公开(公告)号：US20120188742A1

公开(公告)日：2012-07-26

申请号：US13011140

申请日：2011-01-21

Applicant: Don A. Gilliland ,  David B. Johnson ,  Dennis J. Wurth

Inventor： Don A. Gilliland ,  David B. Johnson ,  Dennis J. Wurth

IPC: H05K7/02 ,  H05K13/00

CPC classification number: H05K3/222 ,  H01G2/065 ,  H05K1/0231 ,  H05K1/025 ,  H05K2201/10628 ,  Y10T29/49002

Abstract: A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.

Abstract translation: 提供了一种实现具有对称参考平衡的表面贴装元件的方法和结构。 在表面安装器件（SMD）封装中接收第一参考和输入信号，并且第二参考信号被接收并且输出信号从SMD封装输出。 电容器结构在SMD封装内定义在第一个参考和第二个参考之间。 电容器结构包括在第一参考和第二参考之间的平衡阻抗结构。 连接在接收的输入信号和输出信号之间的分量通常位于电容器结构内。

公开(公告)号：US20090264004A1

公开(公告)日：2009-10-22

申请号：US12424341

申请日：2009-04-15

Applicant: Neil S. Sherman ,  Brian H. Steuer

Inventor： Neil S. Sherman ,  Brian H. Steuer

IPC: H01R13/62

CPC classification number: H01R12/57 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/2421 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

Abstract: A connector device for maintaining a desired spatial relationship for spatially and securely connecting to a platform, such as a circuit board, in an efficient manner. The connector device generally includes a body portion separated from the secondary device, a plurality of legs extending from the body portion for removably attaching the body portion to the secondary device, wherein the plurality of legs each include a foot member insertable within an opening of the secondary device for grasping the secondary device and at least one contact pin extending from the body portion to contact the secondary device on an opposite surface as the foot member. The contact pin maintains the separation between the body portion and the secondary device and includes a spring for providing a counter force against the secondary device with respect to the foot member.

Abstract translation: 一种连接器装置，用于以有效的方式保持用于空间和牢固地连接到平台（例如电路板）的期望的空间关系。 连接器装置通常包括与次级装置分离的主体部分，从主体部分延伸的多个腿部，用于可拆卸地将主体部分附接到次要装置，其中多个腿部各自包括可插入到第二装置的开口内的脚部件 用于抓握次级装置的次级装置和从主体部分延伸的至少一个接触销，以在与脚部件相反的表面上接触次级装置。 接触销保持主体部分和次要装置之间的分离，并且包括用于相对于脚部构件提供抵抗次级装置的反作用力的弹簧。

公开(公告)号：US20090034219A1

公开(公告)日：2009-02-05

申请号：US12184086

申请日：2008-07-31

Applicant: Nader Gamini ,  Joseph C. Fjelstad

Inventor： Nader Gamini ,  Joseph C. Fjelstad

IPC: H05K1/18 ,  H05K7/02

CPC classification number: H05K1/185 ,  H01L25/105 ,  H01L25/16 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H05K1/023 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.

Abstract translation: 公开了一种提高电路组件中的电气部件的密度的装置。 电子部件202,204被堆叠成使得它们彼此重叠并且被封装在电子绝缘材料104中。所得到的子组件可以集成到印刷电路板或反向互连工艺组件中。

公开(公告)号：US20080277151A1

公开(公告)日：2008-11-13

申请号：US12119287

申请日：2008-05-12

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: H05K1/00 ,  B23K31/02

CPC classification number: H05K1/185 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/1241 ,  H05K3/4602 ,  H05K3/4664 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.

