公开(公告)号：US20150055308A1

公开(公告)日：2015-02-26

申请号：US14454114

申请日：2014-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soo Chul LIM ,  Joon Ah Park ,  Hyun Jeong Lee ,  Seung Ju Han

IPC: H05K1/03 ,  G06F3/0354 ,  H01J9/18

CPC classification number: H05K1/0393 ,  G04G17/045 ,  G04G21/08 ,  G06F1/1652 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04102 ,  H05K1/0277 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0326 ,  H05K2201/057 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/104 ,  H05K2203/105

Abstract: A variable stiffness film, a variable stiffness flexible display, and a manufacturing method thereof may include a lower electrode, a variable fluid, and an upper electrode. A polymer layer may be formed on the lower electrode, and a variable fluid receiving portion is patterned on the polymer layer. A variable stiffness layer is formed by putting a variable fluid in the variable fluid receiving portion. The upper electrode is formed on the variable fluid layer.

Abstract translation: 可变刚度膜，可变刚度柔性显示器及其制造方法可以包括下电极，可变流体和上电极。 可以在下电极上形成聚合物层，并且在聚合物层上构图可变流体接收部分。 通过将可变流体放入可变流体接收部分中形成可变刚度层。 上部电极形成在可变流体层上。

公开(公告)号：US20150027753A1

公开(公告)日：2015-01-29

申请号：US14340564

申请日：2014-07-25

Applicant: Chun-Ming Huang ,  Yi-Chun Lin ,  Yi-Chen Tsai ,  Ming-Kung Wu

Inventor： Chun-Ming Huang ,  Yi-Chun Lin ,  Yi-Chen Tsai ,  Ming-Kung Wu

IPC: H05K1/02

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/12 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09681 ,  H05K2201/09727

Abstract: A panel structure includes a substrate, a decoration layer and a conductive component. The decoration layer is located in a first region and the rest region is a second region. The decoration layer includes a middle portion and a first edge protruding portion located between the middle portion and the second region and thinner than the middle portion. Each the conductive component extends in a first direction towards the first region from the second region and crosses the first edge protruding portion followed by extending in a second direction on the middle portion of the decoration layer, the first direction intersects the second direction, each the conductive component on the first edge protruding portion has a first width, each the conductive component on the middle portion extends in the second direction and has a second width less than the first width.

Abstract translation: 面板结构包括基板，装饰层和导电部件。 装饰层位于第一区域中，其余区域是第二区域。 装饰层包括位于中间部分和第二区域之间的中间部分和第一边缘突出部分，并且比中间部分薄。 每个导电部件沿着第一方向从第二区域朝向第一区域延伸，并且穿过第一边缘突出部分，然后在装饰层的中间部分上沿第二方向延伸，第一方向与第二方向相交， 第一边缘突出部分上的导电部件具有第一宽度，中间部分上的导电部件在第二方向上延伸，并且具有小于第一宽度的第二宽度。

公开(公告)号：US08928106B2

公开(公告)日：2015-01-06

申请号：US13090624

申请日：2011-04-20

Applicant: Shunichi Kajiya ,  Kazuya Hayashibe ,  Sohmei Endoh

Inventor： Shunichi Kajiya ,  Kazuya Hayashibe ,  Sohmei Endoh

IPC: H01L31/00 ,  G02F1/167 ,  G02F1/1343 ,  G06K19/077 ,  H05K3/00 ,  H05K3/06 ,  G02F1/1335

CPC classification number: G02F1/13439 ,  G02F1/133502 ,  G02F1/167 ,  G02F2001/1676 ,  G06K19/07749 ,  H01L2924/0002 ,  H05K3/0014 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2203/0143 ,  H01L2924/00

Abstract: An electroconductive element includes a substrate having a first wavy surface and a second wavy surface, and an electroconductive layer formed on the first wavy surface, wherein the electroconductive layer forms an electroconductive pattern, and the first wavy surface and the second wavy surface satisfy the following relationship: 0≦(Am1/λm1)

Abstract translation: 导电元件包括​​具有第一波形表面和第二波浪表面的基板，以及形成在第一波形表面上的导电层，其中导电层形成导电图案，第一波浪面和第二波浪面满足以下 关系：0＆nlE;（Am1 /λm1）<（Am2 /λm2）＆nlE; 1.8。 Am1是第一波形表面的振动的平均振幅，Am2是第二波状表面的振动的平均振幅，λm1是第一波形表面的平均波长，λm2是第二波状表面的平均波长。

公开(公告)号：US20140291846A1

公开(公告)日：2014-10-02

申请号：US14113815

申请日：2013-06-28

Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD

Inventor： Li Chai

IPC: H01L23/00

CPC classification number: G02F1/1345 ,  H05K1/0248 ,  H05K1/025 ,  H05K1/167 ,  H05K2201/0326 ,  H05K2201/0391 ,  H05K2201/09154 ,  H05K2201/09227 ,  H05K2201/10136

Abstract: A fanout line structure of an array substrate includes a plurality of fanout lines arranged on a fanout area of the array substrate, where the fanout line is used to connect a signal line with a bonding pad. Lengths of different fanout lines are different. At least one fanout line includes a first subsection and a second subsection. An electrical resistivity of material of the second subsection of the fanout line is greater than an electrical resistivity of material of the first subsection of the fanout line. Length of a first fanout line is greater than length of a second fanout line, and length of a second subsection of the second fanout line is greater than length of a second subsection of the first fanout line.

