公开(公告)号：US09170002B2

公开(公告)日：2015-10-27

申请号：US13733998

申请日：2013-01-04

Applicant: Molex Incorporated

Inventor： Daniel B. McGowan ,  Gregory P. Meyer

IPC: F21V21/00 ,  H05K1/11 ,  H05K3/00 ,  F21V19/00 ,  F21V29/77 ,  F21Y101/02

CPC classification number: F21V21/00 ,  F21V19/003 ,  F21V19/0055 ,  F21V29/77 ,  F21Y2115/10 ,  H05K1/111 ,  H05K3/0061 ,  H05K2201/09027

Abstract: A holder is provided that include a base with an aperture. An LED array with an LED emitter can be positioned so that the LED emitter is in the aperture. The holder includes pads that can be soldered to surface contacts on the LED array. The holder further includes contacts that are electrically connected to the pads. The pads and contacts can be provided by terminals that insert molded into the base. The base can include an integrated connector that has the contacts of the terminals extend therein.

Abstract translation: 提供包括具有孔径的基座的保持器。 具有LED发射器的LED阵列可以被定位成使得LED发射器在光圈中。 支架包括可焊接到LED阵列上的表面触点的焊盘。 保持器还包括电连接到焊盘的触点。 焊盘和触点可由插入模制到基座中的端子提供。 底座可以包括具有端子的触点在其中延伸的集成连接器。

公开(公告)号：US09115882B2

公开(公告)日：2015-08-25

申请号：US13600876

申请日：2012-08-31

Applicant: Anthony DeRose

Inventor： Anthony DeRose

IPC: F21V29/00 ,  H05K1/18 ,  F21V29/58 ,  F21S9/04 ,  H05K3/00 ,  F21Y101/02 ,  F21K99/00 ,  F21V19/00 ,  F21V23/04 ,  H01L25/075 ,  H01L33/64 ,  F21Y105/00

CPC classification number: F21V29/56 ,  F21K9/00 ,  F21S9/046 ,  F21V19/0055 ,  F21V23/0435 ,  F21V29/30 ,  F21V29/58 ,  F21V31/005 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/648 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/09027 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A fluid cooled light emitting diode and associated lighting unit is disclosed. A fluid, preferably a liquid, cools and stabilizes the p-n junction of the light emitting diode thereby reducing the energy required to power the light emitting diode, lengthening its usable lifetime, and outputting more consistent light. The fluid cools the lens surrounding the light emitting diode, a printed circuit board on which the light emitting diode resides, or other heat transferring elements proximate to the lens of the light emitting diode.

Abstract translation: 公开了流体冷却的发光二极管和相关的照明单元。 流体，优选液体，冷却和稳定发光二极管的p-n结，从而减少为发光二极管供电所需的能量，延长其使用寿命，并输出更一致的光。 流体冷却发光二极管周围的透镜，发光二极管所在的印刷电路板或靠近发光二极管的透镜的其它传热元件。

公开(公告)号：US20150043188A1

公开(公告)日：2015-02-12

申请号：US14452640

申请日：2014-08-06

Applicant: SMR Patents S.A.R.L.

Inventor： Andreas Herrmann

IPC: H05K1/14 ,  H05K3/10 ,  B60R1/12

CPC classification number: H05K1/142 ,  B60R1/12 ,  H05K1/0286 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/105 ,  H05K2201/0187 ,  H05K2201/09027 ,  H05K2201/09118 ,  H05K2201/09963 ,  H05K2201/09972 ,  H05K2201/209 ,  H05K2203/107 ,  H05K2203/1453 ,  H05K2203/1461 ,  H05K2203/168 ,  Y10T29/49126

Abstract: The invention relates to a method for manufacturing a printed circuit board (10) having a substrate (2) and an electric circuit (8), in particular for a rear view device of a motor vehicle, the method comprising the following steps: manufacturing a plurality of substrate parts (2a, 2b); and selecting at least two of the substrate parts (2a, 2b), and connecting the selected substrate parts (2a, 2b) and providing the connected substrate parts (2a, 2b) with the circuit (8).

Abstract translation: 本发明涉及一种用于制造具有基板（2）和电路（8）的印刷电路板（10）的方法，特别是用于机动车辆的后视装置，该方法包括以下步骤： 多个基板部件（2a，2b）; 以及选择所述基板部分（2a，2b）中的至少两个，并且连接所选择的基板部分（2a，2b）并且将所连接的基板部分（2a，2b）提供给所述电路（8）。

公开(公告)号：US20140284805A1

公开(公告)日：2014-09-25

申请号：US14178244

申请日：2014-02-11

Applicant: Huan Wang ,  Aipeng Shu ,  Shu An Yao

Inventor： Huan Wang ,  Aipeng Shu ,  Shu An Yao

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0652 ,  H01L24/80 ,  H01L25/50 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/041 ,  H05K2201/09027 ,  Y02P70/611 ,  H01L2924/00

Abstract: A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes twisted around the columnar part. Semiconductor integrated circuits (IC dies) are attached on one or both of the supporting surfaces of the stairs. The columnar part, the stairs and the IC dies can be encapsulated with a mold compound.

