公开(公告)号：US20240092057A1

公开(公告)日：2024-03-21

申请号：US18274347

申请日：2021-01-27

Applicant: RESONAC CORPORATION

Inventor： Hirofumi SHIOKAWA

IPC: B32B5/18 ,  B32B1/00 ,  B32B3/04 ,  B32B7/02

CPC classification number: B32B5/18 ,  B32B1/00 ,  B32B3/04 ,  B32B7/02 ,  B29C44/083 ,  B32B2266/025 ,  B32B2307/4026 ,  B32B2307/7376 ,  B32B2605/00

Abstract: A resin molded product includes a main body including a design face and a opposite face opposite to the design face and having a first foamed layer formed inside the main body, and a protruding portion located at a periphery of the main body, having a second foamed layer formed inside the protruding portion, and protruding to a thickness direction of the main body and a side opposite to the design face, the protruding portion includes a tip end portion disposed so that a protruding tip portion on the design face extends to a protruding direction of the protruding portion more than a protruding tip portion on the opposite face, and a thickness of the tip end portion is 1.2 mm or less.

公开(公告)号：US11935669B2

公开(公告)日：2024-03-19

申请号：US17775886

申请日：2020-11-10

Applicant: Resonac Corporation ,  NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY

Inventor： Shohei Yamazaki ,  Hiroyuki Izawa ,  Toshiyuki Sugimoto

IPC: H01B13/00 ,  B05D1/00 ,  B01J19/08

CPC classification number: H01B13/0033 ,  B05D1/007 ,  B01J19/08 ,  B01J19/087

Abstract: A method for dispersing conductive particles includes: forming an electric field between a first electrode and a second electrode of an electrostatic adsorption device including the first electrode including a disposition part having electrostatic diffusivity or conductivity on which particles are disposed and the second electrode including an adsorption part having electrostatic diffusivity or conductivity and facing the disposition part, to cause a blend particle in which the conductive particles each having a particle size smaller than a particle size of an intermediate particle are attached to the intermediate particle and which is disposed on the disposition part, to reciprocate between the disposition part and the adsorption part, and to cause the conductive particles to be adsorbed onto the adsorption part.

公开(公告)号：US20240088051A1

公开(公告)日：2024-03-14

申请号：US18261114

申请日：2022-01-12

Applicant: Resonac Corporation

Inventor： Kazuyuki MITSUKURA ,  Shunsuke OTAKE ,  Hiroaki FUJITA ,  Shinji SHIMAOKA ,  Takashi MASUKO ,  Kazuhiko KURAFUCHI

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/5386 ,  H01L21/4846 ,  H01L24/08 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0655 ,  H01L25/50 ,  H01L21/561 ,  H01L2224/08225 ,  H01L2224/19 ,  H01L2224/211

Abstract: A method for manufacturing a semiconductor device is disclosed. The method for manufacturing a semiconductor device includes preparing a base material, preparing a plurality of semiconductor elements each having a connection terminal, preparing a wiring board provided with a first wiring, arranging the plurality of semiconductor elements on the base material, covering the plurality of semiconductor elements on the base material with an insulating material, arranging the wiring board on at least one of the plurality of semiconductor elements so that the first wiring is connected to at least some of the connection terminals of the plurality of semiconductor elements covered with the insulating material, and forming a second wiring around the first wiring. The first wiring has finer wiring than the second wiring.

公开(公告)号：US20240079033A1

公开(公告)日：2024-03-07

申请号：US18241463

申请日：2023-09-01

Applicant: Resonac Corporation

Inventor： Fuminobu OOHASHI

IPC: G11B33/08

CPC classification number: G11B33/08

Abstract: A recording and reproducing device includes, a case; at least one recording medium having a disk-shape, a motor configured to rotate the at least one recording medium, a head configured to read or write information from or to the at least one recording medium, and an actuator configured to drive the head to scan in a radial direction of the at least one recording medium which are provided in the case; and a regulating portion configured to, when an external shock is applied to the at least one recording medium, contact an outer peripheral edge of the at least one recording medium to regulate displacements of the at least one recording medium due to bending of the at least one recording medium, wherein the regulating portion has a regulating member displaced between a position away from the outer peripheral edge of the at least one recording medium and a contact-possible position or a contacting position.

公开(公告)号：US20240059047A1

公开(公告)日：2024-02-22

申请号：US18269679

申请日：2021-12-21

Applicant: RESONAC CORPORATION

Inventor： Akihiro HATAYAMA ,  Shigeya NAKAMURA ,  Kyoichi TOMITA ,  Takuya KAGAWA

IPC: B32B5/14 ,  B32B5/18 ,  B29C44/08 ,  B32B27/32

CPC classification number: B32B5/145 ,  B32B5/18 ,  B29C44/083 ,  B32B27/32 ,  B29K2105/04

Abstract: A molded body, comprising a foamed portion in which a skin layer A, a foamed layer and a skin layer B are disposed in this order in a thickness direction, wherein in the foamed portion, the foamed layer has a ratio of thickness, with respect to a total thickness of the skin layer A, the foamed layer and the skin layer B, of from 73% to 88%.

