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公开(公告)号：US20180270954A1
公开(公告)日：2018-09-20
申请号：US15982240
申请日：2018-05-17
Applicant: HISENSE BROADBAND MULIMEDIA TECHNOLOGIES CO. LTD. , HISENSE USA CORORATION , HISENSE INTERNATIONAL CO., LTD.
CPC classification number: H05K1/18 , H05K1/0298 , H05K1/117 , H05K3/3452 , H05K2201/0137 , H05K2201/10121
Abstract: The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive contact sheet group positioned on the surface of the substrate, where a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.
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公开(公告)号：US10075246B2
公开(公告)日：2018-09-11
申请号：US14037852
申请日：2013-09-26
Applicant: Rosemount Inc.
Inventor： Kirk Allan Hunter , Jared James Dreier , Jordan Dennis Lucht , Samuel Ethan Messenger
CPC classification number: H04B10/802 , H05K1/0256 , H05K1/0274 , H05K3/0047 , H05K3/32 , H05K2201/09036 , H05K2201/10121 , H05K2201/10545 , Y10T29/4913
Abstract: An optical isolator is provided. The optical isolator includes a printed circuit board having a first surface and a second surface opposite the first surface. The printed circuit board has a recess extending only partially through the board. The first photoelement has an active surface and is mounted relative to the first surface of the printed circuit board. A second photoelement has an active surface and is mounted relative to the second surface. The second photoelement is configured to interact with the first photoelement. At least one of the first and second photoelements has its active surface disposed at least partially in the recess. A portion of the printed circuit board is interposed between the first and second photoelements.
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公开(公告)号：US10054731B2
公开(公告)日：2018-08-21
申请号：US15146263
申请日：2016-05-04
Applicant: Seoul Semiconductor Co., Ltd.
Inventor： Seoung Ho Jung , Jung Hwa Jung , Ki Bum Nam
CPC classification number: G02B6/0031 , F21V7/10 , F21V23/005 , G02B6/0026 , G02B6/0073 , G02B6/009 , G02F1/133615 , H01L33/405 , H01L33/50 , H01L33/60 , H01L2224/16225 , H05K1/181 , H05K2201/10106 , H05K2201/10121 , H05K2201/10674
Abstract: A light source module including a circuit board, a first light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), a reflective portion disposed on the circuit board and having at least one recess accommodating the first light emitting device, and a bonding member disposed between the circuit board and the reflective portion. The reflective portion has a height greater than a height of the first light emitting device.
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公开(公告)号：US20180184526A1
公开(公告)日：2018-06-28
申请号：US15737935
申请日：2016-06-28
Applicant: Molex, LLC
Inventor： Marko SPIEGEL , Victor ZADEREJ , Amrit PANDA
CPC classification number: H05K3/188 , H05K1/0265 , H05K1/0326 , H05K1/0346 , H05K1/0393 , H05K1/092 , H05K1/183 , H05K3/027 , H05K3/107 , H05K3/182 , H05K3/202 , H05K2201/0154 , H05K2201/09118 , H05K2201/10106 , H05K2201/10121 , H05K2203/0706 , H05K2203/0709 , H05K2203/0716 , H05K2203/108 , H05K2203/1131
Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
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35.发明授权公开(公告)号：US10004140B2
公开(公告)日：2018-06-19
申请号：US15518797
申请日：2015-10-02
Inventor： Mitsuru Kobayashi
CPC classification number: H05K1/0284 , G01S17/08 , G01V8/12 , H01L2224/48091 , H01L2924/15153 , H01L2924/15159 , H05K1/119 , H05K1/141 , H05K1/183 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10378 , H01L2924/00014
Abstract: A three-dimensional circuit substrate according to the present disclosure includes a base body and a wiring pattern formed on an outer surface of the base body. Also, the outer surface of the base body includes a mounting surface which faces the substrate when the three-dimensional circuit substrate is mounted onto the substrate, and an installation surface which is different from the mounting surface and is a surface where an electronic component is installable. Further, a recess is formed on a side where the mounting surface is provided in the base body.
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Patent Agency Ranking
36.发明申请公开(公告)号：US20180164529A1
公开(公告)日：2018-06-14
申请号：US15317117
申请日：2016-10-28
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
CPC classification number: G02B7/021 , B29C45/14639 , B29L2031/3481 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B13/001 , G02B13/004 , H01L21/565 , H01L25/0655 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H01L27/14687 , H01L27/1469 , H01L2224/48091 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121 , H01L2924/00014
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US09995991B2
公开(公告)日：2018-06-12
申请号：US15523685
申请日：2015-11-26
Inventor： Tetsuya Ida , Tatsuhiko Inagaki
CPC classification number: G03B17/08 , G02B7/02 , G02B7/021 , G02B7/025 , G02B7/028 , G03B17/12 , H04M1/0264 , H04N5/2253 , H04N5/2254 , H04N5/369 , H05K1/181 , H05K2201/10121 , H05K2201/10151
Abstract: An image pickup apparatus includes a circuit board, a solid-state image sensing device disposed on an upper surface of the circuit board, a cylindrical lens barrel disposed above the circuit board, a lens housed in the lens barrel, and a holding member that holds the lens barrel and the circuit board therein. The solid-state image sensing device is positioned in an enclosed space formed by the lens barrel and the circuit board. The lens barrel has a first flange portion protruding in a direction perpendicular to a central axis of the lens barrel. The holding member has a first fitting groove portion in which the first flange portion of the lens barrel is fit. A thermal expansion coefficient of the holding member is smaller than a thermal expansion coefficient of the lens barrel.
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公开(公告)号：US09994153B2
公开(公告)日：2018-06-12
申请号：US15520371
申请日：2015-10-20
Applicant: Connaught Electronics Ltd.
Inventor： Martin Oliver Coleman
CPC classification number: B60R1/00 , H01R13/658 , H01R13/66 , H01R13/6625 , H01R2201/26 , H04N5/225 , H04N5/2257 , H05K1/0218 , H05K1/0231 , H05K1/14 , H05K1/144 , H05K2201/042 , H05K2201/0715 , H05K2201/10121
Abstract: The invention relates to a camera (2) for a motor vehicle (1), which includes a printed circuit board (16), on which a current connector (29) and a communication bus connector (30) and a video interface connector (31) each for connecting to the motor vehicle (1) are disposed, wherein the video interface connector (31) is connected to a capacitor (25) and a parallel-to-serial converter (26), wherein the video interface connector (31) and/or the capacitor (25) and/or the parallel-to-serial converter (26) are surrounded by a device (32) shielding electromagnetic radiation.
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公开(公告)号：US20180124914A1
公开(公告)日：2018-05-03
申请号：US15729603
申请日：2017-10-10
Applicant: FINISAR CORPORATION
Inventor： Cindy H. Hsieh , Frank J. Flens , Ziv Lipkin
CPC classification number: H05K1/0274 , G02B6/4202 , G02B6/4272 , G02B6/428 , G02B7/023 , G02B7/028 , H05K1/0203 , H05K7/2039 , H05K2201/10121
Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.
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公开(公告)号：US20180116054A1
公开(公告)日：2018-04-26
申请号：US15847798
申请日：2017-12-19
Applicant: FINISAR CORPORATION
Inventor： Maziar Amirkiai , Yunpeng Song , Peter Henry Mahowald , Hongyu Deng
CPC classification number: H05K3/32 , G02B6/00 , G02B6/4263 , G02B6/4274 , H05K1/0243 , H05K1/0298 , H05K1/111 , H05K1/181 , H05K2201/10121 , H05K2201/10545 , Y02P70/611
Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.
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