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公开(公告)号：US20050146019A1
公开(公告)日：2005-07-07
申请号：US11048861
申请日：2005-02-03
Applicant: Yuki Momokawa
Inventor： Yuki Momokawa
CPC classification number: H05K3/3452 , H05K3/301 , H05K3/306 , H05K3/3447 , H05K3/3463 , H05K2201/099 , H05K2201/10568 , H05K2201/10575 , H05K2201/10901 , H05K2201/10909 , H05K2201/2036 , H05K2201/2081 , H05K2203/0182 , H05K2203/0577 , H05K2203/0588 , H05K2203/1189 , H05K2203/1394
Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.
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公开(公告)号：US20050029552A1
公开(公告)日：2005-02-10
申请号：US10931844
申请日：2004-08-31
IPC: H01L21/56 , H01L23/00 , H01L23/498 , H05K3/30 , H05K3/34 , H01L27/148
CPC classification number: H01L23/562 , H01L21/563 , H01L23/49894 , H01L2924/0002 , H01L2924/3511 , H05K3/303 , H05K3/3436 , H05K2201/10568 , H05K2201/10734 , H05K2201/10977 , H05K2201/2036 , Y02P70/613 , Y10S438/926 , Y10S438/928 , Y10T428/24 , Y10T428/24802 , Y10T428/24917 , H01L2924/00
Abstract: A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a molding compound to attach the substrate to the package substrate.
Abstract translation: 一种包括封装基板的封装，包括基板的模具基板组件，所述基板包括多个层，所述基板包括具有网状物的层，所述层具有适于安装一个或多个骰子的基板以加固所述基板，一个或多个骰子安装在所述基板上， 以将衬底附接到封装衬底。
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33.发明申请Method for providing socket on substrate and socket applied with such method 审中-公开在基板和插座上提供插座的方法，应用这种方法公开(公告)号：US20040253862A1
公开(公告)日：2004-12-16
申请号：US10864318
申请日：2004-06-10
Applicant: YAMAICHI ELECTRONICS CO., LTD.
Inventor： Hiroaki Masaki , Takuma Utsumi , Noriyuki Matsuoka
IPC: H01R013/64
CPC classification number: H01R12/58 , H01R12/7023 , H01R13/24 , H05K3/306 , H05K3/308 , H05K2201/10325 , H05K2201/10424 , H05K2201/10568 , H05K2201/1059 , H05K2201/10598 , H05K2201/10787
Abstract: A method is provided, comprising the steps of inserting the contact terminal section of the contact provided in a socket into a hole provided in the substrate, sliding the socket relative to a surface of the substrate on which the hole is formed, while maintaining the state in which the contact terminal section is inserted into the hole provided in the substrate, and fixing the socket and the contact terminal section to the substrate, while maintaining the state in which the socket and the contact terminal section are made to slide.
Abstract translation: 提供了一种方法，包括以下步骤：将设置在插座中的触点的接触端子部分插入到设置在基板中的孔中，相对于其上形成有孔的基板的表面滑动插座，同时保持状态 其中接触端子部分插入到设置在基板中的孔中，并且将插座和接触端子部分固定到基板，同时保持插座和接触端子部分滑动的状态。
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公开(公告)号：US20040206802A1
公开(公告)日：2004-10-21
申请号：US10414198
申请日：2003-04-16
Inventor： Ted Ju
IPC: B23K031/02
CPC classification number: H05K3/3421 , B23K1/0016 , B23K2101/38 , G06Q30/0601 , G06Q40/04 , H01R43/0256 , H05K3/303 , H05K2201/10189 , H05K2201/10568 , H05K2201/2036 , Y02P70/613
Abstract: In a process of soldering an electric connector on a circuit board, the connector has an insulator and a plurality of leads mounted inside the insulator. Each lead has a first end extending into a soldering terminal to a bonding surface of the insulator. A soft solder paste is dispensed over a bonding surface of the circuit board. The soldering process inserts the soldering terminal of each lead in the soft solder paste and applies heat to the soft solder paste to bond the soldering terminal and the circuit board together. The direct insertion of the soldering terminal of the lead into the soft paste on the circuit board minimizes the contact area between the lead and the circuit board and prevents the solder paste from being unduly spread, causing short circuit. Furthermore, the yield and soldering reliability are increased and the production cost is reduced.
