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    CIRCUIT BOARD STRUCTURE
    34.
    发明申请
    CIRCUIT BOARD STRUCTURE 有权
    电路板结构

    公开(公告)号：US20080094813A1

    公开(公告)日：2008-04-24

    申请号：US11867647

    申请日：2007-10-04

    Applicant: Shih-Ping HSU

    Inventor： Shih-Ping HSU

    IPC: H05K1/03

    CPC classification number: H05K3/427 ,  H05K1/116 ,  H05K3/108 ,  H05K3/426 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2203/0353 ,  Y10T29/49123 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49163 ,  Y10T29/49165

    Abstract: The present invention provides a circuit board structure, the circuit board structure consisting of a carrier board having a first surface and an opposed second surface, the carrier board being formed with at least one through hole penetrating the first and second surfaces; a conductive pillar formed in the through hole by electroplating; and a first circuit layer and a second circuit layer respectively formed on the first and second surfaces of the carrier board, the first and second circuit layers being electrically connected to the two end portions of the conductive pillar, thereby reducing spacing between adjacent conductive pillars of the carrier board and achieving high density circuit layout.

    Abstract translation: 本发明提供一种电路板结构，所述电路板结构由具有第一表面和相对的第二表面的载体板组成，所述载体板形成有穿过所述第一表面和所述第二表面的至少一个通孔; 通过电镀形成在通孔中的导电柱; 以及分别形成在所述载板的所述第一和第二表面上的第一电路层和第二电路层，所述第一和第二电路层电连接到所述导电柱的两个端部，由此减小相邻导电柱之间的间隔 承载板实现高密度电路布局。

    High density laminated substrate structure and manufacture method thereof
    37.
    发明申请
    High density laminated substrate structure and manufacture method thereof 有权
    高密度层压基板结构及其制造方法

    公开(公告)号：US20030223207A1

    公开(公告)日：2003-12-04

    申请号：US10064424

    申请日：2002-07-12

    Inventor： Kwun-Yao Ho ,  Chen-Yueh Kung

    IPC: B32B003/10

    CPC classification number: H05K3/4617 ,  H05K3/20 ,  H05K3/281 ,  H05K2201/09545 ,  H05K2201/10378 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T428/24331 ,  Y10T428/24851 ,  Y10T428/24917

    Abstract: A laminated substrate structure composed of a plurality of dielectric layers and a plurality of circuit layers stacked with each other. Each of the dielectric layers has a plurality of via studs, and the circuit layers are electrically coupled with each other through the via studs. The laminated substrate structure of the present invention is characterized by adopting the embedded structure landless design that provides high reliability and better adherence. The present invention also provides a laminated substrate manufacture method. The dielectric layers having the patterned circuit and the dielectric layers having the via holes are formed first, and after the dielectric layers having the patterned circuit and the dielectric layers having the via holes are formed, they are aligned and laminated synchronously to complete the manufacture of the laminated substrate.

    Abstract translation: 由多个电介质层和彼此堆叠的多个电路层组成的层叠基板结构。 每个电介质层具有多个通孔柱，并且电路层通过通孔螺栓彼此电耦合。 本发明的层压基板结构的特征在于采用提供高可靠性和更好粘附性的嵌入式结构无地设计。 本发明还提供一种层叠基板的制造方法。 首先形成具有图案化电路的电介质层和具有通路孔的电介质层，并且在形成具有图案化电路的电介质层和具有通孔的电介质层的电介质层之后，它们被同步地对准和层压，以完成制造 层压基板。

    Printed circuit board
    38.
    发明授权
    Printed circuit board 失效
    印刷电路板

    公开(公告)号：US4661654A

    公开(公告)日：1987-04-28

    申请号：US854092

    申请日：1986-04-21

    Applicant: Jean-Paul Strobel

    Inventor： Jean-Paul Strobel

    IPC: H05K3/06 ,  H05K1/11 ,  H05K3/10 ,  H05K3/34 ,  H05K3/42 ,  H05K1/00

    CPC classification number: H05K3/427 ,  H05K1/116 ,  H05K2201/09545 ,  H05K2203/044 ,  H05K2203/0723 ,  H05K3/062 ,  H05K3/108 ,  H05K3/3468 ,  Y10T29/49165

    Abstract: The printed circuit board is produced without soldering lands around the contacting, supporting or interconnecting holes of a simple faced, double-faced or multilayer circuit.The inner wall of the hole is covered with a copper layer which extends only until the free surfaces of the naked board, i.e. levels that surface, or does not fully extend until this level. The said layer is covered with a tin-lead metallization layer which services as a soldering link element. The solder mounts towards the wire or pin of the soldered component but does not touch nor spoil the free, insulating surface of the support.One necessary condition of the making process of the board is the precise, clean, proper and sharp drilling of the holes.

    Abstract translation: 印刷电路板在简单的面对，双面或多层电路的接触，支撑或互连孔周围没有焊接区域生产。 孔的内壁被铜层覆盖，铜层仅延伸到裸板的自由表面，即表面的水平，或者不完全延伸到该水平面。 所述层被用作焊接连接元件的锡铅金属化层覆盖。 焊料朝向焊接部件的导线或销钉安装，但不会接触或破坏支撑件的自由绝缘表面。 板的制造过程的一个必要条件是孔的精确，清洁，适当和尖锐的钻孔。

    Padless plated vias having soldered wicks for multi-layer printed circuit boards
    39.
    发明授权
    Padless plated vias having soldered wicks for multi-layer printed circuit boards 失效
    无电镀通孔，用于多层印刷电路板焊锡芯

    公开(公告)号：US4556759A

    公开(公告)日：1985-12-03

    申请号：US627131

    申请日：1984-07-02

    Applicant: Ralph E. Iadarola

    Inventor： Ralph E. Iadarola

    IPC: H05K3/46 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H05K1/00

    CPC classification number: H05K1/116 ,  H05K2201/09463 ,  H05K2201/09545 ,  H05K3/3447 ,  H05K3/429

    Abstract: A multi-layer printed circuit board (21) has through holes (15-17) which are plated without conventional pads. This avoids circuit board rejections which would occur from cosmetic defects resulting from incomplete solder coverage of the pads and from pad lifting. In order to provide the through holes (15-17) with an adequate supply of solder during solder operations, wicks (45) are provided for each through hole (15-16) which is isolated from circuit traces (37, 38) on the exterior surface (33) of the printed circuit board (21). If the through hole (17) is connected to a circuit trace (38) on the exterior surface (33), then a connecting run (48) is used to provide wicking action in lieu of a tab (45).

    Abstract translation: 多层印刷电路板（21）具有通孔（15-17），其中没有常规垫片。 这避免了由于焊盘不完全的焊料覆盖和焊盘提升而导致的化妆品缺陷的电路板排除。 为了在焊接操作期间为通孔（15-17）提供足够的焊料供应，为每个通孔（15-16）提供灯芯（45），该通孔（15-16）与电路迹线（37,38）隔离， 印刷电路板（21）的外表面（33）。 如果通孔（17）连接到外表面（33）上的电路迹线（38），则连接线（48）用于提供芯吸作用以代替突片（45）。

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