公开(公告)号：US20160307819A1

公开(公告)日：2016-10-20

申请号：US15191404

申请日：2016-06-23

Applicant: Apple Inc.

Inventor： Jay S. NIGEN ,  Ron A. HOPKINSON ,  Derek J. YAP ,  Eric A. KNOPF ,  William F. LEGGETT ,  Richard H. TAN

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/552

CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

公开(公告)号：US20160245706A1

公开(公告)日：2016-08-25

申请号：US14630050

申请日：2015-02-24

Applicant: NXP B.V.

Inventor： Zoran Zivkovic ,  Kim Phan Le ,  Hilco Suy

IPC: G01K7/16 ,  G01K3/08

CPC classification number: G01K7/16 ,  G01K3/08 ,  G01K7/427 ,  H04M17/026 ,  H04M2250/12 ,  H05K1/0201 ,  H05K2201/10151

Abstract: One example discloses a multi-sensor assembly, comprising: a first temperature sensor, having a first thermal profile; a second temperature sensor, having a second thermal profile different from the first thermal profile; wherein the first and second temperature sensors are mounted on a set of lead-frames; wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly. Another example discloses a method of manufacture for the multi-sensor assembly.

Abstract translation: 一个实例公开了一种多传感器组件，包括：具有第一热分布的第一温度传感器; 第二温度传感器，具有不同于第一热分布的第二热分布; 其中所述第一温度传感器和所述第二温度传感器安装在一组引线框架上; 其中所述第一和第二温度传感器包括耦合到周围环境的第一热路输入和耦合到所述引线框架中的至少一个的第二热路输入; 并且其中所述第一和第二传感器和引线框组被包括在单个多传感器组件中。 另一个实例公开了一种用于多传感器组件的制造方法。

公开(公告)号：US20160218533A1

公开(公告)日：2016-07-28

申请号：US14429615

申请日：2014-04-30

Applicant: LG CHEM, LTD.

Inventor： Jong-Min LIM ,  Jin-Seob KIM ,  Hyuck-Jun KO ,  Hyeong-Kwan KANG

IPC: H02J7/00 ,  H01M10/48 ,  H01M2/34 ,  H01M10/46

CPC classification number: H02J7/0042 ,  H01M2/0275 ,  H01M2/1077 ,  H01M2/20 ,  H01M2/348 ,  H01M10/425 ,  H01M10/46 ,  H01M10/486 ,  H01M2200/10 ,  H01M2200/106 ,  H02J7/0026 ,  H05K1/0201 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/1034 ,  Y02T10/7055

Abstract: Disclosed is a circuit board for a secondary battery, which ensures an improved safety according to a temperature of the secondary battery, and a battery pack including the circuit board. The circuit board for a secondary battery, which is connected to at least one of a cathode tab and an anode tab of the secondary battery, includes a tab coupling portion connected to the cathode tab or the anode tab, a charging/discharging path connected to the tab coupling portion to give a path through which a charging current or a discharging current of the secondary battery flows, the charging/discharging path having at least one path cutting portion formed therein, one pair of conductive plates respectively attached to both ends of the path cutting portion, the conductive plates being at least partially bent, and a current interruption module having both ends respectively connected to the one pair of conductive plates, the current interruption module sensing a temperature of the secondary battery and interrupting a current according to the sensed temperature.

Abstract translation: 公开了一种用于二次电池的电路板，其确保根据二次电池的温度提高安全性，以及包括电路板的电池组。 连接到二次电池的阴极接线片和阳极接头中的至少一个的二次电池用电路板包括连接到阴极接头或阳极接头的接头连接部，连接到 所述接头连接部分给出所述二次电池的充电电流或放电电流流动的路径，所述充电/放电路径具有形成在其中的至少一个路径切割部分，一对导电板分别附接到所述二极电极的两端 路径切割部分，导电板至少部分弯曲，并且具有两端分别连接到一对导电板的电流中断模块，电流中断模块感测二次电池的温度并根据感测到的电流中断电流 温度。

公开(公告)号：US09402331B2

公开(公告)日：2016-07-26

申请号：US14512214

申请日：2014-10-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Yvon Imbs

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20 ,  H05K1/14 ,  H01L23/473 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K7/20 ,  H01L23/473 ,  H01L23/49816 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/73204 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/064 ,  H01L2924/00014

Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.

Abstract translation: 电子设备包括由绝缘材料制成并具有电连接网络的衬底晶片。 集成电路芯片安装在基板晶片的顶侧。 衬底晶片包含内部管道。 导管由位于基板晶片顶侧的覆盖沟槽形成。 沟槽包含导热材料，例如是流体。 偏离沟槽的衬底晶片顶部的开口允许在集成电路和电连接网络之间形成电连接。

公开(公告)号：US20160177182A1

公开(公告)日：2016-06-23

申请号：US14909419

申请日：2013-07-31

Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Inventor： William Brenden CARLSON ,  Gregory D. PHELAN

IPC: C09K21/14 ,  H05K1/02 ,  C08B37/00 ,  H05K1/03 ,  C08B15/00 ,  C08B31/00

CPC classification number: C09K21/14 ,  C08B15/005 ,  C08B31/003 ,  C08B37/0045 ,  C09K21/00 ,  H05K1/0201 ,  H05K1/0313 ,  H05K1/0326 ,  H05K1/0353 ,  H05K2201/012

Abstract: Printed circuit boards, or PCBs, may include cross-linked oligomers that have been modified to prevent corrosion and have reduced flammability. The oligomers may be functionalized to include cross-linkable moieties and a flame retardant. The modified materials are more environmentally benign and less toxic than current fiberglass technologies used to manufacture PCBs.