Abstract translation: 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1700。 组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。 该组件用电绝缘材料908封装，其中通孔420,1002通过衬底808形成或钻孔1000穿过组件引线412。 然后将组件电镀1200，并重复封装和钻孔工艺1500以建立所需的层422,1502,1702。

公开(公告)号：US20060205113A1

公开(公告)日：2006-09-14

申请号：US11079143

申请日：2005-03-14

Applicant: Robert Oberle

Inventor： Robert Oberle

IPC: H01L21/50

CPC classification number: H01L23/3164 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2924/0102 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/3484 ,  H05K2201/10628 ,  H05K2203/1311 ,  Y02P80/30 ,  H01L2924/00

Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

Abstract translation: 构造RFID单元的方法可以包括使用保护层来将导电粘合剂尚未完全设定的状态下将集成电路芯片模块保持在具有天线单元的基板层上。

公开(公告)号：US06462955B1

公开(公告)日：2002-10-08

申请号：US09395006

申请日：1999-09-13

Applicant: Jonathan F. Roberts

Inventor： Jonathan F. Roberts

IPC: H05K710

CPC classification number: H05K3/303 ,  H05K1/189 ,  H05K3/301 ,  H05K3/3421 ,  H05K13/0465 ,  H05K13/0482 ,  H05K2201/0394 ,  H05K2201/10393 ,  H05K2201/10628 ,  H05K2203/0173 ,  H05K2203/167 ,  Y02P70/613

Abstract: A component alignment casing system for connecting circuits, and a method for making or assembling the component alignment casing system is disclosed. The system has at least one surface mountable component which has a plurality of exposed leads, a prepared component which has a plurality of exposed traces, an alignment base onto which the prepared component and the surface mountable component are laid, and a compressive cover that attaches to said alignment base. The alignment base has a plurality of alignment ribs to isolate and align the exposed traces of the prepared component. The prepared component and surface mountable components are electrically connected and attached together, preferably by soldering. The method comprises laying the prepared component on the alignment base and ribs, and overlaying the surface mountable component, with its exposed leads, on to the alignment base and the prepared component, and electrically connecting the components together, preferably by soldering, to the alignment base. The cover is then snapped on, and supplies compressive force to assure good contact between the leads of the surface mountable component and the traces of the prepared component.

Abstract translation: 公开了一种用于连接电路的部件对准壳体系统，以及用于制造或组装部件对准套管系统的方法。 该系统具有至少一个可表面安装的部件，其具有多个暴露引线，具有多个暴露迹线的准备部件，放置准备的部件和可表面安装的部件的对准基座以及附接的压缩盖 到所述对准基座。 对准基座具有多个对准肋以隔离并对准所制备的部件的暴露痕迹。 所制备的组件和表面可安装部件优选通过焊接电连接并附接在一起。 该方法包括将准备的部件放置在对准基座和肋上，并将表面安装部件与其暴露的引线重叠在对准基座和准备的部件上，并将部件优选地通过焊接电连接到对准 基础。 然后盖上盖子，并提供压缩力以确保表面可安装部件的引线与准备的部件的迹线之间的良好接触。

公开(公告)号：US5373276A

公开(公告)日：1994-12-13

申请号：US38303

申请日：1993-03-29

Applicant: Anthony J. Suppelsa ,  Fadia Nounou ,  Anthony B. Suppelsa

Inventor： Anthony J. Suppelsa ,  Fadia Nounou ,  Anthony B. Suppelsa

IPC: H01F27/29 ,  H05K3/34 ,  H01F15/02 ,  H01F15/10

CPC classification number: H01F27/292 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10628 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613

Abstract: A self centering coil (200) includes a coil section (202) and also having curved end section (206) and (204) at opposite sides of the coil section (202). The curved end sections are preferably substantially flat and in a plane which is parallel to the center axis (306) of the coiled section (202).

