Electronic device comprising array antenna

    公开(公告)号:US11929546B2

    公开(公告)日:2024-03-12

    申请号:US17259445

    申请日:2019-07-11

    Abstract: An electronic device comprising an array antenna according to various embodiments of the present invention may comprise: a housing comprising a first plate, a second plate facing away from the first plate, and a side member surrounding the space between the first plate and the second plate; a display visible through a part of the first plate; a first printed circuit board comprising a first surface facing the side member, a second surface facing away from the first surface, a first edge adjacent close to the first plate, and a second edge closer to the second plate than the first edge, the first printed circuit board comprising one or more conductive plates on the first surface; a second printed circuit board extending from the first edge so as to bend at an obtuse angle with regard to the first surface, the second printed circuit board comprising one or more first conductive patterns; a third printed circuit board extending from the second edge so as to bend at an obtuse angle with regard to the first surface, the third printed circuit board comprising one or more second conductive patterns; and a wireless communication circuit electrically connected to the conductive plates, the first conductive patterns, and the second conductive patterns and configured to transmit and/or receive signals. Various other embodiments may be possible.

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240064911A1

    公开(公告)日:2024-02-22

    申请号:US18380198

    申请日:2023-10-16

    CPC classification number: H05K3/4679 H05K1/144 H05K2201/10128 H05K2203/104

    Abstract: A method includes preparing a substrate including a display area and a non-display area disposed adjacent to the display area, forming first panel magnetic patterns overlapping the non-display area and extending in a first direction on the substrate, forming first film magnetic patterns extending in the first direction on a film, inputting a first magnetism to the first panel magnetic patterns so that the first panel magnetic patterns have a first magnetic property, inputting a second magnetism to the first film magnetic patterns so that the first film magnetic patterns have a second magnetic property, and aligning the film on the substrate so that the first film magnetic patterns overlap the first panel magnetic patterns in a plan view.

    FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

    公开(公告)号:US20240032195A1

    公开(公告)日:2024-01-25

    申请号:US18336096

    申请日:2023-06-16

    Inventor: Youngbae KIM

    Abstract: A film package includes a film substrate extending in a first direction and including a first side and a second side facing each other, the film substrate including a device region between the first side and the second side, and the film substrate including a reinforcing region adjacent to at least one side of the device region in a second direction, the second direction intersecting the first direction. The film package includes a semiconductor chip having an elongated rod shape, and the semiconductor chip on the device region of the film substrate in the first direction, interconnection patterns electrically connected to the semiconductor chip, the interconnection patterns comprising input patterns extending toward the first side on the film substrate, and output patterns extending toward the second side on the film substrate, and a protective layer on the film substrate to cover at least a portion of the interconnection patterns.

    Image display and combined-type circuit carrying and controlling module thereof

    公开(公告)号:US11864320B2

    公开(公告)日:2024-01-02

    申请号:US17317903

    申请日:2021-05-12

    Inventor: Chien-Shou Liao

    CPC classification number: H05K1/181 G09G3/20 G09G2300/0426 H05K2201/10128

    Abstract: An image display and a combined-type circuit carrying and controlling module thereof are provided. The combined-type circuit carrying and controlling module includes a first circuit substrate structure, a control substrate structure, a second circuit substrate structure, an insulative connection structure and a conductive connection structure. The first circuit substrate structure includes a first carrier substrate, a first circuit layout layer and a plurality of first conductive penetration bodies. The control substrate structure includes a circuit substrate and a circuit control chip. The second circuit substrate structure includes a second carrier substrate and a second circuit layout layer. The insulative connection structure is connected between the first carrier substrate and the second carrier substrate. The conductive connection structure is electrically connected between the first circuit layout layer and the second circuit layout layer.

    Display module and display device
    38.
    发明授权

    公开(公告)号:US11856741B2

    公开(公告)日:2023-12-26

    申请号:US17402182

    申请日:2021-08-13

    CPC classification number: H05K7/20963 H05K1/028 H05K1/189 H05K2201/10128

    Abstract: A display apparatus capable of improving heat-dissipation performance while not increasing a total thickness thereof include a heat-dissipation member accommodated in a cushion plate. Thus, the heat-dissipation performance may be improved without increasing a thickness of the display apparatus. Thus, a mounting space for components may be secured without increasing a bezel area. Further, the heat-dissipation member having a predetermined thickness and an air gap are disposed in the heat-dissipation member accommodating space of the cushion plate, thereby maximizing the heat-dissipation from a driving integrated circuit disposed under the cushion plate so as to overlap the heat-dissipation member accommodating space.

    BACKLIGHT MODULE AND DISPLAY DEVICE
    40.
    发明公开

    公开(公告)号:US20230408755A1

    公开(公告)日:2023-12-21

    申请号:US18036859

    申请日:2020-11-17

    Inventor: Qiping ZHANG

    CPC classification number: G02B6/009 G02B6/0088 H05K1/189 H05K2201/10128

    Abstract: A backlight module includes a backplane, a light guide plate, a light bar assembly, and fixing adhesive tape. The backplane includes a bottom plate, a counter plate and a side plate connected to form an accommodating space. The light guide plate is in the accommodating space. The light bar assembly is in a U-shaped slot of the backplane and comprises a flexible circuit board and a light-emitting component. The flexible circuit board is on a side of the light guide plate facing away from the bottom plate, and the light-emitting component is at a side surface of the light guide plate. The fixing adhesive tape is between the counter plate and the flexible circuit board. The orthographic projection of the fixing adhesive tape on the bottom plate does not overlap the orthographic projection of the light-emitting component on the bottom plate.

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