Abstract:
One embodiment relates to an electronically-variable electrostatic immersion lens in an electron beam apparatus. The electrostatic immersion lens includes a top electrode configured with a first voltage applied thereto, an upper bottom electrode configured with a second voltage applied thereto, and a lower bottom electrode configured with a third voltage applied thereto. The third voltage is controlled separately from the second voltage. Other embodiments are also disclosed.
Abstract:
An immersion lens for a charged particle beam lithography system includes a magnetically floating shield that limits a deflection magnetic field from creating eddy currents in electrically conductive components of the system downstream from the shield. The surface of the shield lies parallel or approximately parallel to a magnetic equipotential surface of the focusing magnetic field so that the shield does not affect the focusing magnetic field. The shield is, e.g., a ferrite disk or a hollow ferrite cone defining a central bore for passage of the charged particle beam.
Abstract:
A magnetic immersion lens has inner and outer pole-pieces arranged symmetrically about a longitudinal axis X-X of the lens, the inner pole piece having a through-bore and the lens producing a magnetic imaging field for directing along the through-bore secondary electrons emitted from a specimen positioned in front of the inner pole-piece. The lens has an axially-symmetric detection arrangement located within the through-bore. The detector comprises a focusser electrode, a repeller electrode, an extractor electrode, a detector electrode, and a reflector electrode
Abstract:
Disclosed are lens apparatus in which a beam of charged particles is brought to a focus by means of a magnetic field, the lens being situated behind the target position. In illustrative embodiments, a lens apparatus is employed in a scanning electron microscope as the sole lens for high-resolution focusing of an electron beam, and in particular, an electron beam having an accelerating voltage of from about 10 to about 30,000 V. In one embodiment, the lens apparatus comprises an electrically-conducting coil arranged around the axis of the beam and a magnetic pole piece extending along the axis of the beam at least within the space surrounded by the coil. In other embodiments, the lens apparatus comprises a magnetic dipole or virtual magnetic monopole fabricated from a variety of materials, including permanent magnets, superconducting coils, and magnetizable spheres and needles contained within an energy-conducting coil. Multiple-array lens apparatus are also disclosed for simultaneous and/or consecutive imaging of multiple images on single or multiple specimens. The invention further provides apparatus, methods, and devices useful in focusing charged particle beams for lithographic processes.
Abstract:
Disclosed are lens apparatus in which a beam of charged particlesis brought to a focus by means of a magnetic field, the lens being situated behind the target position. In illustrative embodiments, a lens apparatus is employed in a scanning electron microscopeas the sole lens for high-resolution focusing of an electron beam, and in particular, an electron beam having an accelerating voltage of from about 10 to about 30,000 V. In one embodiment, the lens apparatus comprises an electrically-conducting coil arranged around the axis of the beam and a magnetic pole piece extending along the axis of the beam at least within the space surrounded by the coil. In other embodiments, the lens apparatus comprises a magnetic dipole or virtual magnetic monopole fabricated from a variety of materials, including permanent magnets, superconducting coils, and magnetizable spheres and needles contained within an energy-conducting coil. Multiple-array lens apparatus are also disclosed for simultaneous and/or consecutive imaging of multiple images on single or multiple specimens. The invention further provides apparatus, methods, and devices useful in focusing charged particle beams for lithographic processes.
Abstract:
An high resolution electron beam observation instrument has an electron beam source, an electron beam optical system for converging the electron beam and scanning the electron beam across the surface of a sample, and a compound magnetic and electrostatic objective lens comprising a single pole magnetic lens having a single magnetic pole portion disposed between the electron beam source and the sample and an electrostatic immersion lens, the electrostatic immersion lens comprising an upper electrode and a lower electrode, one end of the upper electrode extending between the single magnetic pole portion and the sample, and the lower electrode being disposed between the upper electrode and the sample; wherein a deceleration electric field is generated between the upper electrode and the lower electrode to allow high resolution observation of the sample. The upper electrode may comprise the single magnetic pole portion of the single pole magnetic lens, or one or more seperate electrodes. The single pole magnetic lens has a conical shaped portion extending between the single magnetic pole portion and the electron beam source. A potential applied to the sample differs from a potential applied to the lower electrode when the sample is not inclined and a difference between the potentials of the sample and the lower electrode is reduced, or the potentials are made equal to each other when the sample is inclined by the sample inclining means.
Abstract:
This system employs writing of lithographic patterns with a shaped electron beam exposure system which minimizes the time wasted by workpiece positional requirements. The writing field contains an array of sub-fields written in a raster sequence. The large width of the writing field provided by the VAIL system reduces the number of mechanical scans required to write the pattern on the workpiece which further reduces the time required for workpiece positioning. When patterns are being superimposed over previously written patterns, registration is employed. This system includes a registration field confined to local areas on the workpiece, which is larger than the writing field, without requiring change in focus and without requiring the mechanical system comprising the X-Y work table to change speed during the registration and reregistration of the various fields on a semiconductor wafer or mask. The registration field can be larger than the writing field is possible because the quality requirements demanded from the shaped electron beam are less for detecting the locations of such registration marks at the various locations on the wafer.