公开(公告)号：US20200001011A1

公开(公告)日：2020-01-02

申请号：US16490310

申请日：2018-03-06

Applicant: NAMICS CORPORATION

Inventor： Hiroki MYODO ,  Toyokazu HOTCHI ,  Masaaki HOSHIYAMA

IPC: A61M5/28 ,  B05C11/10 ,  A61M5/31

Abstract: Provided are a filled syringe and a method for storing a resin composition, which can suppress generation of a void between the resin composition and an inner surface of the syringe. A filled syringe 1 includes a syringe 10, a plunger 20, and a resin composition 30. When a longitudinal direction of the syringe 10 is a vertical direction and the plunger 20 is above the resin composition 30, a ratio of a cross-sectional area 25 of the plunger at a position of a liquid level 31 at top of the resin composition to a cross-sectional area 35 enclosed by an inner surface 11 of the syringe at the same position as the liquid level 31 at the top of the resin composition is 95% or less.

公开(公告)号：US10388583B2

公开(公告)日：2019-08-20

申请号：US15517742

申请日：2015-10-08

Applicant: Namics Corporation

Inventor： Masaaki Hoshiyama ,  Toyokazu Hotchi ,  Toshiaki Enomoto

IPC: H01L21/00 ,  H01L23/29 ,  C08F2/44 ,  C08K5/3437 ,  C09J11/06 ,  C08L33/06 ,  C08L63/04 ,  C08L101/00 ,  H01L23/00 ,  C08G59/62 ,  H01L21/56 ,  C08F222/10

Abstract: Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa·s/° C. is 200° C. to 250° C.

公开(公告)号：US20190160785A1

公开(公告)日：2019-05-30

申请号：US16312054

申请日：2017-06-26

Applicant: NAMICS CORPORATION

Inventor： Fumikazu KOMATSU ,  Issei AOKI ,  Junya SATO ,  Hiroshi TAKASUGI ,  Shin TERAKI

IPC: B32B15/092 ,  B32B27/20 ,  B32B27/26 ,  C08J5/18 ,  C08K3/22 ,  C08K3/38

Abstract: Provided is a resin composition for a film, which is used for producing the film having excellent insulating properties and thermal conductivity. The provided resin composition for the film contains a thermosetting resin (A) and hexagonal boron nitride secondary agglomerated particles (B). Here, the hexagonal boron nitride secondary agglomerated particles (B) contains hexagonal boron nitride secondary agglomerated particles (B-1) having a cohesive breaking strength of 7 MPa or more and hexagonal boron nitride secondary agglomerated particles (B-2) having a cohesive breaking strength of 3 MPa or more and less than 7 MPa.

公开(公告)号：US10294324B2

公开(公告)日：2019-05-21

申请号：US15562255

申请日：2016-03-28

Applicant: NAMICS CORPORATION

Inventor： Takashi Yamaguchi ,  Shinichi Abe

IPC: C09J9/02 ,  C08G59/56 ,  C08G59/60 ,  C08G73/12 ,  C09J11/06 ,  C09J161/34 ,  C09J163/00 ,  C09J179/04 ,  C08L61/34 ,  C08L63/00 ,  H01L21/288 ,  C09J11/04 ,  C08L79/02

Abstract: There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide and/or imidazoles, (C) bismaleimides, and (D) a compound having in its molecule one or more epoxy groups, or cyanate ester.

公开(公告)号：US10276277B2

公开(公告)日：2019-04-30

申请号：US15750866

申请日：2016-07-27

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki Takahashi

IPC: H01B1/22 ,  C09D5/24 ,  C09J9/02 ,  C09J161/06 ,  H01L23/00 ,  H05K1/09

Abstract: An object of the present invention is to provide a resin composition suitable for copper pastes, which can be cured in an ambient atmosphere and has a viscosity within an appropriate range and a low specific resistance after curing. This resin composition includes (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid, (D) an amine, and (E) 4-aminosalicylic acid. Preferably, the (B) component is resol-type phenolic resin. More preferably, the (C) component is at least one selected from oleic acid, linoleic acid, linolenic acid, stearic acid, palmitic acid, lauric acid, butyric acid, and propionic acid.

