公开(公告)号：US09456500B2

公开(公告)日：2016-09-27

申请号：US13515012

申请日：2010-12-17

Applicant: Thomas Gottwald ,  Alexander Neumann

Inventor： Thomas Gottwald ,  Alexander Neumann

IPC: H05K3/30 ,  H05K1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/186 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/2201 ,  H01L2224/221 ,  H01L2224/224 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/9202 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H05K1/189 ,  H05K3/205 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/83851

Abstract: The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.

Abstract translation: 导体结构元件的制造方法技术领域本发明涉及一种导体结构元件的制造方法，其特征在于，提供刚性基板，在所述刚性基板上电沉积铜涂层，将铜导体图案结构施加到所述铜涂层上，然后可能安装部件，至少层叠所述基板 一个电绝缘层，分离刚性基板，至少部分地去除刚性基板的剩余的铜涂层，使得暴露导体图案结构。

公开(公告)号：US09451696B2

公开(公告)日：2016-09-20

申请号：US13631959

申请日：2012-09-29

Applicant: Dilan Seneviratne ,  Ching-Ping J. Shen ,  Liwen Jin ,  Deepak Arora ,  Vinodhkumar Raghunathan

Inventor： Dilan Seneviratne ,  Ching-Ping J. Shen ,  Liwen Jin ,  Deepak Arora ,  Vinodhkumar Raghunathan

IPC: H05K1/11 ,  H05K3/00 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H05K3/46 ,  H01L23/498

CPC classification number: H05K1/112 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2924/18162 ,  H05K1/185 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/1536 ,  H05K2203/308

Abstract: Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.

Abstract translation: 描述了用于其制造的电子组件和方法，包括与形成包括载体和位于载体上的树脂涂覆的铜层的组件有关的组件。 树脂涂覆的铜层包括第一层和第二层，第一层包含树脂和第二层铜，第一层粘合到第二层。 树脂涂覆的铜的第一层位于载体和涂覆有树脂的铜的第二层之间。 在涂覆有树脂的铜的第二层上形成开口。 模具位于开口中。 多个电介质层和金属通路位于第二层和裸片上。 描述和要求保护其他实施例。

公开(公告)号：US20160157356A1

公开(公告)日：2016-06-02

申请号：US14907486

申请日：2014-07-24

Applicant: JX NIPPON MINING & METALS CORPORATION

Inventor： MICHIYA KOHIKI

IPC: H05K3/02 ,  H05K3/38 ,  B32B15/08 ,  H05K3/20

CPC classification number: H05K3/025 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B2457/08 ,  C23C18/1653 ,  C25D1/04 ,  C25D3/38 ,  C25D3/58 ,  C25D5/10 ,  C25D7/0614 ,  C25D7/0671 ,  H05K1/09 ,  H05K3/205 ,  H05K3/384 ,  H05K3/388 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/0726

Abstract: The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85.

Abstract translation: 本发明提供一种表面处理铜箔，其能够在除去铜箔之后赋予基板表面的轮廓形状，该轮廓形状保持精细的布线成形性并且实现令人满意的无电镀铜镀层的粘合。 本发明还提供一种树脂基板，其具有保持精细布线成形性的表面的轮廓形状，并且实现令人满意的无电镀铜镀层的粘附。 本发明的表面处理铜箔是表面处理铜箔，在铜箔上形成表面处理层，与表面处理层的表面的颗粒对应的面积的比例 为0.1〜0.85。

公开(公告)号：US09313901B2

公开(公告)日：2016-04-12

申请号：US14446702

申请日：2014-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Kazuki Kajihara ,  Yasuki Kimishima

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/427 ,  H05K1/0366 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2203/1476 ,  H05K2203/1492

Abstract: A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate on the opposite side, and a through-hole conductor formed in the penetrating hole and connecting the first and second conductive layers. The through-hole conductor includes a seed layer on inner wall of the penetrating hole, a first electrolytic plated layer on the seed layer such that the first plated layer is filling the space formed by the seed layer in the penetrating hole and forming recesses at the ends of the penetrating hole, respectively, and second electrolytic plated layers filling the recesses, respectively, and the second plated layers includes electrolytic plating having an average crystalline particle diameter greater than an average crystalline particle diameter of electrolytic plating forming the first plated layer.

