公开(公告)号：US07163600B2

公开(公告)日：2007-01-16

申请号：US10250649

申请日：2002-11-22

Applicant: Tetsuro Sato ,  Noriyuki Nagashima

Inventor： Tetsuro Sato ,  Noriyuki Nagashima

IPC: B32B37/00

CPC classification number: H05K3/4655 ,  H05K1/0366 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H05K2203/0307 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state is provided on one side surface of a copper foil 2; a nonwoven fabric 5 or a woven cloth 5 to be a skeletal component is press-bonded onto a first thermosetting resin layer 3; a second thermosetting resin layer 7 is formed on a surface of a press-bonded nonwoven fabric 5 or woven cloth 5; and a semi-cured insulating layer containing the nonwoven fabric 5 or the woven cloth 5 is formed on one side surface of the copper foil 2 by drying into a semi-cured state.”

Abstract translation: 为了提供一种能够使制造的覆铜层压板的绝缘层中含有尽可能薄的骨架成分的材料的制造方法，能够可靠地防止附着的铜箔的结节处理面与 骨骼成分。 为了达到此目的，这里采用“一种具有绝缘层1的铜箔的制造方法”，该方法是在一个侧面上设置有含有骨架成分的半固化绝缘树脂层的铜箔的制造方法 的特征在于：在铜箔2的一个侧面上设置有未固化或半固化状态的第一热固性树脂层3，作为骨架的无纺布5或编织布5 将组分压合在第一热固性树脂层3上;第二热固性树脂层7形成在压合无纺布5或织布5的表面上;以及半固化绝缘层，其包含无纺织物5或 通过干燥成半固化状态，在铜箔2的一个侧面上形成编织布5。

公开(公告)号：US20060166005A1

公开(公告)日：2006-07-27

申请号：US10523698

申请日：2003-08-14

Applicant: Tetsuro Sato ,  Noriyuki Nagashima

Inventor： Tetsuro Sato ,  Noriyuki Nagashima

IPC: B32B15/08 ,  B32B27/38

CPC classification number: H05K3/4655 ,  B32B15/08 ,  B32B27/38 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/0959 ,  Y10T428/31529

Abstract: The present invention provides a resin-coated copper foil, which does not form a crack in the filled resin layer due to thermal shock in a soldering step or the like, when the resin of the resin-coated copper foil has filled via holes. The present invention provides a resin-coated copper foil having the resin layer on one side of the copper foil, wherein the resin composition of the resin layer comprises (1) 20 to 70 parts by weight of an epoxy resin, (2) 5 to 30 parts by weight of a high polymer having a crosslinkable functional group in the molecule and a crosslinking agent therefor in combination, and (3) 10 to 60 parts by weight of a compound having a structure shown in Formula 1. wherein n is an integer of one or more.

Abstract translation: 本发明提供一种树脂被覆铜箔，当树脂被覆铜箔的树脂填充通孔时，在焊接步骤等中由于热冲击而不会在填充的树脂层中形成裂纹。 本发明提供一种在铜箔一侧具有树脂层的树脂被覆铜箔，其中树脂层的树脂组合物包含（1）20〜70重量份的环氧树脂，（2）5〜 30重量份在分子中具有交联性官能团的高分子和其交联剂组合，和（3）10〜60重量份具有式1所示结构的化合物，其中n为整数 一个或多个。

公开(公告)号：US20060003173A1

公开(公告)日：2006-01-05

申请号：US11171198

申请日：2005-07-01

Applicant: Masahiro Usuki ,  Makoto Fujiwara ,  Shigehiro Hoshida ,  Michio Aizawa ,  Tadashi Amano

Inventor： Masahiro Usuki ,  Makoto Fujiwara ,  Shigehiro Hoshida ,  Michio Aizawa ,  Tadashi Amano

IPC: B32B15/08

CPC classification number: B32B15/20 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B27/34 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2307/306 ,  H05K1/0346 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31681

Abstract: In a flexible metal foil/polyimide laminate comprising in sequence, a heat resistant polyimide film, an adhesive layer, and a metal foil, the adhesive layer is a polyimide adhesive layer with a Tg of at least 400° C., obtained by heat imidization of a polyamic acid varnish containing 5-200 ppm of a leveling agent, typically polyether-modified silicone. This laminate of the all polyimide type takes full advantage of the properties of heat resistant polyimide film, includes the adhesive layer having a smooth surface, and is free of thickness variations.

