公开(公告)号：US20060249833A1

公开(公告)日：2006-11-09

申请号：US11396603

申请日：2006-04-04

Applicant: Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

Inventor： Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

IPC: H01L23/04 ,  H01L21/4763

CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0733 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49155

Abstract: A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

Abstract translation: 一种用于制造包括绝缘构件的布线板的方法，包括：在所述绝缘构件中形成贯通孔的贯通孔形成工序; 将导电性连接粒子插入贯通孔的配置工序; 将导电层配置在绝缘部件的两面上的连接粒子挤压工序，将导电层朝向穿透孔内的连接粒子按压，使连接粒子沿按压方向变形，得到连接部件; 以及图案化导电层的图案化工艺，其中在连接粒子压制过程中，进行按压使得沿着连接构件的至少一部分的绝缘构件表面的方向上的横截面积大于 连接构件与导电层的接触面积。

公开(公告)号：US07078095B2

公开(公告)日：2006-07-18

申请号：US10886730

申请日：2004-07-07

Applicant: Man C. Tam

Inventor： Man C. Tam

IPC: B32B5/16 ,  B32B7/12

CPC classification number: H05K3/323 ,  H01R4/04 ,  H05K1/0287 ,  H05K3/102 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2203/0522 ,  Y10T428/24917 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2857 ,  Y10T428/2861

Abstract: An anisotropic conductive film includes a release layer, an insulating adhesive matrix on the release layer, and conductive particles distributed in the matrix in a substantially uniform pattern. The film may also include a patterned adhesive layer on the release layer, so that the particles are positioned in a pattern that substantially corresponds to the pattern of the patterned adhesive layer.

Abstract translation: 各向异性导电膜包括剥离层，剥离层上的绝缘粘合剂基质和以基本上均匀的图案分布在基质中的导电颗粒。 膜还可以在剥离层上包括图案化的粘合剂层，使得颗粒以基本对应于图案化粘合剂层的图案的图案定位。

公开(公告)号：US20060131360A1

公开(公告)日：2006-06-22

申请号：US11290942

申请日：2005-11-29

Applicant: Thomas Durston ,  Robert Larkin ,  James Parsons ,  Andrew Devey ,  Alexander Prokop

Inventor： Thomas Durston ,  Robert Larkin ,  James Parsons ,  Andrew Devey ,  Alexander Prokop

IPC: A47J36/02

CPC classification number: H05K3/3494 ,  B23K1/018 ,  B23K2101/40 ,  B23K2101/42 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2203/0195 ,  H05K2203/104 ,  H05K2203/1581 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A thermal attach and detach method and system for surface-mounted components (SMCs) employs a planar-heater which generates heat in response to an electrical current. The heater's resistance varies with its temperature, and the resistance is read to determine heater and SMC temperature. A means of gripping an SMC is provided such that the device's I/O contacts are heated by thermal conduction from the planar-heater through and/or along the SMC's side-walls. An electrical current is provided to the planar-heater such that heat sufficient to attach/detach the I/O contacts to or from a PCB is generated. The method enables the gripping, heating, resistance monitoring and SMC temperature measuring to occur simultaneously. Several means of gripping an SMC are described, including vacuum, mechanical, adhesive and magnetic. A method which employs a heating element to heat a substrate on which SMCs may be mounted is also described.

Abstract translation: 用于表面安装部件（SMC）的热附接和分离方法和系统采用平面加热器，其响应于电流而产生热量。 加热器的电阻随其温度而变化，读取电阻以确定加热器和SMC温度。 提供夹持SMC的装置，使得装置的I / O触点通过来自平面加热器的热传导通过和/或沿着SMC的侧壁被加热。 向平面加热器提供电流，使得产生足以将I / O触点附接到PCB或从PCB去除的热量。 该方法使夹持，加热，电阻监测和SMC温度测量同时发生。 描述了夹紧SMC的几种手段，包括真空，机械，粘合剂和磁性。 还描述了使用加热元件来加热其上可以安装SMC的基板的方法。

公开(公告)号：US07014474B2

公开(公告)日：2006-03-21

申请号：US11102272

申请日：2005-04-08

Applicant: Li Xing Wu ,  Liu Jun Zhang

Inventor： Li Xing Wu ,  Liu Jun Zhang

IPC: H01R12/00

CPC classification number: G11B33/122 ,  G11B5/4806 ,  G11B5/4853 ,  G11B5/486 ,  H01R12/62 ,  H01R43/0256 ,  H05K3/365 ,  H05K2201/10234 ,  H05K2203/041