Abstract translation: 印刷电路板包括具有贯通孔的绝缘树脂基板，形成在基板的第一表面上的第一导电层，在相对侧的基板的第二表面上形成的第二导电层和形成在 穿透孔并连接第一和第二导电层。 所述通孔导体在所述贯通孔的内壁上具有种子层，所述种子层上的第一电解电镀层使得所述第一镀层在所述贯通孔中填充由所述籽晶层形成的空间， 并且第二镀层分别包括平均结晶粒径大于形成第一镀层的电解电镀的平均结晶粒径的电解电镀。

公开(公告)号：US20160081195A1

公开(公告)日：2016-03-17

申请号：US14851929

申请日：2015-09-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yong Yoon CHO ,  Ki Hwan KIM ,  Gun Woo KIM ,  Sung Won JEONG ,  Gi Ho HAN ,  Da Hee KIM

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/025 ,  H05K1/09 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0156

Abstract: The present invention relates to a detach core substrate and a method of manufacturing a detach core substrate. In accordance with one embodiment of the present invention, there is proposed a detach core substrate that a conductive layer including a metal layer with an etching property different from copper is formed on a top surface and a bottom surface of an insulating layer formed thereon a surface roughness. At this time, the contact interface between the top surface and the bottom surface of the insulating layer is the detachment interface to be separated during the manufacture of the circuit board. In addition, a method of manufacturing the detach core substrate is proposed.

Abstract translation: 分离芯基板和分离芯基板的制造方法技术领域本发明涉及分离芯基板和分离芯基板的制造方法。 根据本发明的一个实施例，提出了一种分离芯基板，其在其上形成有绝缘层的上表面和底表面上形成包括具有不同于铜的蚀刻性质的金属层的导电层 粗糙度 此时，绝缘层的顶表面和底表面之间的接触界面是在制造电路板期间被分离的分离界面。 另外，提出了分离芯基板的制造方法。

公开(公告)号：US09265145B2

公开(公告)日：2016-02-16

申请号：US13581009

申请日：2010-08-13

Applicant: Kouji Morita ,  Hikari Murai ,  Shin Takanezawa ,  Yasuo Inoue ,  Kazunaga Sakai

Inventor： Kouji Morita ,  Hikari Murai ,  Shin Takanezawa ,  Yasuo Inoue ,  Kazunaga Sakai

IPC: H05K1/03 ,  C08J5/24 ,  C08G59/24 ,  C08G59/50 ,  C09D163/00 ,  H01L23/498

CPC classification number: C09D163/00 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2379/00 ,  B32B2457/08 ,  C08G59/245 ,  C08G59/5086 ,  C08J5/24 ,  C08J2363/00 ,  H01L23/49894 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0355 ,  H05K2201/068 ,  Y10T428/31678 ,  Y10T442/2861 ,  Y10T442/2951

Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

Abstract translation: 本发明提供一种通过具有氨基的化合物和具有能够与氨基反应的官能团的树脂之间的反应产生的清漆，并且具有多环结构，其中多个所述树脂的官能团的一部分为 与溶剂中的化合物的氨基反应，以及通过具有酚羟基的化合物与具有与酚羟基反应的官能团的树脂之间的反应而产生的清漆，并且具有多环结构 其中使所述树脂的多个官能团的一部分与所述化合物的所述酚羟基在溶剂中反应。 本发明还提供了一种预浸料，树脂涂膜，覆金属箔层压板和使用任何清漆制成的印刷线路板。

公开(公告)号：US09190573B2

公开(公告)日：2015-11-17

申请号：US14348076

申请日：2012-08-28

Applicant: Bernd Barchmann ,  Ralph Wirth

Inventor： Bernd Barchmann ,  Ralph Wirth

IPC: H01L33/46 ,  H01L33/60 ,  H05K1/02 ,  H01L25/075 ,  H01L33/62 ,  H01L33/30 ,  F21Y101/02

CPC classification number: H01L33/46 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/30 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0058 ,  H05K1/02 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00

Abstract: A semiconductor lighting device may include a substrate populated with at least one semiconductor light source, wherein at least one reflective surface region of the substrate is covered with a light-reflecting layer, and wherein the light-reflecting layer has an aluminum carrier coated in a reflection-intensifying manner.