Abstract translation: 自对中线圈（200）包括线圈部分（202），并且在线圈部分（202）的相对侧上还具有弯曲端部部分（206）和（204）。 弯曲的端部部分优选地基本上是平的并且在平行于盘绕部分（202）的中心轴线（306）的平面内。

公开(公告)号：US4864471A

公开(公告)日：1989-09-05

申请号：US904636

申请日：1986-09-08

Applicant: Hans Hargasser ,  Joachim Dathe

Inventor： Hans Hargasser ,  Joachim Dathe

IPC: H01L21/52 ,  H01L21/58 ,  H05K3/30

CPC classification number: H05K3/305 ,  H01L2224/83138 ,  H01L2924/10158 ,  H05K2201/09036 ,  H05K2201/10568 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/0191 ,  Y02P70/613 ,  Y10S29/039 ,  Y10T29/4913

Abstract: A component for surface mounting is fixed by means of adhesive to a surface of a member. For improving the adhesion, the fixable surface of the component includes a structure which makes it possible, first, for this fixable surface to lie flush against the surface of the member. Second, the structure of the fixable surface also makes it possible for a quantity of adhesive adequate for fixing to remain between the fixable surface of the component and the surface of the member.

Abstract translation: 用于表面安装的部件通过粘合剂固定到部件的表面。 为了改善附着力，组件的可固定表面包括使得可以首先使该固定表面与构件的表面齐平的结构。 第二，可固定表面的结构也使得一定量的用于固定的粘合剂可以保留在构件的可固定表面和构件的表面之间。

公开(公告)号：US4860433A

公开(公告)日：1989-08-29

申请号：US84332

申请日：1987-08-11

Applicant: Norio Miura

Inventor： Norio Miura

IPC: H01F27/29 ,  H01F41/10 ,  H05K3/32

CPC classification number: H05K3/328 ,  H01F27/292 ,  H01F41/10 ,  H01L2224/78301 ,  H01L2924/19107 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2203/0285 ,  Y10T29/49071 ,  Y10T29/49144 ,  Y10T29/49162 ,  Y10T29/49179

Abstract: An inductance element comprises conductive paths of copper and a spool member arranged on a substrate, and insulated winding formed by a fine copper wire whose surface is coated with an insulating film of urethane etc. is wound around the spool member so that both end portions thereof are subjected to ultrasonic vibration by an ultrasonic bonding apparatus to be connected to the conductive paths by ultrasonic bonding. Thus, the end portions of the winding can be processed by local heating with application of ultrasonic vibration, whereby the coil needs not be entirely heated and an inductance element can be readily implemented directly on the substrate.

Abstract translation: 电感元件包括铜的导电路径和布置在基板上的卷轴构件，由表面涂覆有聚氨酯等的绝缘膜的细铜线形成的绝缘绕组缠绕在卷轴构件上，使得其两端部 通过超声波接合装置进行超声波振动，通过超声波接合与导电路径连接。 因此，可以通过施加超声波振动的局部加热来加工绕组的端部，由此不需要完全加热线圈，并且可以容易地在基板上实现电感元件。

公开(公告)号：US11927431B1

公开(公告)日：2024-03-12

申请号：US16602843

申请日：2019-12-10

Applicant: Northrop Grumman Systems Corporation

Inventor： James D. Lucas ,  Eric M. McDonough

IPC: F42B3/12 ,  F42C11/04 ,  F42D1/05 ,  H01L23/498 ,  H05K1/18

CPC classification number: F42B3/124 ,  F42C11/04 ,  F42D1/05 ,  H01L23/49811 ,  H05K1/181 ,  F42B3/121 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: A capacitive discharge unit (CDU) for detonating an explosive in response to a control signal comprises a set of CDU components, including an exploding foil initiator (EFI), a trigger circuit, a firing capacitor, and an insulated-gate bipolar transistor (IGBT) firing switch. In various embodiments the components are arranged on a board for mechanically and electrically supporting the components in an ordered arrangement along a CDU axis where the CDU having an axial length defined by the ordered arrangement of two or more of the EFI, the firing capacitor, and the IBGT firing switch, wherein the trigger circuit is offset from the CDU axis such that the trigger circuit does not contribute to the axial length.