公开(公告)号：US20100124034A1

公开(公告)日：2010-05-20

申请号：US12611422

申请日：2009-11-03

Applicant: Hiroyuki SHOUYAMA ,  Yoshiyuki Nakayama ,  Yoshiaki Tobimatsu ,  Kazuya Fuke

Inventor： Hiroyuki SHOUYAMA ,  Yoshiyuki Nakayama ,  Yoshiaki Tobimatsu ,  Kazuya Fuke

IPC: H05K5/00

CPC classification number: H05K7/1418 ,  H05K1/02 ,  H05K2201/09154

Abstract: A printed board to be loaded into a printed-board-receiving structure having a backboard and a guide rail, the backboard having a connector plug-in connectable to a connector on the printed board, the guide rail guiding the printed board toward the backboard and having a groove including a sloping portion, the printed board includes a sloping portion forming a projection at an end of the printed board, the projection being fittable and slidable along the groove in the guide rail.

Abstract translation: 一种印刷电路板，其被装载到具有背板和导轨的印刷电路板接收结构中，所述背板具有可连接到所述印刷电路板上的连接器的连接器插件，所述导轨将所述印刷板导向所述背板， 具有包括倾斜部分的凹槽，所述印刷板包括形成在所述印刷电路板的端部处的突起的倾斜部分，所述突起可装配并沿着所述导轨中的所述凹槽滑动。

公开(公告)号：US07690103B2

公开(公告)日：2010-04-06

申请号：US11868148

申请日：2007-10-05

Applicant: Alan E. Wang ,  Kevin C. Olson

Inventor： Alan E. Wang ,  Kevin C. Olson

IPC: H05K3/36

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US20090166895A1

公开(公告)日：2009-07-02

申请号：US12342363

申请日：2008-12-23

Applicant: Mitsuru NOGUCHI ,  Sadamichi Takakusaki

Inventor： Mitsuru NOGUCHI ,  Sadamichi Takakusaki

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H05K1/05 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/44 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09745 ,  H05K2203/1572 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.

Abstract translation: 一种包括金属基板的半导体器件，包括顶表面，底表面和四个侧表面，与金属基板绝缘的导电图案，以及安装在导电图案上并电连接到导电图案的半导体元件。 顶面绝缘。 金属基板的每个侧表面包括第一倾斜侧表面和第二倾斜侧表面，以便形成在金属基板的顶表面和底表面之间向外突出的凸形，并且第一倾斜侧表面 一对两个相对的侧表面小于另一对相对侧表面的相应的第一倾斜侧表面。

公开(公告)号：US07554795B2

公开(公告)日：2009-06-30

申请号：US11597880

申请日：2005-06-03

Applicant: Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

Inventor： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

IPC: H01G9/15

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: An electronic component has an element, a pair of terminal portions which are disposed on the element, and an external covering material which covers a part of the terminal portions and the element. The electronic component is configured such that inclined portions are disposed on corner portions of a bottom surface and side surfaces of the external covering material, and the terminal portions are protruded from corner portions where the inclined portions and the bottom surface of the external covering material intersect.

Abstract translation: 电子部件具有元件，设置在元件上的一对端子部分和覆盖端子部分和元件的一部分的外部覆盖材料。 电子部件被构造成使得倾斜部分设置在外包覆材料的底表面和侧表面的角部上，并且端子部分从外部覆盖材料的倾斜部分和底表面相交的角部突出 。

公开(公告)号：US07466021B2

公开(公告)日：2008-12-16

申请号：US11381357

申请日：2006-05-02

Applicant: Joseph Charles Fjelstad

Inventor： Joseph Charles Fjelstad

IPC: H01L23/04

CPC classification number: G11C5/04 ,  B82Y10/00 ,  G01R31/2822 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/08 ,  H01P5/028 ,  H05K1/024 ,  H05K1/0243 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signals can be routed along the length of the multi-chip strip package without having to have the signals ascend and descend from the interconnection substrate on which the assembly is mounted to the IC package termination and back as the signal transmits between devices.

