公开(公告)号：US07651021B2

公开(公告)日：2010-01-26

申请号：US11966943

申请日：2007-12-28

Applicant: Lakshmi Supriya ,  Ravi Nalla

Inventor： Lakshmi Supriya ,  Ravi Nalla

IPC: B23K31/02

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/13155 ,  H01L2224/1316 ,  H01L2224/13186 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/3478 ,  H05K2201/0224 ,  H05K2201/083 ,  H05K2201/09036 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0776 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/05381 ,  H01L2924/01027 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed.

Abstract translation: 描述了用于制造电子设备的电子设备和方法。 一种方法包括在其上提供具有多个接合焊盘的基板，并且提供多个焊料微球，所述微球包括其上的涂层。 该方法还包括将焊料微球流到衬底上并将焊料微球定位在焊盘上。 该方法还包括加热焊料微球以回流并形成焊料微球和焊盘之间的接头。 描述和要求保护其他实施例。

公开(公告)号：US20090279259A1

公开(公告)日：2009-11-12

申请号：US12284670

申请日：2008-09-24

Applicant: David W. Cripe ,  Bryan S. McCoy ,  Nathan P. Lower ,  Ross K. Wilcoxon

Inventor： David W. Cripe ,  Bryan S. McCoy ,  Nathan P. Lower ,  Ross K. Wilcoxon

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H05K7/20254 ,  H01L2924/0002 ,  H01L2924/01019 ,  H05K1/0272 ,  H05K2201/083 ,  H05K2203/128 ,  H01L2924/00

Abstract: A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal may carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly. The pump may be driven by electric current that is utilized by one or more electronic components on the circuit board.

Abstract translation: 电路板可以包括泵和通道。 通道可以包括液态金属和涂层。 液体金属可以通过泵泵送通过通道，并且涂层减少了液态金属与通道的至少部分之间的扩散和化学反应。 液态金属可以承载热能以在衬底上的两个或更多个位置之间用作热传递机构。 衬底可以包括电互连以允许将电气部件填充到衬底上以形成电子组件。 泵可以由电路板上的一个或多个电子部件使用的电流驱动。

公开(公告)号：US20090279257A1

公开(公告)日：2009-11-12

申请号：US12116126

申请日：2008-05-06

Applicant: Nathan P. Lower ,  Ross K. Wilcoxon ,  Qizhou Yao ,  David W. Dlouhy ,  John A. Chihak

Inventor： Nathan P. Lower ,  Ross K. Wilcoxon ,  Qizhou Yao ,  David W. Dlouhy ,  John A. Chihak

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K2201/083 ,  H05K2203/128 ,  H01L2924/00

Abstract: A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.

Abstract translation: 电路板包括泵和通道。 该通道包括液态金属和涂层。 液体金属通过泵泵送通过通道，并且涂层减少了液态金属与通道的至少部分之间的扩散和化学反应。 液体金属可以承载热能以在衬底上的两个或更多个位置之间用作热传递机构。 衬底可以包括电互连以允许将电气部件填充到衬底上以形成电子组件。

公开(公告)号：US07615256B2

公开(公告)日：2009-11-10

申请号：US11575973

申请日：2005-09-21

Applicant: Christoph Rickert ,  Jurgen Kress ,  Michel Probst

Inventor： Christoph Rickert ,  Jurgen Kress ,  Michel Probst

IPC: B05D1/04

CPC classification number: H05K3/4626 ,  B05D1/24 ,  B05D1/28 ,  B05D3/0254 ,  B05D3/14 ,  B05D2252/02 ,  H05K2201/0358 ,  H05K2201/083 ,  H05K2203/105 ,  H05K2203/1355

Abstract: Disclosed is a process for mixing and gentle transport and transfer of powders to substrates.

Abstract translation: 公开了一种将粉末混合并缓和输送和转移至基底的方法。

公开(公告)号：US07605474B2

公开(公告)日：2009-10-20

申请号：US11477412

申请日：2006-06-30

Applicant: Ruoh Huey Uang ,  Yu Chih Chen ,  Ren Jen Lin ,  Syh Yuh Cheng

Inventor： Ruoh Huey Uang ,  Yu Chih Chen ,  Ren Jen Lin ,  Syh Yuh Cheng

IPC: H01L23/48

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2203/0726 ,  H05K2203/104 ,  Y10S977/761 ,  Y10S977/762 ,  Y10S977/766 ,  Y10S977/77 ,  Y10S977/778 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

公开(公告)号：US20070023909A1

公开(公告)日：2007-02-01

申请号：US11191566

申请日：2005-07-27

Applicant: David Fork ,  Thomas Hantschel ,  Michael Chabinyc

Inventor： David Fork ,  Thomas Hantschel ,  Michael Chabinyc

IPC: H01L23/48

CPC classification number: H05K3/32 ,  B82Y30/00 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/083 ,  H01L2924/00

Abstract: A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

Abstract translation: 描述形成自组装互连结构的方法。 在该方法中，接触垫表面和溶液中的颗粒被聚集在一起。 颗粒被选择成使得颗粒粘附到接触垫表面。 接触的形成通过将相对的接触压入颗粒中而完成，使得经由相对的接触垫和基板表面接触垫之间的颗粒形成电连接。 所描述的自组装互连结构在显示器件制造中特别有用。

公开(公告)号：US20060076672A1

公开(公告)日：2006-04-13

申请号：US10962947

申请日：2004-10-12

Applicant: James Petroski

Inventor： James Petroski

IPC: H01L23/34 ,  H01L33/00

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V19/001 ,  F21V19/045 ,  F21V21/096 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  H01L2224/95144 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: A light engine (16) includes at least one LED (12) for generating light of one of a plurality of wavelengths. The LED (12) is disposed on the magnetic core printed circuit board (14). A heatsink (26) is disposed in thermal communication with a base (24) and the LED (12) for conducting thermal energy away from the LED (12). The light engine (16) is magnetically attached to the heatsink (26) via a magnet (50) which is attached to the heatsink (26) to create that a magnetic force between the magnetic core board (14) and the heatsink (26).