Abstract: An electrical connection and a method of electrically coupling are disclosed. In one embodiment, a circuit substrate with a first set of circuitry has a bonding pad mounted to a surface of the circuit board. The bonding pad is electrically coupled to the first set of circuitry. A flexible circuit substrate with a second set of circuitry has a connecting pad mounted to a surface of the flexible circuit substrate facing the surface of the circuit board. The connecting pad is electrically coupled to the second set of circuitry. A ball of conductive material is mounted on the bonding pad. A clamping device presses the connecting pad to the ball of conductive material.

Abstract translation: 公开了电气连接和电耦合的方法。 在一个实施例中，具有第一组电路的电路基板具有安装到电路板表面的焊盘。 接合焊盘电耦合到第一组电路。 具有第二组电路的柔性电路基板具有安装到面向电路板表面的柔性电路基板的表面的连接焊盘。 连接焊盘电耦合到第二组电路。 导电材料球安装在焊盘上。 夹紧装置将连接垫压到导电材料球上。

公开(公告)号：US20060023364A1

公开(公告)日：2006-02-02

申请号：US10992836

申请日：2004-11-22

Applicant: Takeshi Ohwe

Inventor： Takeshi Ohwe

IPC: G11B5/48 ,  G11B21/16

CPC classification number: H05K3/361 ,  G11B5/4846 ,  G11B5/486 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0285

Abstract: A head supporting mechanism having a structure for connecting a first end of a suspension side wire, the other end thereof being connected to a magnetic head of a disk apparatus, to a circuit of a disk device via a flexible circuit board is provided, without using solder containing lead so that the both are easily disconnected during repair. A tail terminal (2) provided at the one end of the suspension side wire is disposed to be in surface-contact with a bonding pad (1) of the flexible circuit board (10) and bonded to the latter via a gold ball (6).

Abstract translation: 一种头部支撑机构，其具有用于将悬挂侧线的第一端（其另一端连接到盘装置的磁头）经由柔性电路板连接到盘装置的电路的结构，而不使用 包含铅的焊料使得两者在维修期间容易断开。 设置在悬挂侧线的一端的尾端子（2）设置成与柔性电路板（10）的接合焊盘（1）表面接触，并通过金球（6）与其接合 ）。

公开(公告)号：US06982387B2

公开(公告)日：2006-01-03

申请号：US09884778

申请日：2001-06-19

Applicant: Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

Inventor： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4046 ,  H05K3/4614 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10416

Abstract: A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the conductive element extends beyond a surface of the laminate. A compressive pressure is applied to the portion of the at least one end of the conductive element. The compressive pressure applied to the at least one end of the conductive element forms a contact pad extending beyond the surface of the laminate. The conductive element may include an inner element covered by an outer element.

Abstract translation: 一种用于在层压板内形成导电路径的方法和相关结构。 导电元件被压入层压板中的开口中，使得导电元件的至少一端的一部分延伸超过层压体的表面。 对导电元件的至少一个端部的部分施加压缩压力。 施加到导电元件的至少一个端部的压缩压力形成延伸超过层压体表面的接触垫。 导电元件可以包括被外部元件覆盖的内部元件。

公开(公告)号：US06913187B2

公开(公告)日：2005-07-05

申请号：US10609955

申请日：2003-06-30

Applicant: Lars-Anders Olofsson

Inventor： Lars-Anders Olofsson

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  B23K31/00 ,  B21D39/00 ,  B23K1/20 ,  B23K35/12

CPC classification number: H05K3/4046 ,  H05K1/0204 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10416

Abstract: A method of providing thermal vias in a printed circuit board that includes one or more layers of board material is disclosed. The vias provide for conducting heat from components mounted on the board. One or more holes (4) are provided in a printed circuit board that may include several metal layers. A metal ball (6) is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall (5) of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside (2) and bottom side (3) of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.