Abstract translation: 三维包装包括具有包括侧壁的柱状部分的基板和沿着柱状部分的侧壁以沿着柱状部分扭转的多个螺旋形的形式布置的台阶或台阶。 半导体集成电路（IC管芯）安装在楼梯的一个或两个支撑面上。 柱状部分，楼梯和IC模具可以用模具化合物包封。

公开(公告)号：US20140065853A1

公开(公告)日：2014-03-06

申请号：US14117849

申请日：2012-05-16

Applicant: Kazuya Murakami

Inventor： Kazuya Murakami

IPC: H01R12/77

CPC classification number: H01R12/77 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/09027 ,  H05K2201/09063

Abstract: A first flexible printed wiring board (10) has a first wiring line (14) and includes a first opening (12) and second opening (13) that are positioned at a prescribed distance from each other. A portion of a second flexible printed wiring board (20) is inserted into the first opening (12) and second opening (13). The second flexible printed wiring board (20) has a second wiring line (22) on a narrow-width section (26), which is located at a tip part in an insertion direction (30) and has a smaller width than the first opening (12) and second opening (13) in a width direction (31) that is perpendicular to the insertion direction (30) towards the first flexible printed wiring board (10). The second flexible printed wiring board (20) contains a positioning section (24) that connects to the narrow-width section (26) and that has a width greater than either the first opening (12) or the second opening (13) in the width direction (31). In other words, the first wiring line (14) and the second wiring line (22) are connected when the first opening (12) or the second opening (13) is coupled to the positioning section (24) to lock the first flexible printed wiring board (10) and the second flexible printed wiring board (20) together.

Abstract translation: 第一柔性印刷布线板（10）具有第一布线（14），并且包括彼此相隔规定距离的第一开口（12）和第二开口（13）。 第二柔性印刷电路板（20）的一部分插入第一开口（12）和第二开口（13）中。 第二柔性印刷电路板（20）在宽度窄的部分（26）上具有位于插入方向（30）的尖端部分的第二布线（22），并且具有比第一开口 （12）和与所述插入方向（30）垂直的所述宽度方向（31）朝向所述第一柔性印刷布线板（10）的第二开口（13）。 第二柔性印刷布线板（20）包含连接到窄宽度部分（26）并且具有大于第一开口（12）或第二开口（13）中的任何一个的宽度的定位部分（24） 宽度方向（31）。 换句话说，当第一开口（12）或第二开口（13）联接到定位部分（24）时，第一布线（14）和第二布线（22）连接，以锁定第一柔性印刷 布线板（10）和第二柔性印刷布线板（20）。

公开(公告)号：US08601682B2

公开(公告)日：2013-12-10

申请号：US12557222

申请日：2009-09-10

Applicant: Zdenko Grajcar

Inventor： Zdenko Grajcar

IPC: H05K3/34

CPC classification number: H05K1/144 ,  F21K9/00 ,  H05K1/0204 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/306 ,  H05K3/3415 ,  H05K3/368 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10818 ,  H05K2203/0169 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A light circuit manufacturing process includes forming a palletized driver PCB board having a plurality of driver PCBs, forming a plurality of power PCBs on a palletized surface, forming slots in the driver PCBs, forming holes in the power PCBs, aligning both the power PCB palletization and the driver PCB palletization using reference holes such that the edges of each extend further in one direction or the other, and inserting thermal tabs into both the power PCB and the driver PCB.

Abstract translation: 光电路制造工艺包括形成具有多个驱动器PCB的码垛驱动PCB板，在码垛表面上形成多个电源PCB，在驱动器PCB中形成槽，在电源PCB中形成孔，使电源PCB码垛 以及使用参考孔的驱动器PCB码垛，使得每个边缘在一个方向上进一步延伸，并且将热突片插入到电源PCB和驱动器PCB中。

公开(公告)号：US20120206892A1

公开(公告)日：2012-08-16

申请号：US13370276

申请日：2012-02-09

Applicant: Erik James Shahoian ,  Chris Ligtenberg

Inventor： Erik James Shahoian ,  Chris Ligtenberg

IPC: H05K1/14 ,  H05K3/36 ,  H01R12/71

CPC classification number: H05K1/144 ,  H05K1/141 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T29/49126

Abstract: Non-rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment pin, wherein the pin aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