Abstract translation: 光引擎（16）包括用于产生多个波长中的一个的光的至少一个LED（12）。 LED（12）设置在磁芯印刷电路板（14）上。 散热器（26）设置成与基座（24）和用于将热能远离LED（12）的LED（12）热连通。 光引擎（16）通过附着在散热片（26）上的磁铁（50）与磁性散热器（26）磁性连接，从而产生磁芯板（14）和散热片（26）之间的磁力， 。

公开(公告)号：US06977025B2

公开(公告)日：2005-12-20

申请号：US10388441

申请日：2003-03-17

Applicant: Ciaran Bernard McArdle ,  Rory Brian Barnes

Inventor： Ciaran Bernard McArdle ,  Rory Brian Barnes

IPC: G03F7/34 ,  H01R4/04 ,  H05K3/32 ,  B32B31/00

CPC classification number: H01R4/04 ,  G03F7/34 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K3/323 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0769 ,  H05K2203/104 ,  Y10T428/24802 ,  H01L2924/00

Abstract: The invention provides a method of forming a monolayer of substantive particles including the steps of applying to a substrate a curable composition having substantive particles contained therein, the substantive particles having a particle size on at least one dimension thereof of at least 1 micrometer and being in two or more groups of different sizes; exposing the substantive particle-containing curable composition to a source of energy suitable for effecting polymerization of the curable composition for a sufficient time to effect polymerization of a layer of the curable composition having a thickness of no more than 50% of the height of the largest substantive particles; and optionally, removing uncured curable composition. The invention also provides a method of forming a monolayer of substantive particles in a non-random array where the curable composition comprises a ferrofluid composition. The latter method further comprises the step of subjecting the particle-containing curable ferrofluid composition to a magnetic field for a sufficient time to array the particles in a non-random manner in the composition prior to the exposure.

Abstract translation: 本发明提供了一种形成单层实质性颗粒的方法，包括以下步骤：将具有其中所含的实质性颗粒的可固化组合物施用于基材，所述实体颗粒的至少一个尺寸的颗粒尺寸至少为1微米， 两组或两组以上不同大小; 将含有实质的含颗粒的可固化组合物暴露于适于实现可固化组合物聚合足够时间的能量源，以实现可固化组合物层的厚度不超过最大厚度的50％ 实质粒子 并且任选地，除去未固化的可固化组合物。 本发明还提供了以非随机阵列形成单层实质性颗粒的方法，其中可固化组合物包含铁磁流体组合物。 后一种方法还包括以下步骤：使含有颗粒的可固化铁磁体组合物经历足够的时间以在曝光之前以非随机方式将组合物排列在组合物中。

公开(公告)号：US20050168141A1

公开(公告)日：2005-08-04

申请号：US11025281

申请日：2004-12-28

Applicant: Debora Henseler ,  Georg Wittmann ,  Ralph Patzold ,  Karsten Heuser

Inventor： Debora Henseler ,  Georg Wittmann ,  Ralph Patzold ,  Karsten Heuser

IPC: H01L21/68 ,  H01L51/00 ,  H05K1/00 ,  H05K3/00

CPC classification number: H01L51/0097 ,  H01L2227/326 ,  H05K1/0393 ,  H05K3/007 ,  H05K2201/0129 ,  H05K2201/083 ,  H05K2203/0152 ,  Y02E10/549 ,  Y02P70/521

Abstract: The production of electronic and/or optoelectronic components on a flexible film (1) can be adapted without a high effort to existing installations, which are usually based on a batch process, by virtue of the fact that, during the production method, the flexible film (1) is fixed on a carrier (2), which is sufficiently mechanically stable for the further processing of the film (1). The film (1) is connected to the carrier (2) by a magnetic layer (3) or a thermoplastic material. After the further processing of the film (1), the carrier (2) can be removed from the film (2) in a state in which it can be reused.

Abstract translation: 在柔性膜（1）上生产电子和/或光电子部件可以不经过大量努力而适应现有的安装，这些安装通常基于分批过程，因为在生产方法期间，柔性膜 膜（1）固定在载体（2）上，其对于进一步处理膜（1）是足够机械稳定的。 膜（1）通过磁性层（3）或热塑性材料连接到载体（2）。 在膜（1）的进一步处理之后，载体（2）可以在可以重复使用的状态下从膜（2）移除。

公开(公告)号：US06875367B2

公开(公告)日：2005-04-05

申请号：US10696075

申请日：2003-10-28

Applicant: George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: C03C10/02 ,  H05K3/32 ,  H01B1/20 ,  H01L29/43 ,  H01L35/24 ,  C23C38/00

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.