公开(公告)号：US09847267B2

公开(公告)日：2017-12-19

申请号：US14904771

申请日：2014-11-18

Applicant: KYOCERA Corporation

Inventor： Noritaka Niino

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  H01L21/50 ,  H03H9/10 ,  H01L23/08 ,  H01L41/053 ,  H05K9/00 ,  H05K5/00 ,  H05K1/02

CPC classification number: H01L23/053 ,  H01L21/50 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L41/053 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H03H9/1014 ,  H03H9/1071 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/183 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K9/0098 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/10371 ,  H01L2924/00014

Abstract: An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

公开(公告)号：US09832859B2

公开(公告)日：2017-11-28

申请号：US14813448

申请日：2015-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Won Lee ,  Hyun-Tae Jang ,  Jung Je Bang

IPC: H05K7/00 ,  H05K1/02 ,  G06F1/18 ,  H05K9/00 ,  H05K1/18

CPC classification number: H05K1/0216 ,  G06F1/18 ,  H05K1/181 ,  H05K9/0032 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.

公开(公告)号：US09807890B2

公开(公告)日：2017-10-31

申请号：US13906892

申请日：2013-05-31

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Joseph Byron Bullis

IPC: H05K3/40 ,  H05K1/14 ,  H01L23/31 ,  H01L23/00 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K3/4007 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48229 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/10371 ,  Y10T29/4902 ,  Y10T29/49146 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

公开(公告)号：US09775265B2

公开(公告)日：2017-09-26

申请号：US15195510

申请日：2016-06-28

Applicant: KYOCERA Document Solutions Inc.

Inventor： Shogo Yoneda

IPC: H05K7/20 ,  H05K9/00 ,  H05K1/02

CPC classification number: H05K7/20154 ,  H05K1/0209 ,  H05K1/0216 ,  H05K7/20145 ,  H05K9/0022 ,  H05K2201/066 ,  H05K2201/10371

Abstract: A heatsink to be mounted on a circuit board including a plurality of electronic parts is constituted of a conductive and rectangular plate-shaped member, and mounted on the circuit board such that a main surface of the heatsink blocks an airflow generated on the circuit board, the heatsink being electrically grounded. The main surface includes a contacting portion disposed in contact with the circuit board and an isolated portion separated from the circuit board, the isolated portion being cut into two parts along a straight line extending in a direction away from the circuit board. The two parts are each bent such that an end portion on a side of the straight line is oriented to a downstream side of the airflow, so that an opening is defined between the respective end portions of the two parts on the side of the straight line.

公开(公告)号：US09743564B2

公开(公告)日：2017-08-22

申请号：US14830351

申请日：2015-08-19

Applicant: Apple Inc.

Inventor： Shayan Malek ,  David A. Pakula ,  Gregory N. Stephens ,  Jason Sloey

IPC: H05K7/00 ,  H05K9/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K9/0032 ,  H05K1/0216 ,  H05K1/181 ,  H05K2201/10371 ,  Y02P70/611

Abstract: An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.

公开(公告)号：US20170094779A1

公开(公告)日：2017-03-30

申请号：US15147227

申请日：2016-05-05

Applicant: Samsung Display Co., Ltd.

Inventor： Jeonghun GO ,  Ung CHOI ,  Seonghyun GO

IPC: H05K1/02 ,  G09G3/20 ,  H05K1/18

CPC classification number: H05K1/0216 ,  G09G3/2092 ,  G09G2300/0426 ,  G09G2310/027 ,  G09G2330/06 ,  H05K1/0201 ,  H05K9/0026 ,  H05K9/0041 ,  H05K2201/10128 ,  H05K2201/10371

Abstract: A drive circuit unit includes: a printed circuit board; an electronic device disposed on the printed circuit board; and a shield can disposed on the printed circuit board to surround the electronic device such that an electromagnetic wave generated in the electronic device is shielded, and the shield can further includes a shield cover which overlaps at least a portion of a heat ventilation hole defined in a wall of the shield can in a vertical direction.