Abstract translation: 公开了具有楼梯阶层并且没有电镀通孔的IC封装结构。 这样的结构可以被制造成分立的封装或者条带，例如可能有利于与存储器件一起使用，其中关键或高速信号可以沿着多芯片条封装的长度布线，而不必使信号上升， 随着信号在设备之间传输，从其上安装组件的互连基板下降到IC封装端接和返回。

公开(公告)号：US20080026602A1

公开(公告)日：2008-01-31

申请号：US11868085

申请日：2007-10-05

Applicant: Alan Wang ,  Kevin Olson

Inventor： Alan Wang ,  Kevin Olson

IPC: H01R12/00

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体保形地沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US20080024960A1

公开(公告)日：2008-01-31

申请号：US11597880

申请日：2005-06-03

Applicant: Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

Inventor： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

IPC: B29C45/14 ,  H05K7/00

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

Abstract translation: 本发明的目的是提供一种以低成本制造工艺制造的电子部件，同时实现耐冲击性，耐久性，抗弯曲性，安装可靠性等的改善，而不需要微调等。本发明是 具有元件2的电子部件1，设置在元件2上的一对端子部4和覆盖端子部4的一部分和元件2的外部覆盖材料5， 倾斜部分10设置在底面9的角部和外部覆盖材料5的侧面的方式，端子部4从外部覆盖材料的倾斜部10和底面9的角部突出 相交。

公开(公告)号：US07291037B2

公开(公告)日：2007-11-06

申请号：US11476849

申请日：2006-06-29

Applicant: Ching-Cheng Tsai

Inventor： Ching-Cheng Tsai

IPC: H01R12/24

CPC classification number: H05K1/118 ,  H01R12/592 ,  H05K1/117 ,  H05K2201/09154 ,  H05K2203/0346 ,  Y10S439/951

Abstract: A flexible circuit board is provided, comprising a flexible substrate having an upper surface and a lower surface and a plurality of electrically conductive pads overlaid on an upper surface of the flexible substrate. Front ends of the electrically conductive pads do not reach a front edge of the flexible substrate and are separated from the front edge of the flexible substrate by a distance.

Abstract translation: 提供一种柔性电路板，包括具有上表面和下表面的柔性基板和覆盖在柔性基板的上表面上的多个导电焊盘。 导电焊盘的前端没有到达柔性基板的前边缘并且与柔性基板的前边缘分开一段距离。

公开(公告)号：US20070012788A1

公开(公告)日：2007-01-18

申请号：US11181741

申请日：2005-07-15

Applicant: Chien-Yuan Chen

Inventor： Chien-Yuan Chen

IPC: G06K19/06

CPC classification number: H05K3/0052 ,  H05K3/0032 ,  H05K3/284 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1316

Abstract: A manufacturing process for encapsulation and cutting memory cards, embodying a full-wafer circuit board substrate, whereon is distributed a plurality of sets of a number of chip modules assembled from passive component members, flash memory modules and control chips. A mold is then used to carry out full-wafer compression molding to seal the chip modules and passive component members onto the circuit board substrate, thereby forming a plurality of sets of memory cards having complete electric functionality. Grooves are formed between neighboring memory cards when carrying out the compression molding process, which enable direct chamfering of edges and corners of each of the memory cards after cutting, thereby eliminating the need for further finishing.

Abstract translation: 一种用于封装和切割存储卡的制造方法，体现了全晶片电路板基板，其中分布有多组由无源元件，闪存模块和控制芯片组装的芯片模块。 然后使用模具进行全晶片压缩成型以将芯片模块和无源组件构件密封到电路板基板上，从而形成具有完整电功能的多组存储卡。 在执行压缩成型工艺时，在相邻的存储卡之间形成槽，这能够在切割之后直接倒角每个存储卡的边缘和拐角，从而不需要进一步精加工。

公开(公告)号：US07153143B2

公开(公告)日：2006-12-26

申请号：US11292082

申请日：2005-12-02

Applicant: Thomas Muench

Inventor： Thomas Muench

IPC: H01R12/00

CPC classification number: H01L24/05 ,  H01L23/057 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85399 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/113 ,  H05K1/117 ,  H05K1/185 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2203/049 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.