Abstract translation: 公开了一种在包括一层或多层板材的印刷电路板中提供热通孔的方法。 通孔提供从安装在电路板上的组件传导热量。 一个或多个孔（4）设置在可包括若干金属层的印刷电路板中。 将金属球（6）插入每个孔中并施加压力以使所述球变形，并将所得的块塞紧紧地固定在所述孔的壁（5）上。 固定在孔中的可能具有金属化内表面的变形的球或块被用来在印刷电路板的金属化顶部（2）和底侧（3）之间以及中间金属化层之间传导热和/或电 在多层板的情况下。

公开(公告)号：US20050121227A1

公开(公告)日：2005-06-09

申请号：US10726888

申请日：2003-12-04

Applicant: Douglas Albert

Inventor： Douglas Albert

IPC: H01L21/60 ,  H05K3/32 ,  H05K3/36 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K3/328 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K3/366 ,  H05K2201/10234 ,  H05K2201/10727 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  H01L2224/05599

Abstract: A method for electrical interconnection of angularly disposed and abutted conductive patterns is disclosed along with a device created from the method. Conventional wire bonding equipment is used to apply a conductive metal ball at the junction of angularly disposed conductive patterns by orienting a cornerbond assembly whereby one or more conductive metal balls are orthogonally applied and electrically connected to the respective conductive patterns.

Abstract translation: 公开了一种用于角配置和邻接的导电图案的电互连的方法以及从该方法创建的装置。 常规的引线接合设备用于通过定向拐角组合件来将角度设置的导电图案的接合处施加导电金属球，由此一个或多个导电金属球正交地施加并电连接到相应的导电图案。

公开(公告)号：US06787921B2

公开(公告)日：2004-09-07

申请号：US10291019

申请日：2002-11-08

Applicant: Chien-Ping Huang

Inventor： Chien-Ping Huang

IPC: H01L2348

CPC classification number: H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A solder ball array type package structure is able to control collapse. The package includes a substrate, a carrier, a plurality of dies, a molding compound and a plurality of solder balls. The substrate has at least one active surface. Pads are located on the first surface of the substrate. The carrier has at least an active surface and a back surface opposite the active surface. A plurality of dies are located on the back surface and the active surface of the carrier. The dies arranged on the active surface are electrically connected to the carrier by flip chip technology. A molding compound encapsulates on the back surface of the carrier to cover the dies on the back surface of the carrier. Solder balls having a base material are provided on the active surface of the carrier in array. At least three solder balls coated with the base material having a high melting-temperature core are further provided in the periphery of the array. The carrier is arranged such that the active surface faces the first surface of the substrate to allow each solder ball correspond to the one of the pads, respectively.

公开(公告)号：US20040140877A1

公开(公告)日：2004-07-22

申请号：US10624379

申请日：2003-07-22

Inventor： Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

IPC: H01F005/00

CPC classification number: H01L23/552 ,  H01F19/08 ,  H01F27/28 ,  H01F27/292 ,  H01L23/49811 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/00 ,  H02M3/158 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/0212 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10234 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A surface-mount microconverter is formed by mounting a microinductor chip and a semiconductor integrated circuit chip on a circuit board. Stud terminals are arranged on the circuit board and the microinductor chip is supported on the stud terminals, and the microinductor chip and the semiconductor integrated circuit chip are superposed on the circuit board. The microconverter has an improved ability and is small and thin. The microconverter includes an effective laminated magnetic-core inductor. The inductor comprises a helical coil formed by uniting alternately superposed insulating magnetic layers and conductive pattern layers, and an annular closed magnetic path formed by the insulating magnetic layers and defining a magnetic field created by the coil. The inductor can be miniaturized in a thin chip, and a wide range in which magnetic flux density varies linearly can be secured by balancing a closed magnetic path for a magnetic field created by the coil.

Abstract translation: 表面安装微型转换器通过将微型电感芯片和半导体集成电路芯片安装在电路板上而形成。 螺柱端子布置在电路板上，微电感芯片支撑在螺柱端子上，微电感芯片和半导体集成电路芯片叠加在电路板上。 微型转换器具有改进的能力，体积小而薄。 微型转换器包括有效的层叠磁芯电感器。 电感器包括通过将交替叠置的绝缘磁性层和导电图案层相互组合形成的螺旋线圈和由绝缘磁性层形成并限定由线圈产生的磁场的环形闭合磁路。 电感器可以在薄的芯片中小型化，并且可以通过平衡由线圈产生的磁场的闭合磁路来确保磁通密度线性变化的宽范围。