Abstract translation: 非矩形内插器，用于空间高效，可靠的制造，两个印刷电路板（如主板和配对板）之间的高速互连。 一个示例使用非矩形插入器提供空间效率，其中插入件可以至少近似为圆形。 可以通过包括一个或多个开口来接受一个或多个对准特征来提供可靠的制造。 在一个示例中，提供第一开口以接纳螺纹凸台，其可用于将两个印刷电路板和插入件紧固在一起。 在另一示例中，可以提供第二开口以接受对准销，其中该引脚将插入件对准到两个印刷电路板。 可以在每一侧设置触点以与两个印刷电路板中的每一个上的触点配合。

公开(公告)号：US20120057737A1

公开(公告)日：2012-03-08

申请号：US13259890

申请日：2011-05-20

Applicant: Gap Ryul Jung

Inventor： Gap Ryul Jung

IPC: H04R1/00

CPC classification number: H04R1/04 ,  H04R3/00 ,  H05K1/023 ,  H05K1/181 ,  H05K2201/09027 ,  Y02P70/611

Abstract: This disclosure is directed to implementing a measure of additionally including and installing a load register connected to a circuit chip in a printed circuit board so that the corresponding circuit chip may normally obtain and receive a series of operation powers by using the load register included in the printed circuit board; and a measure of additionally installing a ground terminal, a signal output terminal and a power receiving terminal to a joining portion of a printed circuit board joined to the circuit board of the electronic device, and electrically connecting both of the signal output terminal and the power receiving terminal to the load register and the circuit chip in the printed circuit board so that the corresponding load register and the circuit chip may normally obtain the operation power supplied from the electronic device by indirectly using the output signal receiving terminal and the signal output terminal.

Abstract translation: 本公开涉及实现另外包括并安装连接到印刷电路板中的电路芯片的负载寄存器的措施，使得相应的电路芯片通常可以通过使用包含在该电路板中的负载寄存器来获得并接收一系列操作功率 印刷电路板; 以及将接地端子，信号输出端子和电力接收端子附加地安装到连接到电子设备的电路板的印刷电路板的接合部分并且电连接信号输出端子和电力两者的措施 接收端子到印刷电路板上的负载寄存器和电路芯片，使得对应的负载寄存器和电路芯片可以通过间接地使用输出信号接收端子和信号输出端子来正常地获得从电子设备提供的操作功率。

公开(公告)号：US20110085312A1

公开(公告)日：2011-04-14

申请号：US12637902

申请日：2009-12-15

Applicant: Wei TANG ,  Chih-Hsieh Chen

Inventor： Wei TANG ,  Chih-Hsieh Chen

IPC: H05K1/14

CPC classification number: H05K1/02 ,  G06F1/1658 ,  G06F1/184 ,  H05K2201/044 ,  H05K2201/09027

Abstract: A motherboard includes a square circuit board having an indention at a corner thereof. A memory module is disposed on the circuit board near the indention. A first I/O module is disposed on an edge of the circuit board near the indention. A chip module is disposed at an area of the circuit board away from the indention. The motherboard is fixed at a half portion of a chassis of a computer host. A heat dissipation unit is accommodated in the indention of the circuit board. The other half portion of the chassis accommodates a hard disk drive.

Abstract translation: 主板包括在其拐角处具有缩进的方形电路板。 存储器模块设置在电路板附近的缩进。 第一I / O模块设置在电路板的靠近凹口的边缘上。 芯片模块设置在电路板的远离缩进的区域。 主板固定在计算机主机机箱的一半部分。 散热单元容纳在电路板的缺口中。 机箱的另一半部分容纳一个硬盘驱动器。

公开(公告)号：US20110009716A1

公开(公告)日：2011-01-13

申请号：US12920288

申请日：2009-02-24

Applicant: Karlheinz Göhler ,  Gerd Kunze ,  Christian Von Falkenhausen

Inventor： Karlheinz Göhler ,  Gerd Kunze ,  Christian Von Falkenhausen

IPC: A61B5/07

CPC classification number: A61B5/031 ,  A61B5/0031 ,  A61B5/6864 ,  H01Q1/2208 ,  H01Q1/273 ,  H05K1/16 ,  H05K2201/09027

Abstract: A patient data sensor device has an implantable patient data sensor and an implantable data transmission mechanism, which is in signal connection with the patient data sensor. The data transmission mechanism has an antenna for telemetric data transmission to an external data collection unit. In addition, the data transmission mechanism has a carrier plate for electronic components. The latter are covered on the carrier plate, at least to one side, by a cover. The antenna is configured in an edge region of the carrier plate and running around the latter and around the electronic components. The result is a patient data sensor device which is more tolerable for the patient.

Abstract translation: 患者数据传感器装置具有可植入的患者数据传感器和与患者数据传感器信号连接的可植入数据传输机构。 数据传输机构具有用于向外部数据收集单元进行遥测数据传输的天线。 此外，数据传输机构具有用于电子部件的载板。 后者通过盖覆盖在承载板上，至少一侧。 天线配置在承载板的边缘区域中，并围绕电子元件运行。 结果是患者数据传感器装置对于患者更可忍。