Abstract translation: 在依次包含耐热聚酰亚胺膜，粘合剂层和金属箔的柔性金属箔/聚酰亚胺层压体中，粘合剂层是Tg为至少400℃的聚酰亚胺粘合剂层，通过酰亚胺化获得 的聚酰胺酸清漆，其含有5-200ppm的流平剂，通常为聚醚改性的硅氧烷。 所有聚酰亚胺类型的这种层压体充分利用了耐热聚酰亚胺膜的性质，包括具有光滑表面的粘合剂层，并且没有厚度变化。

公开(公告)号：US20050208278A1

公开(公告)日：2005-09-22

申请号：US11076445

申请日：2005-03-09

Applicant: Vincent Landi ,  Bryan McAlister ,  John Neill

Inventor： Vincent Landi ,  Bryan McAlister ,  John Neill

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/00 ,  B29B15/10 ,  B32B31/00

CPC classification number: H05K3/386 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: A method of forming a circuit material comprises disposing an adhesion promoting elastomer composition between a conductive copper foil and a thermosetting composition; and laminating the copper foil, adhesion promoting composition, and thermosetting composition to form the circuit material. The adhesion promoting layer may be uncured or partially cured before contacting with the curable thermosetting composition. Preferably the adhesion promoting layer has electrical characteristics such as dissipation factor, dielectric breakdown strength, water absorption, and dielectric constant that are similar to and/or compatible with the electrical characteristics of the thermosetting composition.

Abstract translation: 形成电路材料的方法包括在导电铜箔和热固性组合物之间设置粘合促进弹性体组合物; 并层压铜箔，粘合促进组合物和热固性组合物以形成电路材料。 在与可固化的热固性组合物接触之前，粘合促进层可以是未固化的或部分固化的。 优选地，粘附促进层具有类似于和/或与热固性组合物的电特性相容的电学特性，例如耗散因子，介电击穿强度，吸水率和介电常数。

公开(公告)号：US06675473B2

公开(公告)日：2004-01-13

申请号：US09909386

申请日：2001-07-19

Applicant: Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole

Inventor： Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole

IPC: H01K310

CPC classification number: H01L23/49838 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0269 ,  H05K1/112 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09227 ,  H05K2201/09918 ,  H05K2201/10734 ,  H05K2203/107 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49213 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of constructing a multilayer electric apparatus, comprising the steps of first providing a set of dielectric layers and forming a set of conductive features and at least one fiducial marking, in mutual reference to each other, on a first one of the dielectric layers. Next, the dielectric layers are joined together to form a stack, such that the first of the dielectric layers is interposed depthwise between others of the dielectric layers and the at least one fiducial marking is distinctly observable from outside of the stack. Finally, a via is drilled from the exterior of the stack to one of the conductive features of the first dielectric layer, referencing the drilling to the fiducial marking.

Abstract translation: 一种构造多层电气设备的方法，包括以下步骤：在电介质层的第一层上首先提供一组电介质层并形成彼此相互参照的一组导电特征和至少一个基准标记。 接下来，电介质层被接合在一起以形成堆叠，使得第一介电层被插入在介电层的其它部分之间的深度方向上，并且至少一个基准标记可以从堆叠的外部明显地观察到。 最后，参考对基准标记的钻孔，将通孔从堆叠的外部钻出到第一介电层的导电特征之一。

公开(公告)号：US20030194573A1

公开(公告)日：2003-10-16

申请号：US10257502

申请日：2002-10-10

Inventor： Takashi Itoh ,  Shoji Hara ,  Hirosaku Nagano ,  Masaru Nishinaka

IPC: B32B027/00

CPC classification number: H05K3/4655 ,  B32B27/06 ,  H05K3/386 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0358 ,  H05K2201/068 ,  H05K2203/121 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2848 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721

Abstract: A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.