Abstract translation: 在将电连接器焊接在电路板上的过程中，连接器具有绝缘体和安装在绝缘体内部的多个引线。 每个引线具有延伸到焊接端子到第一绝缘体的接合表面的第一端。 软电焊膏被分配在电路板的接合表面上。 焊接工艺将每个引线的焊接端子插入软焊锡膏中，并将热量施加到软焊膏上，将焊接端子和电路板粘合在一起。 将引线的焊接端子直接插入到电路板上的软膏中，使引线和电路板之间的接触面积最小化，防止焊膏过度扩散，导致短路。 此外，提高了成品率和焊接可靠性，降低了生产成本。
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公开(公告)号：US06805277B1
公开(公告)日：2004-10-19
申请号：US10414198
申请日：2003-04-16
Applicant: Ted Ju
Inventor： Ted Ju
IPC: B23K3100
CPC classification number: H05K3/3421 , B23K1/0016 , B23K2101/38 , G06Q30/0601 , G06Q40/04 , H01R43/0256 , H05K3/303 , H05K2201/10189 , H05K2201/10568 , H05K2201/2036 , Y02P70/613
Abstract: In a process of soldering an electric connector on a circuit board, the connector has an insulator and a plurality of leads mounted inside the insulator. Each lead has a first end extending into a soldering terminal to a bonding surface of the insulator. A soft solder paste is dispensed over a bonding surface of the circuit board. The soldering process inserts the soldering terminal of each lead in the soft solder paste and applies heat to the soft solder paste to bond the soldering terminal and the circuit board together. The direct insertion of the soldering terminal of the lead into the soft paste on the circuit board minimizes the contact area between the lead and the circuit board and prevents the solder paste from being unduly spread, causing short circuit. Furthermore, the yield and soldering reliability are increased and the production cost is reduced.
Abstract translation: 在将电连接器焊接在电路板上的过程中，连接器具有绝缘体和安装在绝缘体内部的多个引线。 每个引线具有延伸到焊接端子到第一绝缘体的接合表面的第一端。 软电焊膏被分配在电路板的接合表面上。 焊接工艺将每个引线的焊接端子插入软焊锡膏中，并将热量施加到软焊膏上，将焊接端子和电路板粘合在一起。 将引线的焊接端子直接插入到电路板上的软膏中，使引线和电路板之间的接触面积最小化，防止焊膏过度扩散，导致短路。 此外，提高了成品率和焊接可靠性，降低了生产成本。
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Patent Agency Ranking
公开(公告)号：US20040173888A1
公开(公告)日：2004-09-09
申请号：US10732309
申请日：2003-12-11
Inventor： Kenichi Shirasaka
IPC: H01L023/02
CPC classification number: H05K3/303 , H01L23/544 , H01L2223/54406 , H01L2223/5442 , H01L2223/54473 , H01L2223/54486 , H01L2924/1815 , H05K1/0269 , H05K2201/09936 , H05K2201/10568 , H05K2201/10689 , H05K2203/168 , Y02P70/613 , Y10S438/975
Abstract: To provide a semiconductor package mounting method, with excellent work efficiency, wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.
Abstract translation: 为了提供具有优异的工作效率的半导体封装安装方法，其中可以通过在安装之前的简单方法来验证半导体封装的方向。 设置在半导体封装体的表面上的方形显示部分的一个角部被倒角，使得倒角尺寸与其他角部的尺寸不同。 如果照相机的图像识别确定该倒角部分正确定位，则确定半导体封装的取向是正确的。 另一方面，如果图像识别确定其不正确定位，则调整半导体封装的取向直到其正确。
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公开(公告)号：US20040092174A1
公开(公告)日：2004-05-13
申请号：US10666945
申请日：2003-09-19
Inventor： Daniel S. Eichorn , Michael W. Allender , Dominic Anthony Messuri , Christopher Alan Brandon
IPC: H01R004/02
CPC classification number: H01R12/58 , H01R12/523 , H05K3/306 , H05K3/3447 , H05K2201/10303 , H05K2201/10424 , H05K2201/10568 , H05K2201/2036 , Y10T29/49147
Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics. The preferred embodiment limits normal forces caused by temperature cycling, vibration, and other conditions to two areas of contact yet enables adequately low electrical contact resistance.
