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    Method for Fabricating Suspended MEMS Structures
    44.
    发明申请
    Method for Fabricating Suspended MEMS Structures 有权
    制造悬浮MEMS结构的方法

    公开(公告)号：US20160304340A1

    公开(公告)日：2016-10-20

    申请号：US14687943

    申请日：2015-04-16

    Applicant: David J. Meyer ,  Brian P. Downey

    Inventor： David J. Meyer ,  Brian P. Downey

    IPC: B81C1/00

    CPC classification number: B81C1/00539 ,  B81C1/00936 ,  B81C2201/0107 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0177

    Abstract: A process for fabricating a suspended microelectromechanical system (MEMS) structure comprising epitaxial semiconductor functional layers that are partially or completely suspended over a substrate. A sacrificial release layer and a functional device layer are formed on a substrate. The functional device layer is etched to form windows in the functional device layer defining an outline of a suspended MEMS device to be formed from the functional device layer. The sacrificial release layer is then etched with a selective release etchant to remove the sacrificial release layer underneath the functional layer in the area defined by the windows to form the suspended MEMS structure.

    Abstract translation: 一种用于制造悬浮微机电系统（MEMS）结构的方法，其包括部分或完全悬浮在衬底上的外延半导体功能层。 在基板上形成牺牲剥离层和功能元件层。 功能器件层被蚀刻以在功能器件层中形成窗口，其限定要由功能器件层形成的悬置的MEMS器件的轮廓。 然后用选择性释放蚀刻剂蚀刻牺牲剥离层，以去除由窗口限定的区域中的功能层下方的牺牲剥离层，以形成悬浮的MEMS结构。

    Method for forming a microfabricated structure
    46.
    发明授权
    Method for forming a microfabricated structure 有权
    形成微细结构的方法

    公开(公告)号：US09302905B1

    公开(公告)日：2016-04-05

    申请号：US14738980

    申请日：2015-06-15

    Applicant: Innovative Micro Technology

    Inventor： Suresh K Sampath

    IPC: H01L21/00 ,  B81C1/00 ,  H01L21/027

    CPC classification number: B81C1/00412 ,  B81C2201/0143 ,  H01L21/0272 ,  H01L21/32139 ,  H01L43/12

    Abstract: A method for forming a feature in a device layer, including forming a first layer of a liftoff material and a second layer of photoresist over the liftoff material, exposing the photoresist and developing the photoresist and the liftoff layer. The photoresist develops at a slower rate than the liftoff layer. The development results in a first opening in the lift off layer and a second opening in the photoresist layer wherein the first opening is smaller than the second opening because of the different developing rates. The device layer is then dry etched or ion milled through the opening. Subsequent removal of the first layer and second layer leaves a clean surface of the patterned device layer, without the fences that can be formed using other methods.

    Abstract translation: 一种用于在器件层中形成特征的方法，包括在剥离材料上形成第一层剥离材料和第二层光致抗蚀剂，暴露光致抗蚀剂并显影光致抗蚀剂和剥离层。 光致抗蚀剂以比剥离层更慢的速率显影。 显影导致剥离层中的第一开口和光致抗蚀剂层中的第二开口，其中由于不同的显影速率，第一开口小于第二开口。 然后将器件层干蚀刻或通过开口离子研磨。 随后去除第一层和第二层离开图案化的器件层的干净的表面，而不需要使用其它方法形成的栅栏。

    Microfabrication
    47.
    发明申请
    Microfabrication 审中-公开
    微加工

    公开(公告)号：US20160035539A1

    公开(公告)日：2016-02-04

    申请号：US14447446

    申请日：2014-07-30

    Applicant: Lauri Sainiemi ,  Tapani Levola ,  Pasi Saarikko

    Inventor： Lauri Sainiemi ,  Tapani Levola ,  Pasi Saarikko

    IPC: H01J37/305

    CPC classification number: H01J37/3053 ,  B81C1/00547 ,  B81C99/0025 ,  B81C2201/0143 ,  G02B5/1857

    Abstract: A microfabrication apparatus for fabricating a microstructure on a substrate is disclosed and comprises a partitioning system arranged to provide an aperture, a particle source that can generate a beam of particles for patterning the substrate and a substrate holder which supports the substrate. Relative motion is effected between the aperture and the substrate over a portion of the substrate's surface so that different points on the surface portion are exposed at different times. Whilst that motion is ongoing, one or more exposure conditions are varied so that the different points are subject to different exposure conditions. Corresponding microfabrication processes and products obtained thereby are also disclosed.