公开(公告)号：US09609738B1

公开(公告)日：2017-03-28

申请号：US14560807

申请日：2014-12-04

Applicant: Flextronics AP, LLC

Inventor： Dennis Willie ,  Richard Loi ,  David Geiger ,  Anwar Mohammed ,  Murad Kurwa ,  Hector Rene Marin Hernandez

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20

CPC classification number: H05K1/0201 ,  H01L23/373 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/181 ,  H05K3/3494 ,  H05K7/20209 ,  H05K7/2039 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/062 ,  H05K2201/10371 ,  H05K2203/304

Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. The formed graphite sheet is shaped to selective direct impinging heat. The heat can be directly away from the entire electronic component. Alternatively, the heat can be selectively directed away from some portions of the electronic component and toward other portions of the electronic component.

公开(公告)号：US20170055340A1

公开(公告)日：2017-02-23

申请号：US15240744

申请日：2016-08-18

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： XUN WU ,  GUO-XIANG NIU

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H05K9/0032 ,  H05K2201/10371

Abstract: A shielding device mounted upon a printed circuit board comprises a shielding shell including a top wall, a sidewall and at least a clamping means extending downwardly therefrom respectively, which surrounds a receiving cavity defined by the shielding shell; at least a bracket removably clamped within said clamping means and fixed upon said printed circuit board; wherein the clamping means includes a first clamping part and a second clamping part respectively abutting elastically against two opposite sides of said bracket.

Abstract translation: 安装在印刷电路板上的屏蔽装置包括屏蔽壳体，该屏蔽壳体包括顶壁，侧壁和分别向下延伸的至少一个夹持装置，该装置包围由屏蔽壳限定的接收腔; 至少一个支架可移除地夹紧在所述夹紧装置内并固定在所述印刷电路板上; 其中夹紧装置包括分别抵靠所述支架的两个相对侧弹性抵靠的第一夹紧部分和第二夹紧部分。

公开(公告)号：US20170048963A1

公开(公告)日：2017-02-16

申请号：US15208944

申请日：2016-07-13

Applicant: FUJITSU LIMITED

Inventor： HAJIME MURAKAMI

IPC: H05K1/02 ,  H05K1/14 ,  H01L23/31 ,  H05K1/11

CPC classification number: H05K1/023 ,  G06F1/183 ,  G06F1/184 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0262 ,  H05K1/113 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A noise reduction board includes: a first board; a second board arranged under the first board; a plurality of power feeding parts made of a metal in a shape of a pole and configured to electrically interconnect the first board and the second board; and a noise reduction part arranged between the power feeding parts, wherein the noise reduction part includes: a metal plate; an insulator configured to cover a surface of the metal plate; a first terminal provided on the side of the first board of the metal plate and electrically coupled to a ground pattern of the first board; and a second terminal provided on the side of the second board of the metal plate and electrically coupled to a ground pattern of the second board.

Abstract translation: 降噪板包括：第一板; 布置在第一板下的第二板; 多个供电部，其由金属制成，其形状为极，并且构造成使所述第一板和所述第二板电连接; 以及设置在所述供电部之间的降噪部，其中所述降噪部包括：金属板; 被配置为覆盖所述金属板的表面的绝缘体; 第一端子，设置在所述金属板的所述第一板的一侧上并电耦合到所述第一板的接地图案; 以及第二端子，设置在所述金属板的所述第二板的一侧并电耦合到所述第二板的接地图案。

公开(公告)号：US20170042018A1

公开(公告)日：2017-02-09

申请号：US15106339

申请日：2014-06-09

Applicant: ZTE Corporation

Inventor： Yunyun LONG

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/0209 ,  H05K1/18 ,  H05K7/20445 ,  H05K9/0032 ,  H05K2201/10371

Abstract: A dual layer shielding cover is provided and includes a dual layer structure with an upper layer shielding cover (22) and a lower layer shielding cover (21). The dual layer shielding cover is formed by stamping through a mould, for example, formed by bending and stretching, etc.

Abstract translation: 提供双层屏蔽盖，并且包括具有上层屏蔽盖（22）和下层屏蔽盖（21）的双层结构。 双层屏蔽罩通过冲压通过模具形成，例如通过弯曲和拉伸等形成。