Abstract translation: 提供电连接，使得定位在销块中的端子销延伸穿过电路板基板中的电镀通孔，并且使用诸如焊料的导电粘合剂与电路板连接。 端子引脚能够与位于电路板的每个主要侧面上的导电元件相互连接，并且不需要端子引脚和电路板之间的过盈配合。 销块包括主体和至少一个支架。 支架将主体与电路板基板保持足够的距离，以便在再流动处理期间能够在电镀通孔和端子销之间形成焊锡圆角。 电气互连还包括电路板中的偏心孔，其适于与诸如在具有差的可焊性特性的电气接地上的突出圆柱形特征相互连接的过盈配合。 优选的实施例将由温度循环，振动和其他条件引起的正常力限制到两个接触区域，但是能够实现足够低的电接触电阻。
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公开(公告)号：US06649444B2
公开(公告)日：2003-11-18
申请号：US10000438
申请日：2001-10-24
Applicant: Warren M. Earnworth , Alan G. Wood
Inventor： Warren M. Earnworth , Alan G. Wood
IPC: H01L2144
CPC classification number: H01L24/81 , B33Y10/00 , B33Y30/00 , B33Y80/00 , G03F7/70416 , H01L24/14 , H01L24/75 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/13099 , H01L2224/14 , H01L2224/75 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K1/0269 , H05K3/0023 , H05K3/303 , H05K2201/09909 , H05K2201/10568 , H05K2201/10674 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00 , H01L2224/05599
Abstract: Insulative spacers to be disposed on a surface of a semiconductor device component and methods of fabricating and placing the insulative spacers on semiconductor device components. Upon assembly of the semiconductor device component face-down upon a higher level substrate and establishing electrical communication between the semiconductor device component and the higher level substrate, the insulative spacers define a minimum, substantially uniform distance between the semiconductor device component and the higher level substrate. The insulative spacers also prevent tilting or tipping of the semiconductor device component relative to the higher level substrate. The insulative spacers may be preformed or fabricated on a surface of the semiconductor device component. A stereolithographic method for fabricating the insulative spacers is disclosed, which may employ a machine vision system to recognize the position and orientation of a substrate to which material is to be applied and control fabrication based upon the recognized position and orientation.
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公开(公告)号：US20030209785A1
公开(公告)日：2003-11-13
申请号：US10379979
申请日：2003-03-04
Inventor： Seung-Yong Choi , Seung-Han Paek
IPC: H01L023/495
CPC classification number: H05K3/303 , H01L23/3107 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H05K2201/10568 , H05K2201/10689 , H05K2201/2036 , Y02P70/613 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
Abstract: A semiconductor package mounted on a printed circuit board using improved-reliability solder joints is described. The semiconductor package includes a lead frame pad and lead frame lead attached to the solder joints, a semiconductor chip mounted on top of the lead frame pad, wires electrically connecting the semiconductor chip and the lead frame lead, an epoxy molding compound that exposes the lower portion surface of the lead frame pad and part of the lead frame lead, and protrusions fixed to the lower portion surface of the epoxy molding compound and positioned between the solder joints, with the protrusions supporting the semiconductor package when the epoxy molding compound is mounted on the printed circuit board.
Abstract translation: 描述了使用改进的可靠性焊接接头安装在印刷电路板上的半导体封装。 半导体封装包括引线框架焊盘和附接到焊接点的引线框架引线，安装在引线框架焊盘顶部的半导体芯片，电连接半导体芯片和引线框架引线的导线，暴露下部的环氧树脂模塑料 引线框架衬垫的部分表面和引线框架引线的一部分，以及固定到环氧树脂模制化合物的下部表面并位于焊料接头之间的凸起，当环氧模塑料安装在其上时，凸起支撑半导体封装 印刷电路板。
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40.发明申请Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board 失效布线板和安装在布线板上的电子部件的电子设备以及将电子部件安装在布线板上的方法公开(公告)号：US20030196831A1
公开(公告)日：2003-10-23
申请号：US10419197
申请日：2003-04-21
Applicant: NEC Corporation
Inventor： Yuki Momokawa
IPC: H05K001/09
CPC classification number: H05K3/3452 , H05K3/301 , H05K3/306 , H05K3/3447 , H05K3/3463 , H05K2201/099 , H05K2201/10568 , H05K2201/10575 , H05K2201/10901 , H05K2201/10909 , H05K2201/2036 , H05K2201/2081 , H05K2203/0182 , H05K2203/0577 , H05K2203/0588 , H05K2203/1189 , H05K2203/1394
Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.
Abstract translation: 电子装置安装在布线板上，其包括：具有通孔的基板和在基板的表面上延伸并与通孔的开口相邻的台阶。 此外，提供至少一个涂层，其涂覆至少一个焊盘的外周区域的至少一部分，以便使至少一个部件与无铅焊料分离，从而防止任何 从基材表面剥离土地。
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