    Abstract translation: 公开了一种用于在基板上制造微结构的微细加工装置，其包括设置成提供孔的分隔系统，可以产生用于图案化基板的颗粒束的颗粒源和支撑基板的基板支架。 在基板表面的一部分上的孔和基板之间进行相对运动，使得表面部分上的不同点在不同时间被曝光。 虽然该运动正在进行，一个或多个曝光条件是变化的，以便不同的点受到不同的曝光条件的影响。 还公开了相应的微加工工艺和由此获得的产品。

    Aerogel-based mold for MEMS fabrication and formation thereof
    49.
    发明授权
    Aerogel-based mold for MEMS fabrication and formation thereof 有权
    用于MEMS制造和形成的基于气凝胶的模具

    公开(公告)号：US09138918B2

    公开(公告)日：2015-09-22

    申请号：US14455745

    申请日：2014-08-08

    Applicant: Honeywell International Inc.

    Inventor： Robert Jon Carlson

    IPC: C23F1/00 ,  B29C33/38 ,  H01L21/306 ,  C23F1/02 ,  B81C99/00 ,  B29C41/00 ,  B29C59/14 ,  B29C59/16 ,  B81B7/00

    CPC classification number: B29C33/3842 ,  B29C41/00 ,  B29C59/14 ,  B29C59/16 ,  B29K2909/00 ,  B29K2995/0037 ,  B81B7/00 ,  B81B2201/05 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C99/009 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/034 ,  C23F1/02 ,  H01L21/30604 ,  Y10T428/24496

    Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

    Abstract translation: 本发明涉及用作至少部分微机电特征的模具的图案化气凝胶基层。 气凝胶的密度小于MEMS制造中使用的典型材料的密度，例如多晶硅，氧化硅，单晶硅，金属，金属合金等。 因此，可以以明显高于在较致密的材料中形成结构特征的速率的速率在气凝胶层中形成结构特征。 本发明还包括一种图案化气凝胶层以产生这种基于气凝胶的模具的方法。 本发明还包括使用基于气凝胶的模具制造微机电特征的方法。 该方法包括将致密材料层直接沉积在已经形成在气凝胶层中的微机电特征的至少一部分的轮廓上。

    System and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same
    50.
    发明授权
    System and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same 有权
    使用激光辅助化学蚀刻制备独立膜的系统和方法，以及使用其形成的独立膜

    公开(公告)号：US08866240B2

    公开(公告)日：2014-10-21

    申请号：US13655198

    申请日：2012-10-18

    Applicant: Margaret H. Abraham ,  David P. Taylor

    Inventor： Margaret H. Abraham ,  David P. Taylor

    IPC: H01L29/20 ,  B82Y30/00 ,  H01L21/306 ,  B81C1/00

    CPC classification number: H01L21/30604 ,  B81C1/00047 ,  B81C1/00547 ,  B81C2201/0143 ,  B82Y30/00

    Abstract: Systems and methods for preparing freestanding films using laser-assisted chemical etch (LACE), and freestanding films formed using same, are provided. In accordance with one aspect a substrate has a surface and a portion defining an isotropically defined cavity; and a substantially continuous film is disposed at the substrate surface and spans the isotropically defined cavity. In accordance with another aspect, a substrate has a surface and a portion defining an isotropically defined cavity; and a film is disposed at the substrate surface and spans the isotropically defined cavity, the film including at least one of hafnium oxide (HfO2), diamond-like carbon, graphene, and silicon carbide (SiC) of a predetermined phase. In accordance with still another aspect, a substrate has a surface and a portion defining an isotropically defined cavity; and a multi-layer film is disposed at the substrate surface and spans the isotropically defined cavity.

    Abstract translation: 提供了使用激光辅助化学蚀刻（LACE）制备独立膜的系统和方法，以及使用其形成的独立膜。 根据一个方面，衬底具有限定各向同性定义的空腔的表面和部分; 并且基本上连续的膜设置在基底表面并跨越各向同性地限定的腔。 根据另一方面，一种衬底具有限定各向同性定义的空腔的表面和一部分; 并且膜被设置在基板表面并跨越各向同性地限定的空腔，所述膜包括预定相的氧化铪（HfO 2），类金刚石碳，石墨烯和碳化硅（SiC）中的至少一种。 根据另一方面，一种基板具有限定各向同性定义的空腔的表面和一部分; 并且多层膜设置在基板表面并跨越各向同性定义的空腔。

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