公开(公告)号：US07943855B2

公开(公告)日：2011-05-17

申请号：US11425442

申请日：2006-06-21

Applicant: Chi-Chen Cheng ,  Chi-Chung Lo

Inventor： Chi-Chen Cheng ,  Chi-Chung Lo

IPC: H05K1/00

CPC classification number: H05K1/0204 ,  H05K1/189 ,  H05K3/281 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/10689

Abstract: A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat produced from the electronic component can be transmitted to the main layer by a heat-conductive medium between the electronic component and the main layer, and can be diffused via the first opening.

Abstract translation: 柔性印刷电路（FPC）和电子部件组件。 FPC包括具有第一开口的第一保护层，第一保护层上的主层，以及具有暴露主层的第二开口的第二保护层。 由电子部件产生的热量可以通过电子部件和主体层之间的导热介质传输到主层，并且可以经由第一开口扩散。

公开(公告)号：US07939373B2

公开(公告)日：2011-05-10

申请号：US12143603

申请日：2008-06-20

Applicant: Ryosuke Usui ,  Hideki Mizuhara ,  Takeshi Nakamura

Inventor： Ryosuke Usui ,  Hideki Mizuhara ,  Takeshi Nakamura

IPC: H01L21/60

CPC classification number: H01L21/6835 ,  H01L23/3128 ,  H01L23/498 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/244 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/381 ,  H05K2201/0989 ,  H05K2203/049 ,  H05K2203/095 ,  Y10S438/906 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film.

Abstract translation: 在电极膜上形成粘合膜，在其上形成涂膜。 镍，铬，钼，钨，铝或它们的合金被用作粘合膜的构成材料。 金，银，铂或它们的合金被用作涂膜的构成材料。

公开(公告)号：US07911056B2

公开(公告)日：2011-03-22

申请号：US11651540

申请日：2007-01-10

Applicant: Pai-Chou Liu ,  Yu-Hsin Lee

Inventor： Pai-Chou Liu ,  Yu-Hsin Lee

IPC: H01L23/48

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H05K2201/0989 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure includes a substrate and a solder mask. The substrate has a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are disposed on the first surface. The trace layer has a plurality of traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding to the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. The problem of non-alignment of the solder ball can thus be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.

Abstract translation: 具有非焊锡掩模设计（N-SMD）球垫的衬底结构。 衬底结构包括衬底和焊接掩模。 基板具有第一表面，迹线层和至少一个球垫。 球垫和轨迹层设置在第一表面上。 迹线层具有多个迹线，并且至少一个轨迹电连接到球垫。 焊接掩模具有至少一个对应于球垫的开口。 开口的尺寸大于球垫的尺寸。 焊接掩模覆盖连接到球垫的迹线。 因此可以解决焊球不对准的问题，并且当用PCB焊接衬底结构时可以防止焊球中的孔，从而可以提高焊球焊接的可靠性。

公开(公告)号：US20110018552A1

公开(公告)日：2011-01-27

申请号：US12828776

申请日：2010-07-01

Applicant: Kaoru Sugimoto ,  Katsuhiko Kobayashi

Inventor： Kaoru Sugimoto ,  Katsuhiko Kobayashi

IPC: H01H31/02 ,  B05D5/12

CPC classification number: H05K1/0269 ,  H05K1/024 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/029 ,  H05K2201/0989 ,  Y10T29/4922 ,  Y10T428/24124 ,  Y10T428/24273

Abstract: A coupon board is cut out together with a printed wiring board from a sheet material in which a solder resist film is formed on a surface of a glass cloth fiber. The coupon board is for evaluating characteristics of the printed wiring board. The coupon board includes a region on which the solder resist film is not formed, and which extends parallel with one side of the printed wiring board.

Abstract translation: 从玻璃布纤维的表面上形成有阻焊膜的片状材料与印刷线路板一起切割优惠券板。 优惠券板用于评估印刷电路板的特性。 优惠券板包括没有形成阻焊膜的区域，并且与印刷线路板的一侧平行延伸。

公开(公告)号：US20100315791A1

公开(公告)日：2010-12-16

申请号：US12758661

申请日：2010-04-12

Applicant: Hidetoshi Hatakeyama

Inventor： Hidetoshi Hatakeyama

IPC: H05K1/18 ,  H05K5/00

CPC classification number: H05K3/0052 ,  H05K1/0269 ,  H05K3/28 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/0989 ,  H05K2201/09909

Abstract: According to an aspect of the present invention, there is provided a printed wiring board having a first surface and a second surface provided on a side opposite to the first surface, the printed wiring board including: a product portion on which electronic components are mounted; an end portion provided to have a gap with respect to the product portion; and a connection portion which connects the product portion and the end portion to each other; a first coating composition applied on the first surface of the product portion; and a second coating composition applied on the first surface of the end portion and the first surface of the connection portion so as to be separated from the first coating composition.

Abstract translation: 根据本发明的一个方面，提供了一种印刷线路板，其具有设置在与第一表面相对的一侧上的第一表面和第二表面，印刷线路板包括：产品部分，其上安装电子部件; 设置成相对于所述产品部分具有间隙的端部; 以及将产品部分和端部部分彼此连接的连接部分; 施加在产品部分的第一表面上的第一涂料组合物; 以及施加在所述端部的所述第一表面和所述连接部的所述第一表面上以与所述第一涂料组合物分离的第二涂料组合物。

公开(公告)号：US20100258953A1

公开(公告)日：2010-10-14

申请号：US12729548

申请日：2010-03-23

Applicant: Hiromitsu TAKEDA

Inventor： Hiromitsu TAKEDA

IPC: H01L23/538 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16237 ,  H01L2224/81385 ,  H01L2924/00014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/05599

Abstract: A substrate has a plurality of pads formed over one surface of a base, and an insulating film which is formed thereon and has a plurality of openings formed therein so as to expose each of the pads, wherein the openings of the insulating film are formed so that, in each pad formed at the corner of the base, among the plurality of pads, a first peripheral portion which composes a portion of the pad more closer to the corner and more distant away from the center of the base is covered by the insulating film, and so that a second peripheral portion which composes a portion of the pad more closer to the center as compared with the first peripheral portion is exposed in the opening.