Abstract translation: 阵列基板的扇出线结构包括布置在阵列基板的扇出区域上的多个扇出线，其中扇出线用于将信号线与接合焊盘连接。 不同扇出线的长度不同。 至少一个扇出线包括第一小节和第二小节。 扇出线的第二子部分的材料的电阻率大于扇出线的第一子部分的材料的电阻率。 第一扇出线的长度大于第二扇出线的长度，并且第二扇出线的第二子部分的长度大于第一扇出线的第二子部分的长度。

公开(公告)号：US08749009B2

公开(公告)日：2014-06-10

申请号：US13205526

申请日：2011-08-08

Applicant: Michael Eugene Young ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Alexander Chow Mittal

Inventor： Michael Eugene Young ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Alexander Chow Mittal

IPC: H01L31/00 ,  H01L31/048 ,  H01L31/0216

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。

公开(公告)号：US20140138141A1

公开(公告)日：2014-05-22

申请号：US14086970

申请日：2013-11-22

Applicant: Chung-Hsien Li ,  Kuo-Hsing Chen ,  Yu-Ting Chen ,  Chen-Hao Su

Inventor： Chung-Hsien Li ,  Kuo-Hsing Chen ,  Yu-Ting Chen ,  Chen-Hao Su

IPC: H05K1/02

CPC classification number: H05K1/0259 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04107 ,  H05K1/0215 ,  H05K1/117 ,  H05K2201/0326 ,  H05K2201/09227 ,  H05K2201/09354 ,  H05K2201/09418 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/0979

Abstract: A peripheral circuit structure disposed on a substrate having an element region and a peripheral circuit region is provided. The peripheral circuit structure located in the peripheral circuit region includes first pads, second pads, a first trace, a second trace and third traces connected to the second pads and a device located in the element region. The first pads include a first ground pad and a second ground pad. The second pads are located between the first ground pad and the second ground pad. Two ends of the first trace are respectively electrically connected to the first ground pad and the second ground pad. Two ends of the second trace are respectively electrically connected to the first ground pad and the second ground pad, so that the second trace, the first trace, the first ground pad and the second ground form a closed loop.

Abstract translation: 设置有具有元件区域和外围电路区域的基板上的外围电路结构。 位于外围电路区域中的外围电路结构包括第一焊盘，第二焊盘，第一迹线，第二迹线和连接到第二焊盘的第三迹线以及位于元件区域中的器件。 第一焊盘包括第一接地焊盘和第二接地焊盘。 第二焊盘位于第一接地焊盘和第二接地焊盘之间。 第一迹线的两端分别电连接到第一接地焊盘和第二接地焊盘。 第二迹线的两端分别电连接到第一接地焊盘和第二接地焊盘，使得第二迹线，第一迹线，第一接地焊盘和第二接地形成闭环。

公开(公告)号：US20140063755A1

公开(公告)日：2014-03-06

申请号：US14015208

申请日：2013-08-30

Applicant: Pantech Co., Ltd.

Inventor： Chang Jin SONG

IPC: H05K7/02 ,  H05K3/00

CPC classification number: H05K7/02 ,  H05K1/0287 ,  H05K3/00 ,  H05K2201/0326 ,  H05K2201/09681

Abstract: A terminal includes: a touch unit that includes first electrodes connected in a first diagonal direction, the first diagonal direction being oblique to each side of the touch unit, and a second electrodes disposed in the second diagonal direction which intersects the first diagonal direction, the second diagonal direction being oblique to each side of the touch unit, and a Printed Circuit Board (PCB) configured to receive information generated in response to electric signals from one or more of the first electrodes and the second electrodes. Accordingly, a width of the terminal may be reduced as signal wirings need not be formed at the side surface thereof.

