  Y10S428/92 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703 ,  Y10T428/31761 ,  Y10T428/31964 ,  Y10T442/3415 ,  Y10T442/3431 ,  Y10T442/3439 ,  Y10T442/3585 ,  Y10T442/3813

Abstract: A prepreg useful in flame resistant copper clad printed circuit boards is made by impregnating a porous substrate with an impregnant containing: either a prebrominated epoxy resin or a mixture of a non-halogenated epoxy resin and flame retarding additive containing bromine, and phenolic hydroxyl groups. A phenolic novolac oligomer having an average of over 2.5 phenolic hydroxyl groups per oligomeric unit is used as curing agent. Optionally, a suitable catalyst may be included. The impregnated substrate is heated to cure or advance the resin to the "B"-stage.

Abstract translation: 用于阻燃铜包层印刷电路板的预浸料通过用含有溴化物的预溴化环氧树脂或非卤化环氧树脂和阻燃添加剂混合物和酚羟基的浸渍剂浸渍多孔基材来制备。 使用每个低聚单元平均具有超过2.5个酚羟基的酚醛清漆低聚物作为固化剂。 任选地，可以包括合适的催化剂。 将浸渍的基材加热固化或将树脂推进到“B”阶段。

公开(公告)号：US4440833A

公开(公告)日：1984-04-03

申请号：US437305

申请日：1982-10-28

Applicant: Arnold Franz ,  Siegfried Koepnick

Inventor： Arnold Franz ,  Siegfried Koepnick

IPC: B32B5/28 ,  B32B15/08 ,  B32B15/12 ,  B32B27/42 ,  B32B29/00 ,  C08J5/24 ,  C08K5/00 ,  C08L61/06 ,  C08L61/14 ,  C08L75/08 ,  D21H17/48 ,  D21H17/57 ,  H05K1/03 ,  B32B27/00 ,  B32B15/10

CPC classification number: H05K1/0373 ,  B32B15/12 ,  C08K5/00 ,  C08L61/06 ,  D21H17/48 ,  D21H17/57 ,  H05K1/0313 ,  C08L75/08 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/921 ,  Y10T428/31591 ,  Y10T428/31594 ,  Y10T428/31605 ,  Y10T428/31703 ,  Y10T428/31964

Abstract: Increased elasticity of a laminate is obtained by adding 5-20% by weight of a blocked polyetherurethane component from a reaction product of polyethylene glycol, polypropylene glycol and p-nonylphenol with toluene-2,4-diisocyanate having the following composition:______________________________________ polyethylene glycol 15-20% by weight polypropylene glycol 50-60% by weight toluene-2,4-diisocyanate 8-12% by weight nonylphenol 10-15% by weight ______________________________________ in the manufacture of a fire resistant laminate based on a cellulose-containing substrate material and an impregnating varnish made up of a phenol-resol with additives of plasticizers and flame retardants. A copper-laminated hard paper made of this phenolic resin laminate is distinguished by reduced punching resistance and stripping resistance.

Abstract translation: 通过从聚乙二醇，聚丙二醇和对壬基苯酚的反应产物中加入5-20重量％的封端聚醚聚氨酯组分与具有以下组成的甲苯-2,4-二异氰酸酯获得层压体的增加的弹性：聚乙二醇 15-20重量％ - 聚丙二醇50-60重量％甲苯-2,4-二异氰酸酯8-12重量％壬基酚10-15重量％ - 在制造基于纤维素的耐火层压板 含有酚醛树脂的增塑剂和阻燃剂添加剂的浸渍清漆。 由该酚醛树脂层压板制成的铜层压硬纸的特征在于抗冲击性和耐剥离性降低。

公开(公告)号：US4372800A

公开(公告)日：1983-02-08

申请号：US223402

申请日：1981-01-08

Applicant: Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

Inventor： Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

IPC: B32B37/00 ,  B29C57/00 ,  B29C63/00 ,  B29C67/00 ,  B29C70/00 ,  B29C70/50 ,  B32B15/08 ,  B32B27/04 ,  B32B38/08 ,  D21H25/06 ,  H05K1/03 ,  H05K3/02 ,  C09J5/02

CPC classification number: B32B38/08 ,  B29C70/50 ,  B32B27/04 ,  D21H25/06 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K3/022 ,  Y10S428/901 ,  Y10T156/1085 ,  Y10T29/49124 ,  Y10T442/3431 ,  Y10T442/3528 ,  Y10T442/656 ,  Y10T442/67

Abstract: A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.

公开(公告)号：US3987230A

公开(公告)日：1976-10-19

申请号：US556917

申请日：1975-03-10

Applicant: Morio Gaku ,  Kazuhiro Suzuki ,  Kazuyuki Nakamichi

Inventor： Morio Gaku ,  Kazuhiro Suzuki ,  Kazuyuki Nakamichi

IPC: B29C43/02 ,  B29C43/18 ,  B29C43/20 ,  B29C57/00 ,  B29C67/00 ,  B29C70/00 ,  B32B17/04 ,  C08J5/24 ,  D21H17/53 ,  H05K1/03 ,  H05K1/00

CPC classification number: D21H17/53 ,  B29C70/00 ,  C08J5/24 ,  H05K1/036 ,  B29K2309/08 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31678 ,  Y10T442/3439

Abstract: A laminate comprising at least one inorganic or organic fiber nonwoven fabric impregnated with a cyanic acid ester resin composition, at least one glass fabric impregnated with an epoxy resin composition, and at least one of the outermost layers being the glass fabric impregnated with an epoxy resin composition.

