公开(公告)号：US20240341039A1

公开(公告)日：2024-10-10

申请号：US18294158

申请日：2022-07-29

Applicant: Resonac Corporation

Inventor： Kei TOGASAKI ,  Kazuyuki MITSUKURA ,  Masaya TOBA ,  Kenichi IWASHITA ,  Keishi ONO ,  Mao NARITA

IPC: H05K3/10 ,  C25D3/38 ,  C25D5/00 ,  C25D5/02 ,  C25D7/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/02

CPC classification number: H05K3/10 ,  C25D3/38 ,  C25D5/022 ,  C25D5/605 ,  C25D7/123 ,  H05K1/02 ,  H01L21/4846 ,  H01L23/49866 ,  H05K2203/11

Abstract: A method for manufacturing a wiring board, including: forming a resist layer on a seed layer comprising a metal provided on a support body; forming a pattern including an opening to which the seed layer is exposed in the resist layer by light exposure and development of the resist layer, and forming a copper plating layer on the seed layer exposed into the opening by electrolytic plating, in this order. The arithmetic mean roughness Ra of the surface of the seed layer on a side opposite to the support body is 0.05 μm or more and 0.30 μm or less.

公开(公告)号：US20240402603A1

公开(公告)日：2024-12-05

申请号：US18699058

申请日：2022-10-03

Applicant: Resonac Corporation

Inventor： Yusaku WATANABE ,  Akiko TAKEDA ,  Mao NARITA ,  Keishi ONO

IPC: G03F7/033 ,  C08F212/08 ,  C08K5/3472 ,  C08K5/36

Abstract: A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a tetrazole compound, in which a content of a monomer unit of a styrene compound in the binder polymer is more than 30% by mass, and a content of the tetrazole compound is 0.01 parts by mass or more with respect to 100 parts by mass of the total of the binder polymer and the photopolymerizable compound.

公开(公告)号：US20240015889A1

公开(公告)日：2024-01-11

申请号：US18044789

申请日：2021-09-09

Applicant: RESONAC CORPORATION

Inventor： Kei TOGASAKI ,  Kenichi IWASHITA ,  Keishi ONO ,  Mao NARITA ,  Kazuyuki MITSUKURA ,  Masaya TOBA

IPC: H05K1/18 ,  H05K3/12 ,  H05K3/18 ,  H05K3/02

CPC classification number: H05K1/181 ,  H05K3/1208 ,  H05K3/181 ,  H05K3/022

Abstract: A method for producing a wiring board, including: a step of pretreating the surface of a metal layer exposed into an opening by bringing the surface into contact with a pretreatment liquid at a predetermined pretreatment temperature; and a step of forming a copper plating layer on the metal layer by electrolytic plating. The resist layer and the pretreatment liquid are selected such that a mass change rate of the resist layer when the resist layer before being exposed and developed is immersed in the pretreatment liquid is −2.0% by mass or more. The mass change rate is a value calculated by Expression: Mass change rate (% by mass)={(W1−W0)/W0}×100. W1 is the mass of the resist layer after a laminated body including a resist layer 3 and a copper foil is immersed in the pretreatment liquid at the pretreatment temperature for 30 minutes.