Abstract translation: 衬底具有形成在基底的一个表面上的多个焊盘和形成在其上的绝缘膜，并且在其中形成有多个开口以暴露每个焊盘，其中绝缘膜的开口形成为 在形成在基座的角部的每个焊盘中，在多个焊盘之间，构成更靠近角部并且远离基座的中心更远离的焊盘的一部分的第一周边部分被绝缘体覆盖 膜，并且使得构成与第一周边部分相比更靠近中心的焊盘的一部分的第二周边部分暴露在开口中。

公开(公告)号：US07812913B2

公开(公告)日：2010-10-12

申请号：US11698102

申请日：2007-01-26

Applicant: Eiji Oohira

Inventor： Eiji Oohira

IPC: G02F1/1345 ,  G02F1/1333 ,  H05K1/00

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/2009

Abstract: The invention provides a display device which can suppress a bending repulsive force of a flexible printed circuit board having a folded portion thus reducing a manufacturing cost thereof. In a display device which includes a display panel, and a flexible printed circuit board which has one end thereof connected to a terminal portion of the display panel, the flexible printed circuit board includes a base member, a line layer which is formed on the base member using a metal layer, a surface protective cover which covers the line layer, and a folded portion, the line layer includes a signal line which supplies control signals or display data to the display panel and a dummy line, the signal line is covered with the surface protective cover at the folded portion, and the folded portion includes at least one exposed portion in which the dummy line is exposed from the surface protective cover ranging from a folding start point to a folding finish point.

Abstract translation: 本发明提供了一种能够抑制具有折叠部分的柔性印刷电路板的弯曲斥力的显示装置，从而降低了其制造成本。 在包括显示面板的显示装置和将其一端连接到显示面板的端子部分的柔性印刷电路板的情况下，柔性印刷电路板包括基底构件，形成在基底上的线层 使用金属层的构件，覆盖线层的表面保护盖和折叠部，线层包括向显示面板提供控制信号或显示数据的信号线和虚拟线，信号线被覆盖 折叠部分的表面保护罩，折叠部分包括至少一个暴露部分，虚线从折叠起点到折叠完成点从表面保护罩露出。

公开(公告)号：US07791186B2

公开(公告)日：2010-09-07

申请号：US11542261

申请日：2006-10-04

Applicant: Katsumi Kikuchi ,  Shintaro Yamamichi ,  Yoichiro Kurita ,  Koji Soejima

Inventor： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Yoichiro Kurita ,  Koji Soejima

IPC: H01L23/12

CPC classification number: H01L25/0657 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09881 ,  H05K2201/0989 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.

Abstract translation: 一种布线板，包括：第一表面，其上设置有第一电极;第二表面，其上设置有第二电极; 至少单个绝缘层和至少一个布线层; 以及一个或多个安装的半导体元件，其中设置在第二表面上的第二电极嵌入在绝缘层中，在第二电极的第二表面侧上的暴露表面的相对侧上的表面连接到布线 层，并且第二电极的全部或部分侧面不与绝缘层接触。

公开(公告)号：US20100193223A1

公开(公告)日：2010-08-05

申请号：US12697407

申请日：2010-02-01

Applicant: Detlev Bagung ,  Michael Decker ,  Gregory Drew ,  Thomas Riepl ,  Bernd Roller

Inventor： Detlev Bagung ,  Michael Decker ,  Gregory Drew ,  Thomas Riepl ,  Bernd Roller

IPC: H05K1/00 ,  B05D5/00 ,  B32B3/10

CPC classification number: H05K3/3452 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/4691 ,  H05K2201/0989 ,  H05K2201/09909 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T428/24273

Abstract: A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.

Abstract translation: 用于刚性 - 柔性电路板的阻焊涂层包含一个或多个导体轨道和至少一个弯曲区域。 阻焊涂层在电路板的柔性区域中具有一个或多个移动间隙。 此外，形成具有至少一个具有阻焊涂层的刚性 - 柔性电路板的电子模块。

公开(公告)号：US20100140798A1

公开(公告)日：2010-06-10

申请号：US12692239

申请日：2010-01-22

Applicant: Roden R. Topacio ,  Vincent Chan ,  Fan Yeung

Inventor： Roden R. Topacio ,  Vincent Chan ,  Fan Yeung

IPC: H01L23/498

CPC classification number: H05K3/3452 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H05K2201/0989 ,  H05K2201/10674 ,  H01L2924/00014

Abstract: Various semiconductor chip packages and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a solder bump to a side of a semiconductor chip and bringing the solder bump into contact with a conductor pad coupled to a substrate and positioned in an opening of a solder mask on the substrate. The conductor pad has a first lateral dimension and the opening has a second lateral dimension that is larger than the first lateral dimension. A metallurgical bond is established between the solder bump and the conductor pad.

Abstract translation: 公开了各种半导体芯片封装及其制造方法。 在一个方面，提供了一种制造方法，其包括将焊料凸点耦合到半导体芯片的一侧，并使焊料凸块与耦合到基板的导体焊盘接触并定位在衬底上的焊料掩模的开口中 。 导体垫具有第一横向尺寸，并且开口具有大于第一横向尺寸的第二横向尺寸。 在焊料凸块和导体焊盘之间建立冶金结合。