Abstract translation: 一种多层结构，包括导体层，粘合剂层和介于导体层和粘合剂层之间的聚合物膜层。 该多层结构可用于提供具有优异的电性能和优异的物理平衡性，高耐热性，窄节距布线图案，小直径孔，均匀绝缘层厚度，适当低的系数 线膨胀，金属与聚合物膜之间的粘合性稳定。 聚合物膜层可以在分子中含有至少一个由式（1）表示的重复单元。 本发明还提供从多层结构体获得的多层布线基板。

公开(公告)号：US20030148107A1

公开(公告)日：2003-08-07

申请号：US10337488

申请日：2003-01-07

Applicant: KYOCERA CHEMICAL CORPORATION

Inventor： Tetsuaki Suzuki ,  Shiniti Kazama ,  Tsuyoshi Sugiyama ,  Hiroki Kamiya ,  Noriko Kanemaki ,  Kei Ogawa ,  Yuji Tada

IPC: B32B027/38

CPC classification number: H05K3/4655 ,  B32B15/08 ,  B32B27/38 ,  C08K5/5399 ,  C08L63/00 ,  C08L85/02 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0358 ,  Y10T428/31511 ,  C08L85/00 ,  C08L2666/22

Abstract: A halogen-free nonflammable epoxy resin composition, which comprises, as essential components (A) at least one kind of a cross-linked phenoxyphosphazene compound, (B) at least one kind of polyepoxide compound such as bisphenol A epoxy resin, (C) a curing agent for epoxy such as bisphenol A novolac resin, and (D) a cure promoter for epoxy, wherein the epoxy resin composition further comprises 0 to 50% by weight of an inorganic filler.

Abstract translation: 作为必要成分（A）至少一种交联的苯氧基磷腈化合物，（B）至少一种聚环氧化合物如双酚A环氧树脂，（C） 环氧树脂用固化剂，如双酚A酚醛清漆树脂，（D）环氧树脂固化促进剂，其中，所述环氧树脂组合物还含有0〜50重量％的无机填料。

公开(公告)号：US06591495B2

公开(公告)日：2003-07-15

申请号：US09797916

申请日：2001-03-05

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K302

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin by a laser beam so that a via hole is formed. Copper foil, the thickness of which is reduced to 3 &mgr;m by etching to lower the thermal conductivity, is used as a conformal mask. Therefore, an opening is formed in the resin and the number of irradiation of pulse-shape laser beam is reduced. Thus, occurence of undercut of the resin, which forms an interlayer insulating resin layer, can be prevented and the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂中形成开口，从而形成通孔。 铜箔的厚度通过蚀刻减少到3μm，以降低导热率，被用作保形掩模。 因此，在树脂中形成开口，并且脉冲形状的激光束的照射次数减少。 因此，可以防止形成层间绝缘树脂层的树脂的底切的发生，并且可以提高通孔的连接的可靠性。

公开(公告)号：US20030087101A1

公开(公告)日：2003-05-08

申请号：US10156339

申请日：2002-05-24

Inventor： Tetsuro Sato ,  Tsutomu Asai ,  Toshifumi Matsushima

IPC: B32B027/38

CPC classification number: H05K3/4655 ,  B32B15/08 ,  C08L63/00 ,  C09D163/00 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0358 ,  Y10T428/31529 ,  C08L2666/02

Abstract: An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: 1 a.a high polymer having cross-linkablenull5 to 30 parts by weight functional groups in the molecule, and a cross-linking agent therefor b.an epoxy resin that is liquid atnull5 to 30 parts by weight room temperature c.a compound having the structure shown40 to 90 parts by weight in Formula 1 1 where R is H or 2

Abstract translation: 本发明的目的是提供一种用于制造印刷线路板的树脂涂覆铜箔，其在阻燃特性，树脂流动性，耐水性和剥离强度的总体平衡上是优异的。 树脂被覆铜箔包括在铜箔的一侧上的树脂层，其特征在于，树脂层包括具有以下组成的树脂组合物：其中R是H或

公开(公告)号：US06551433B2

公开(公告)日：2003-04-22

申请号：US09904386

申请日：2001-07-12

Applicant: Fujio Kuwako ,  Tomohiro Ishino

Inventor： Fujio Kuwako ,  Tomohiro Ishino

IPC: B32B3100

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/0023 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/09 ,  H05K3/025 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09509 ,  Y10S428/914 ,  Y10T428/1438 ,  Y10T428/24843 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH). In order to attain the object, there is provided a method for producing a copper-clad laminate employing the following copper foil serving as an outer layer: (1) a resin-coated copper foil being formed of copper foil having a thickness of 15 &mgr;m or more and a rupture strength of 275 kN/m2 or more as measured through a bulge test performed after the foil is heated, wherein the resin-coated copper foil has a resin layer on one side of the copper foil; (2) a copper foil with etchable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 &mgr;m or more; or (3) a copper foil with peelable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 &mgr;m or more, the releasing layer formed between the carrier layer and the copper foil layer having a peel strength of 5 gf/cm to 300 gf/cm as measured after heating.