公开(公告)号：US20190100646A1

公开(公告)日：2019-04-04

申请号：US16086982

申请日：2017-03-30

Applicant: NAMICS CORPORATION

Inventor： Hiroki MYODO ,  Toyokazu HOTCHI

IPC: C08L33/08 ,  C08F2/44 ,  C08K3/36 ,  C08K5/09

Abstract: An object of the present invention is to provide a resin composition in which voids are suppressed during application, the voids and delamination are suppressed after reflow subsequent to mounting and a moisture absorption resistance test, and the delamination and change in resistance value after curing are suppressed, when used in a pre-supply type process. Provided is the resin composition containing (A) an acrylate compound or methacrylate compound having a specific structure and not having an aliphatic cyclic structure, (B) an acrylate compound or a methacrylate compound having an aliphatic cyclic structure and not having a structure of Chemical Formula (1), (C) an acid anhydride-modified polybutadiene compound, (D) silica particles, and (E) a polymerization initiator.

公开(公告)号：US10246550B2

公开(公告)日：2019-04-02

申请号：US15556978

申请日：2016-03-10

Applicant: NAMICS Corporation

Inventor： Kazuki Iwaya ,  Fuminori Arai ,  Akikazu Matsuda ,  Naoto Okumura ,  Takeshi Kumano

IPC: C08K3/34 ,  C08K5/37 ,  C08G59/66 ,  C08G59/68 ,  C08L63/00 ,  C09J163/00

Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.5 equivalents in terms of the ratio of the thiol equivalent of the compound of the (A) component and the oligomer of the (B) component with respect to the epoxy equivalent of the (C) component. In addition, the chloride ion concentration in the resin composition is 230 ppm or less.

公开(公告)号：US09994729B2

公开(公告)日：2018-06-12

申请号：US15309972

申请日：2015-03-20

Applicant: NAMICS CORPORATION

Inventor： Hideaki Ogawa

IPC: H01L23/29 ,  C09D163/00 ,  C09J163/00 ,  C08K9/06

CPC classification number: C09D163/00 ,  C08G59/50 ,  C08K9/06 ,  C08K2201/005 ,  C09J163/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00 ,  C08K3/36 ,  C08L63/00

Abstract: This liquid sealing material has low thermal expansion and has injection properties for injection into gaps between a semiconductor element and a substrate; this electronic component is formed by sealing a sealing site using the liquid sealing material. This liquid sealing material is characterized by containing (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler with an average particle diameter of 7-50 nm, surface treated with 2-(3,4-epoxy cyclohexyl) ethyl trimethoxysilane, and (D) a silica filler with an average particle diameter of 0.2-5 μm, wherein relative to a total of 100 parts by mass of all components of the liquid sealing material, the total of the silica filler of component (C) and the silica filler of the component (D) is 45-77 parts by mass, and the mixing ratio (weight ratio) of the silica filler of component (C) and the silica filler of component (D) is 1:10.2-1:559.

公开(公告)号：US20180079856A1

公开(公告)日：2018-03-22

申请号：US15562255

申请日：2016-03-28

Applicant: NAMICS CORPORATION

Inventor： Takashi YAMAGUCHI ,  Shinichi ABE

IPC: C08G59/60 ,  H01L21/288 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00

CPC classification number: C08G59/60 ,  C08G59/56 ,  C08G73/12 ,  C08L61/34 ,  C08L63/00 ,  C08L79/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J161/34 ,  C09J163/00 ,  C09J179/04 ,  H01L21/288 ,  C08L79/085

Abstract: There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide and/or imidazoles, (C) bismaleimides, and (D) a compound having in its molecule one or more epoxy groups, or cyanate ester.

公开(公告)号：US20180051128A1

公开(公告)日：2018-02-22

申请号：US15556978

申请日：2016-03-10

Applicant: NAMICS Corporation

Inventor： Kazuki IWAYA ,  Fuminori ARAI ,  Akikazu MATSUDA ,  Naoto OKUMURA ,  Takeshi KUMANO

IPC: C08G59/66 ,  C08K3/34 ,  C08K5/37 ,  C08L63/00 ,  C09J163/00

CPC classification number: C08G59/66 ,  C08G59/686 ,  C08K3/34 ,  C08K5/37 ,  C08L63/00 ,  C09J163/00

Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.5 equivalents in terms of the ratio of the thiol equivalent of the compound of the (A) component and the oligomer of the (B) component with respect to the epoxy equivalent of the (C) component. In addition, the chloride ion concentration in the resin composition is 230 ppm or less.