公开(公告)号：US20240052225A1

公开(公告)日：2024-02-15

申请号：US18266973

申请日：2022-04-28

Applicant: Resonac Corporation

Inventor： Hajime YUKUTAKE ,  Hajime FUNAHASHI ,  Hikaru SATOH

IPC: C09K5/14 ,  C08G59/32 ,  C08G59/24 ,  C08G59/38 ,  C08G59/62 ,  C08G59/68 ,  C08K9/02 ,  C08K3/22 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08G59/3218 ,  C08G59/245 ,  C08G59/38 ,  C08G59/621 ,  C08G59/688 ,  C08K9/02 ,  C08K3/22 ,  H05K7/209 ,  C08K2003/2227 ,  C08K2201/001

Abstract: A thermally conductive resin composition includes an epoxy resin and a thermally conductive powder. The thermally conductive powder includes aluminum nitride having a silicon-containing oxide coating on a surface thereof and another thermally conductive powder. The content of the epoxy resin is 1% by mass or more and 20% by mass or less based on the total amount of the thermally conductive resin composition. The content of the thermally conductive powder is 80% by mass or more and 99% by mass or less based on the total amount of the thermally conductive resin composition. The content of the aluminum nitride having a silicon-containing oxide coating on a surface thereof is 10% by mass or more and 70% by mass or less based on the total amount of the thermally conductive resin composition. The content of the other thermally conductive powder is 10% by mass or more and 89% by mass or less based on the total amount of the thermally conductive resin composition.

公开(公告)号：US20240047230A1

公开(公告)日：2024-02-08

申请号：US18258454

申请日：2021-12-20

Applicant: Resonac Corporation

Inventor： Tomoko HIGASHIUCHI ,  Hiroshi YOKOTA ,  Tomohiko KOTAKE ,  Naoki FURUKAWA ,  Naoki MARUYAMA ,  Yutaka OKADA ,  Nozomi MATSUBARA

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/566 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2924/1435

Abstract: A method for manufacturing a semiconductor device, the method including: a step of disposing an adhesive thermal insulation material on a semiconductor device; a step of performing reflow of the semiconductor device having the thermal insulation material disposed thereon; and a step of detaching the thermal insulation material from the semiconductor device.

公开(公告)号：US20240043659A1

公开(公告)日：2024-02-08

申请号：US18354873

申请日：2023-07-19

Applicant: Resonac Corporation

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI

IPC: C08K9/08 ,  C08K9/02

CPC classification number: C08K9/08 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/006 ,  C08K2201/005 ,  C08K2201/014

Abstract: A heat conducting composition including:



a polymer component (A);
a surface-treated filler (B) obtained by surface-treating a filler with α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane having a weight average molecular weight of 500 to 5,000, with the α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane having an adhesion percentage to the filler of from 20.0 to 50.0% by mass; and
a silicon-containing oxide-coated nitride (C) having a nitride and a silicon-containing oxide coating that coats the nitride.

公开(公告)号：US20240043597A1

公开(公告)日：2024-02-08

申请号：US18258467

申请日：2021-12-20

Applicant: Resonac Corporation

Inventor： Tomoko HIGASHIUCHI ,  Hiroshi YOKOTA ,  Naoki FURUKAWA ,  Nozomi MATSUBARA

IPC: C08F265/08 ,  C08J5/18 ,  C08L55/02

CPC classification number: C08F265/08 ,  C08J5/18 ,  C08L55/02 ,  C08F222/1063

Abstract: A composition containing first hollow particles being thermally expandable hollow particles; second hollow particles being hollow particles other than the first hollow particles; and a polymerizable compound.

公开(公告)号：US20240015889A1

公开(公告)日：2024-01-11

申请号：US18044789

申请日：2021-09-09

Applicant: RESONAC CORPORATION

Inventor： Kei TOGASAKI ,  Kenichi IWASHITA ,  Keishi ONO ,  Mao NARITA ,  Kazuyuki MITSUKURA ,  Masaya TOBA

IPC: H05K1/18 ,  H05K3/12 ,  H05K3/18 ,  H05K3/02

CPC classification number: H05K1/181 ,  H05K3/1208 ,  H05K3/181 ,  H05K3/022

Abstract: A method for producing a wiring board, including: a step of pretreating the surface of a metal layer exposed into an opening by bringing the surface into contact with a pretreatment liquid at a predetermined pretreatment temperature; and a step of forming a copper plating layer on the metal layer by electrolytic plating. The resist layer and the pretreatment liquid are selected such that a mass change rate of the resist layer when the resist layer before being exposed and developed is immersed in the pretreatment liquid is −2.0% by mass or more. The mass change rate is a value calculated by Expression: Mass change rate (% by mass)={(W1−W0)/W0}×100. W1 is the mass of the resist layer after a laminated body including a resist layer 3 and a copper foil is immersed in the pretreatment liquid at the pretreatment temperature for 30 minutes.