Abstract translation: 终端包括：触摸单元，包括在第一对角线方向上连接的第一电极，第一对角线方向与触摸单元的每一侧倾斜;以及第二电极，设置在与第一对角线方向相交的第二对角线方向上， 第二对角线方向与触摸单元的每一侧倾斜;以及印刷电路板（PCB），被配置为接收响应于来自所述第一电极和所述第二电极中的一个或多个的电信号产生的信息。 因此，由于不需要在其侧面形成信号布线，所以可以减小端子的宽度。

公开(公告)号：US08658260B2

公开(公告)日：2014-02-25

申请号：US13453518

申请日：2012-04-23

Applicant: Jie Zhang

Inventor： Jie Zhang

IPC: B05D3/02 ,  B05D3/00

CPC classification number: H05K3/02 ,  H01L31/022466 ,  H01L31/1884 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2203/0776 ,  H05K2203/107 ,  H05K2203/1581 ,  Y02E10/50

Abstract: A coating material containing metal oxide is applied to one side of a substrate, both coating and substrate being transparent to visible light. An absorber material is placed in heat transfer proximity to the coating and a laser beam is transmitted through the substrate and through the coating to strike the absorber material at the interface between coating and absorber. The absorber material absorbs optical energy from the laser beam causing the material to heat. Heat from the absorber propagates to the coating to heat a localized region, causing the coating material to anneal. If desired, the coating material can include a doping material that fuses into the coating during annealing.

Abstract translation: 将含有金属氧化物的涂料施加到基材的一侧，涂层和基材对可见光都是透明的。 将吸收材料置于热传递附近的涂层上，并且激光束透射穿过基底并穿过涂层以在涂层和吸收体之间的界面处撞击吸收体材料。 吸收材料从激光束吸收光能使材料发热。 来自吸收器的热量传播到涂层以加热局部区域，导致涂层材料退火。 如果需要，涂层材料可以包括在退火期间熔化到涂层中的掺杂材料。

公开(公告)号：US20140034364A1

公开(公告)日：2014-02-06

申请号：US14004560

申请日：2012-07-30

Applicant: Jae Wook Kang ,  Do Geun Kim ,  Jong Kuk Kim ,  Sung Hun Jung ,  Seunghun Lee

Inventor： Jae Wook Kang ,  Do Geun Kim ,  Jong Kuk Kim ,  Sung Hun Jung ,  Seunghun Lee

IPC: H05K3/10 ,  H05K1/02

CPC classification number: H05K3/0041 ,  H05K1/0283 ,  H05K1/03 ,  H05K1/0393 ,  H05K3/101 ,  H05K3/20 ,  H05K3/207 ,  H05K2201/0326 ,  H05K2201/0376 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10128 ,  H05K2203/0139 ,  H05K2203/016 ,  H05K2203/0264 ,  H05K2203/095

Abstract: Disclosed are methods or manufacturing a metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same. The method includes pre-treating a substrate by irradiating the plasma on the surface of the substrate (Step 1), forming a metal wiring on the pre-treated substrate in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the substrate including the metal wiring formed thereon in Step 2 and curing (Step 3), and separating the polymer layer formed in Step 3 from the substrate in Step 1 (Step 4), The metal wiring may be inserted into the flexible substrate, and the resistance of the wiring may be decreased. The metal wiring may be clearly separated from the substrate, and impurities on the substrate surface may be clearly removed. The flexible substrate may be easily separated by applying only physical force.

Abstract translation: 公开了通过使用由其制造的等离子体和柔性基板来制造金属布线埋入的柔性基板的方法或制造方法。 该方法包括通过在基板的表面上照射等离子体来预处理基板（步骤1），在步骤1（步骤2）中在预处理基板上形成金属布线，通过涂布形成金属布线掩埋的聚合物层 在步骤2中，将包含形成在其上的金属布线的固化性聚合物固化（步骤3），并在步骤1（步骤4）中将步骤3中形成的聚合物层与基板分离。金属布线可插入 柔性基板，并且布线的电阻可能降低。 金属布线可以从衬底清楚地分离，并且可以清楚地去除衬底表面上的杂质。 柔性基板可以通过仅施加物理力而容易地分离。

公开(公告)号：US08518277B2

公开(公告)日：2013-08-27

申请号：US12704133

申请日：2010-02-11

Applicant: Yang Yun ,  Ryan T. Gerlach

Inventor： Yang Yun ,  Ryan T. Gerlach

IPC: C23F1/02

CPC classification number: G06F3/0202 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  C09K13/04 ,  C23F1/02 ,  G06F3/041 ,  G06F3/044 ,  H01L31/022466 ,  H01L31/1884 ,  H01L51/0019 ,  H05K3/027 ,  H05K3/067 ,  H05K2201/0326

Abstract: A method of removing portions of a conductive layer comprising a transparent conductive material and/or a metallic material disposed on a plastic substrate used for capacitive touchscreen devices includes providing a plastic substrate having a conductive layer disposed on a surface thereof and removing portions of the conductive layer at the surface of the plastic substrate to establish a pattern of electrically isolated conductive portions on the surface of the plastic substrate. The conductive portions or traces are electrically connected to a touchscreen controller, which is operable to determine a location of a touch or proximity of an object at or near the surface of the plastic substrate responsive to a detected change in capacitance. The removal process may comprise etching or laser ablating portions of the conductive layer at the surface of the plastic substrate.