公开(公告)号：US3955024A

公开(公告)日：1976-05-04

申请号：US603989

申请日：1975-08-12

Applicant: Ira Bernard Goldman ,  John Francis Henrickson

Inventor： Ira Bernard Goldman ,  John Francis Henrickson

IPC: C08L63/00 ,  D06M15/507 ,  D06M15/55 ,  H04R25/00 ,  H05K1/03 ,  B32B15/08 ,  B32B27/04 ,  B32B27/38 ,  H05K1/00

CPC classification number: H05K1/0366 ,  C08L63/00 ,  D06M15/507 ,  D06M15/55 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31536 ,  Y10T428/31794

Abstract: A method of improving the dimensional and thermal stability of a fibrous web containing substrate is disclosed. A uniformly or randomly spun or bonded fabric or textile support is impregnated with a curable polymer resin, e.g., an epoxy-polyester resin. The impregnated resin is then fully cured whereupon a polymer resin coat is applied thereto. The coat is maintained in a partial cure state whereby a laminate comprising an internal woven or bonded fabric skeleton impregnated with a fully cured polymer resin and coated with a layer of a partially cured polymer resin is obtained.

Abstract translation: 公开了一种改善含纤维网的基材的尺寸和热稳定性的方法。 用可固化聚合物树脂例如环氧 - 聚酯树脂浸渍均匀或随机纺丝或粘合的织物或织物载体。 然后将浸渍的树脂完全固化，由此施加聚合物树脂涂层。 将该涂层保持在部分固化状态，由此获得包含浸渍有完全固化的聚合物树脂并涂覆有部分固化的聚合物树脂层的内部织造或粘合织物骨架的层压体。

公开(公告)号：US3909680A

公开(公告)日：1975-09-30

申请号：US47280274

申请日：1974-05-23

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TSUNASHIMA EIICHI

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H01C13/00 ,  H02B9/00

CPC classification number: H05K3/28 ,  H05K1/0366 ,  H05K1/095 ,  H05K1/167 ,  H05K3/0094 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0769 ,  H05K2201/09581 ,  H05K2203/122 ,  H05K2203/1461

Abstract: In a printed circuit board, on which there are formed printed components such as resistors and capacitors and printed conductors, which comprise silver or silver powder and resin, such as an electrode of a component and a connecting conductor, there are provided under coating layer and/or an over coating layer comprising insulating resin and an organic inhibitor so as to prevent migration of silver from the conductor of a higher potential to the conductor of a lower potential.

Abstract translation: 在印刷电路板中，在其上形成诸如电阻器和电容器的印刷部件和印刷导体，其包括银或银粉末和树脂，例如部件的电极和连接导体，设置在涂层和 /或包含绝缘树脂和有机抑制剂的覆盖层，以防止银从较高电位的导体迁移到较低电位的导体。

公开(公告)号：US3855047A

公开(公告)日：1974-12-17

申请号：US32144473

申请日：1973-01-05

Applicant: MINNESOTA MINING & MFG

Inventor： GROFF G

IPC: D04H1/42 ,  H05K1/03 ,  D04H1/04 ,  B32B7/04

CPC classification number: H05K1/0366 ,  D04H1/4342 ,  D04H1/435 ,  D04H1/4382 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/2904 ,  Y10T442/2164 ,  Y10T442/2475

Abstract: The disclosed laminate is suitable for use in the art of printed circuitry and comprises an electrically conductive layer and a nonwoven backing layer. The nonwoven backing has unusual dimensional stability under a wide variety of conditions and preferably comprises a blend of at least 15 wt. % polyester staple and at least 10 wt. % aromatic polyamide staple. This blend is impregnated with a thermosettable resin.

Abstract translation: 所公开的层压体适用于印刷电路领域，并且包括导电层和非织造背衬层。 非织造背衬在各种条件下具有不寻常的尺寸稳定性，并且优选包含至少15wt。 ％聚酯短纤维和至少10重量％ ％芳族聚酰胺短纤维。 该混合物用热固性树脂浸渍。

公开(公告)号：US20240341032A1

公开(公告)日：2024-10-10

申请号：US18130768

申请日：2023-04-04

Applicant: AVISHTECH, INC.

Inventor： Tarun Amla ,  Keshav Amla ,  Jyoti Amla

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/0293 ,  H05K2201/068

Abstract: Dielectric materials including non-woven inorganic fabrics impregnated with a low-density resin are disclosed. The dielectric materials may have a thickness in a range of about 5 to about 125 microns for use in printed circuit boards.