Abstract translation: 半导体照明装置可以包括填充有至少一个半导体光源的基板，其中基板的至少一个反射表面区域被光反射层覆盖，并且其中所述光反射层具有涂覆在所述基板上的铝载体 反射加剧的方式。

公开(公告)号：US20150327355A1

公开(公告)日：2015-11-12

申请号：US14443231

申请日：2013-11-15

Applicant: JUMATECH GMBH

Inventor： Markus WÖLFEL

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/0265 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/202 ,  H05K2201/0275 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/057 ,  H05K2201/09027 ,  H05K2201/0969 ,  H05K2201/1028 ,  Y10T29/49156

Abstract: An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section.

Abstract translation: 一种角度可调的印刷电路板结构，其具有相对于彼此成角度地布置的两个印刷电路板部分。 印刷电路板结构包含至少一个导电元件，其至少主要嵌入在印刷电路板结构中，并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘。 两个接触垫位于不同的印刷电路板部分上。 印刷电路板部分可相对于彼此具有角度可调节和/或成角度，同时维持接触焊盘和至少一个传导元件之间的连接，并且通过经印刷的弯曲边缘弯曲至少一个导电元件 电路板部分。 如横截面所示，导电元件沿着弯曲边缘比垂直方向具有更大的程度。

公开(公告)号：US09183488B2

公开(公告)日：2015-11-10

申请号：US13138918

申请日：2010-04-28

Applicant: Hiroyoshi Gotou

Inventor： Hiroyoshi Gotou

IPC: G06K19/06 ,  G06K19/077 ,  H05K3/40

CPC classification number: G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A method for manufacturing an antenna sheet, includes: a pressing step in which an overlapped portion of an antenna coil and/or a connection pattern formed from a metal material and provided on one surface of a substrate formed from a thermoplastic resin, and a conductive member formed from a metal material and provided on the other surface of the substrate is pressed using a pressing unit at least from the surface of one side of the substrate; and a welding steps in which the overlapped portion of the antenna coil and/or the connection pattern and the conductive member is welded.

Abstract translation: 一种天线片的制造方法，其特征在于，包括：加压工序，在所述加压工序中，将由天线线圈和/或由金属材料形成的连接图案的重叠部分设置在由热塑性树脂形成的基板的一个表面上， 由金属材料形成的并且设置在基板的另一个表面上的部件至少从基板的一侧的表面使用压制单元进行加压; 以及其中焊接天线线圈和/或连接图案和导电构件的重叠部分的焊接步骤。

公开(公告)号：US20150319863A1

公开(公告)日：2015-11-05

申请号：US14700438

申请日：2015-04-30

Applicant: Dhananjaya Turpuseema ,  Thomas P. Warwick ,  Thomas Smith ,  James V. Russell

Inventor： Dhananjaya Turpuseema ,  Thomas P. Warwick ,  Thomas Smith ,  James V. Russell

IPC: H05K1/18 ,  H05K3/36 ,  H05K3/46 ,  H05K3/32 ,  H05K1/14 ,  H05K3/00

CPC classification number: H05K1/188 ,  H05K1/144 ,  H05K1/183 ,  H05K1/186 ,  H05K3/0026 ,  H05K3/0094 ,  H05K3/321 ,  H05K3/366 ,  H05K3/4655 ,  H05K3/4679 ,  H05K2201/032 ,  H05K2201/0355 ,  H05K2201/042 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09545 ,  H05K2201/09572 ,  H05K2203/0485 ,  H05K2203/063 ,  H05K2203/11 ,  Y10T29/49128 ,  Y10T29/4914

Abstract: A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component. This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.

Abstract translation: 印刷电路板内部的方法和电互连结构，用于在嵌入式组件端子，信号迹线和/或电源/接地平面之间建立可靠的，高性能的连接方法，其可能占据与嵌入式组件相同的垂直空间，例如 作为电容器或电阻器。 通过所述嵌入式组件结构的制造过程进一步减轻组装和可靠性。 在一种结构化的钻孔中，电镀通孔使用永久且高度导电的附着材料将印刷电路板中的迹线或平面连接到嵌入式部件的电气端子。 在另一种结构中，迹线或平面通过选择性侧壁电镀连接，该电镀围绕部件的电端子。 该结构还使用永久且高度导电的附着材料将组件端子电连接到电镀侧壁，并且在最终实施例中，端子通过导电附着材料通过z轴上的通孔连接到导电焊盘。