公开(公告)号：US20230419935A1

公开(公告)日：2023-12-28

申请号：US18339573

申请日：2023-06-22

Applicant: Carl Hansen

Inventor： Carl Hansen

IPC: G10K11/00 ,  H04R1/28 ,  H04R29/00

CPC classification number: G10K11/002 ,  H04R1/288 ,  H04R29/001 ,  H04R2201/003

Abstract: An acoustic attenuation enclosure providing a plurality of panels connectable to define a boundary of the acoustic attenuation enclosure housing an electroacoustic transducer converting an electrical audio signal propagated in an external environment, wherein the acoustic attenuation enclosure substantially maintains a first acoustics regardless of a second acoustics of the external environment.

公开(公告)号：US20230396931A1

公开(公告)日：2023-12-07

申请号：US18085891

申请日：2022-12-21

Applicant: National Kaohsiung University of Science and Technology

Inventor： CHENG-TA YANG

IPC: H04R19/00 ,  H04R1/04

CPC classification number: H04R19/005 ,  H04R1/04 ,  H04R2201/003

Abstract: A micro-electromechanical system (MEMS) acoustic sensor includes: a silicon substrate layer; an insulation layer, arranged above the silicon substrate layer; two first electrode layers, respectively arranged above the insulation layer and arranged opposite to each other at intervals; and two second electrode layers, respectively arranged above the two first electrode layers. Each of the second electrode layers is provided with at least one support member connected to the corresponding first electrode layer, and forms an acoustic flow channel together with a part of the insulation layer and the two first electrode layers. The each second electrode layer has a front section and a rear section. The front section forms a diverging first cambered surface. The rear section forms a tapered second cambered surface.

公开(公告)号：US11832057B2

公开(公告)日：2023-11-28

申请号：US18064896

申请日：2022-12-12

Applicant: Skyworks Solutions, Inc.

Inventor： Yu Hui ,  Guofeng Chen

IPC: H04R17/02 ,  B81B3/00 ,  H10N30/20

CPC classification number: H04R17/02 ,  B81B3/0021 ,  H10N30/2047 ,  B81B2201/0257 ,  H04R2201/003

Abstract: A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer having substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.

公开(公告)号：US20230370783A1

公开(公告)日：2023-11-16

申请号：US18356246

申请日：2023-07-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHUN-WEN CHENG ,  CHUN YIN TSAI ,  CHIA-HUA CHU

IPC: H04R17/02 ,  B81B3/00 ,  B81C1/00

CPC classification number: H04R17/02 ,  B81B3/0021 ,  B81C1/00158 ,  H04R2201/003 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2201/0257

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.

公开(公告)号：US11818542B2

公开(公告)日：2023-11-14

申请号：US17448352

申请日：2021-09-21

Applicant: GMEMS TECH SHENZHEN LIMITED

Inventor： Guanghua Wu ,  Xingshuo Lan ,  Zhixiong Xiao

IPC: H04R19/04 ,  B81B3/00

CPC classification number: H04R19/04 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  H04R2201/003

Abstract: The present invention provides a MEMS microphone comprising (i) a substrate layer, (ii) a fixed backplate, and (iii) an intermediate layer sandwiched between the substrate layer and the fixed backplate. The substrate layer has a first opening through the thickness of the substrate layer. The intermediate layer has a second opening through the thickness of the intermediate layer. The fixed backplate forms a ceiling of the second opening, and the second opening is larger than the first opening and extends into the first opening, forming a looped recess (“undercut”). The looped recess is defined by a looped ledge on the substrate, a looped sidewall around the second opening, and a looped ceiling from the fixed backplate. The looped sidewall and the looped ceiling are made of a same material.

公开(公告)号：US20230353933A1

公开(公告)日：2023-11-02

申请号：US18192722

申请日：2023-03-30

Applicant: SONICEDGE LTD.

Inventor： Mordehai Margalit

IPC: B81B7/02 ,  H04R1/28 ,  H04R19/02

CPC classification number: H04R1/2803 ,  B81B7/02 ,  H04R19/02 ,  B81B2201/0257 ,  H04R2201/003 ,  H04R2217/03

Abstract: Techniques described herein generally relate to generating an audio signal with a speaker. In some examples, a speaker device is described that includes a membrane and a shutter and driver device is configured to receive an audio signal, modulate it and generate electric signals to operate the speaker and generate an acoustic audio signal.

公开(公告)号：US20230345182A1

公开(公告)日：2023-10-26

申请号：US18190291

申请日：2023-03-27

Applicant: Skyworks Solutions, Inc.

Inventor： Takanori Yasuda ,  Siarhei Dmitrievich Barsukou ,  Keiichi Maki ,  Hiroyuki Nakamura

IPC: H04R17/02 ,  B81B7/00

CPC classification number: H04R17/02 ,  B81B7/0061 ,  B81B2207/012 ,  B81B2207/096 ,  H04R2201/003

Abstract: An integrated device package is disclosed. The integrated device package can include a printed circuit board and a microelectronicmechanical systems die that is at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board. The integrated device package can include a filler material that is at least partially disposed between the microelectronicmechanical systems die and the printed circuit board. The integrated device package can include a lid that is coupled to the printed circuit board. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.

公开(公告)号：US11796411B2

公开(公告)日：2023-10-24

申请号：US17280197

申请日：2019-03-25

Applicant: Gettop Acoustic Co., Ltd.

Inventor： Kuan-Hong Hsieh ,  Shih-Chia Chiu ,  Sung-Cheng Lo ,  Bo-Cheng You ,  Chun-Kai Chan ,  Wei-Leun Fang

IPC: G01L9/00 ,  G01L19/14 ,  H04R19/04

CPC classification number: G01L9/0041 ,  G01L19/14 ,  H04R19/04 ,  H04R2201/003

Abstract: A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.

公开(公告)号：US11787689B2

公开(公告)日：2023-10-17

申请号：US16630036

申请日：2018-07-04

Applicant: TDK Corporation

Inventor： Wolfgang Pahl

IPC: B81C1/00 ,  B81B7/00 ,  H04R19/04 ,  H04R31/00 ,  H04R1/04

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  H04R19/04 ,  H04R31/00 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/99 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2203/0109 ,  B81C2203/032 ,  H04R1/04 ,  H04R2201/003

Abstract: A MEMS sensor with a media access opening in its carrier board. The MEMS sensor has an integrally filter mesh closing the media access opening. The mesh can be applied in unstructured form over the whole surface of the carrier board. Then, a structuring is performed to produce preferably at the same time a perforation forming the filter mesh.

公开(公告)号：US20230328456A1

公开(公告)日：2023-10-12

申请号：US18295673

申请日：2023-04-04

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fabrizio CERINI ,  Silvia ADORNO ,  Marco SALINA

IPC: H04R17/00 ,  H10N30/20 ,  H04R7/06 ,  H04R7/18

CPC classification number: H04R17/005 ,  H10N30/20 ,  H04R2400/11 ,  H04R7/18 ,  H04R2201/003 ,  H04R7/06

Abstract: A microelectromechanical electroacoustic transducer includes a supporting frame of semiconductor material, a membrane of semiconductor material, connected to the supporting frame along a perimeter and having central symmetry, and a piezoelectric actuator on a peripheral portion of the membrane. The membrane has through slits of elongated shape arranged around a center of the membrane.