Abstract:
A wireless IC device includes a wireless IC chip; a feeder circuit board which has the wireless IC chip located thereon, is magnetically coupled to a radiation plate, supplies electric power to the wireless IC chip, and relays signals between the wireless IC chip and the radiation plate; and a substrate on which the feeder circuit board is placed. On the substrate, there are formed a plurality of positioning markers indicating the boundaries of a plurality of positioning areas in which the feeder circuit board is selectively placed.
Abstract:
A printed wiring board includes solder pads to which component leads may be soldered. L-shaped solder pads of the printed wiring board allow component leads to approach the board from any of the four major sides of the printed wiring board. Each solder pad includes two legs and two respective axes. A component lead may be selectively soldered to one of the two legs of the solder pad. Thus, a component lead may approach a solder pad from one of four orthogonal directions.
Abstract:
A printed circuit board includes a plurality of pairs of first bond pads mounted on an area of a surface thereof, and a plurality of pairs of second bond pads mounted to on the same area thereof. One first bond pad of each pair is electrically connected to a first signal wire. The other first bond pad of each pair is electrically connected to a second signal wire. One second bond pad of each pair is connected to a first bond pad of one pair that are connected with the first signal wire. The other second bond pad of each pair is connected to a first bond pad of another pair that is connected with the second signal wire.
Abstract:
According to an example embodiment of the invention, a configurable printed circuit board (PCB) includes one or more separable portions for supporting modules for interfacing with the PCB. The separable portions extend from an edge portion of a main body of the PCB, and are disposed between the main body of the PCB and a protective portion. A scored portion is provided at a boundary between the main body of the PCB and the separable portions, the separable portions being separable by being broken off from the main body of the PCB at the scored portion. According to an example embodiment of the invention, a method of configuring a PCB having one or more separable portions of the PCB includes securing the PCB and separating the one or more separable portions of the PCB from another portion of the PCB.
Abstract:
A horizontal connector (10A) is configured for mounting on a circuit board (90) so that a connecting direction with a mating connector is parallel to the surface of the circuit board (90). A vertical connector (10B) is configured for mounting on the circuit board (90) so that a connecting direction with a mating connector is normal to the surface of the circuit board (90). Board connecting portions (35A, 35B) of terminal fittings (30A, 30B) to be inserted into connection holes (91) and mounting holes (16A, 16B) of mounting portions (12A, 12B) to be mounted to fixing holes (92) are arranged at the same positions for both the horizontal connector (10A) and vertical connector (10B). Therefore, the circuit board (90) can be commonly used for both horizontal connector (10A) and vertical connector (10B).
Abstract:
A method of fabricating a circuit board includes the steps of: (a) defining a first jumper symbol and a second jumper symbol of a schematic circuit symbol library; (b) drawing the first jumper symbol and the second jumper symbol of the schematic circuit symbol library in a schematic circuit diagram for forming a three-terminal jumper symbol; (c) defining a first jumper pattern and a second jumper pattern of a PCB component pattern library; (d) calling the PCB component pattern library for drawing the first jumper pattern and the second jumper pattern in a PCB layout so as to define a three-terminal jumper pattern; (e) selecting a jumper symbol between the first jumper symbol and the second jumper symbol; and (f) mounting a jumper on the first jumper pattern or the second jumper pattern on the circuit board according to the PCB layout and a select result from step (e).
Abstract:
An electronic module includes electronic circuitry and first and second connection mechanisms, both operationally connected to the electronic circuitry, for mounting the module in a larger electronic device by different respective methods. Preferably, the first connection mechanism is a robotic connection mechanism such as a BGA with one or more solder balls and the second connection mechanism is a manual connection mechanism such as a plug with one or more electrically conducting pads, both mechanisms being for mounting the module on a PCB.
Abstract:
Example embodiments relate to a memory card including a generally box-shaped printed circuit board, a control chip in the generally box-shaped printed circuit board, a memory chip in the generally box-shaped printed circuit board, and a plurality of contact pads on at least two portions of an upper portion, a lower portion, a left portion and a right portion of a front face of the generally box-shaped printed circuit board, and on at least two portions of an upper portion, a lower portion, a left portion and a right portion of a rear face of the generally box-shaped printed circuit board.
Abstract:
A circuit board assembly includes a circuit board, an electronic component and a structure coupling the electronic component to the circuit board. The structure retains the electronic component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The structure is movably coupled to one of the electronic component and the circuit board in a direction perpendicular to the axis at least prior to being coupled to the other of the electronic component and the circuit board.
Abstract:
A device to indicate a fuse capacity includes a fuse, a printed circuit board (PCB), on which the fuse is mounted, and a capacity indicating part to expose one of different fuse capacities, corresponding to the fuse mounted on the PCB, and to shield other fuse capacities. Accordingly, the device can easily indicate the fuse capacity in electric apparatus which uses various fuses having different capacities on the PCB.