Abstract translation: 印刷电路板或PCB可以包括已经被改性以防止腐蚀并具有降低的可燃性的交联低聚物。 低聚物可以被官能化以包括可交联部分和阻燃剂。 改性材料比目前用于制造PCB的玻璃纤维技术更环保，毒性更低。

公开(公告)号：US20160161952A1

公开(公告)日：2016-06-09

申请号：US14561591

申请日：2014-12-05

Applicant: International Business Machines Corporation

Inventor： Daniel J. Buvid ,  Eric J. Campbell ,  Tyler Jandt ,  Joseph Kuczynski

IPC: G05D7/06 ,  G05B15/02 ,  H05K1/02 ,  G01M3/40 ,  H05K7/20

CPC classification number: G05B15/02 ,  G01M3/18 ,  G01M3/40 ,  H05K1/0201 ,  H05K7/20218 ,  H05K2201/064

Abstract: A cooling system cools one or more electrical components on a printed circuit board. A piece of bilayer tubing made of an electrically conductive outer layer and an insulating inner layer. The insulating inner layer separates an electrically conductive coolant fluid from the electrically conductive outer layer. A signal generator is configured to inject an electrical signal into the electrically conductive coolant fluid. A sensor circuit electrically connected to the conductive outer layer is configured to detect the signal in the electrically conductive outer layer.

Abstract translation: 冷却系统冷却印刷电路板上的一个或多个电气部件。 由导电外层和绝缘内层制成的双层管。 绝缘内层将导电冷却剂流体与导电外层分离。 信号发生器被配置为将电信号注入到导电冷却剂流体中。 电连接到导电外层的传感器电路被配置为检测导电外层中的信号。

公开(公告)号：US09349930B2

公开(公告)日：2016-05-24

申请号：US13981821

申请日：2012-01-17

Applicant: Chung Hoon Lee

Inventor： Chung Hoon Lee

IPC: H01L33/00 ,  H01L33/64 ,  F21V23/00 ,  H05K1/02 ,  F21K99/00 ,  F21V29/15 ,  F21Y101/02 ,  F21V29/74

CPC classification number: H01L33/64 ,  F21K9/278 ,  F21V23/005 ,  F21V29/15 ,  F21V29/74 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/10106 ,  H05K2201/10575 ,  H01L2924/00

Abstract: Disclosed are a light emitting diode (LED) module and a lighting assembly. The lighting assembly comprises a light emitting device, a driver integrated circuit device for driving the light emitting device, a heat sink for dissipating heat generated from the light emitting device, and a heat shielding portion for blocking thermal interference between the driver integrated circuit device and the light emitting device. In the LED module, the driver integrated circuit device is disposed on the heat shielding portion. Accordingly, it is possible to block thermal interference between the light emitting device and the driver integrated circuit device and to decrease the size of the lighting assembly.

Abstract translation: 公开了一种发光二极管（LED）模块和照明组件。 照明组件包括发光器件，用于驱动发光器件的驱动器集成电路器件，用于散发从发光器件产生的热的散热器，以及用于阻挡驱动器集成电路器件与驱动器集成电路器件之间的热干扰的热屏蔽部分 发光装置。 在LED模块中，驱动器集成电路器件设置在热屏蔽部分上。 因此，可以阻止发光器件和驱动器集成电路器件之间的热干扰并且减小照明组件的尺寸。

公开(公告)号：US20160049275A1

公开(公告)日：2016-02-18

申请号：US14824474

申请日：2015-08-12

Applicant: BorgWarner Ludwigsburg GmbH

Inventor： Michael Stözinger ,  Bernd Halbrock ,  Sisay Tadele ,  Norbert Ernst

IPC: H01H85/36 ,  H01H85/20 ,  H01H85/055

CPC classification number: H01H85/36 ,  H01H37/761 ,  H01H85/055 ,  H01H85/20 ,  H01H2037/046 ,  H01H2037/763 ,  H01H2085/0275 ,  H05K1/0201 ,  H05K1/0263

Abstract: Described is a fuse for an electrical circuit, comprising two contact arms, each having at least one connecting pin for inserting into a hole of a printed circuit board, and a spring which connects the two contact arms in an electrically conductive manner. According to this disclosure, it is provided that the spring is fastened to at least one of the two contact arms by means of a fastening means that loses its strength at a trigger temperature of the fuse, wherein the fuse is formed in such a manner that by inserting the connecting pins into holes of a printed circuit board, the spring is loaded such that the spring lifts from the at least one contact arm by spring force as soon as the fastening means loses its strength due to overheating. Moreover, a printed circuit board comprising such a fuse is described.

Abstract translation: 描述了一种用于电路的熔断器，包括两个接触臂，每个接触臂具有用于插入印刷电路板的孔中的至少一个连接销，以及以导电方式连接两个接触臂的弹簧。 根据该公开内容，提供了通过在熔丝的触发温度下损失其强度的紧固装置将弹簧紧固到两个接触臂中的至少一个上，其中，熔丝以如下方式形成： 通过将连接销插入印刷电路板的孔中，弹簧被加载成使得弹簧由于过热而使紧固装置失去其强度时弹簧从弹簧力提升至少一个接触臂。 此外，描述了包括这种熔丝的印刷电路板。

公开(公告)号：US09265152B2

公开(公告)日：2016-02-16

申请号：US14108943

申请日：2013-12-17

Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.

Inventor： Larry G. Pymento ,  Tony C. Sass

IPC: H01L23/02 ,  H05K1/18 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0201 ,  H05K3/303 ,  H05K2201/0191 ,  H05K2201/09709 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10545 ,  H05K2201/10568 ,  Y02P70/611 ,  Y10T29/49133

Abstract: Embodiments of the invention relates to a process and assembly for a dual sided and staggered connector arrangement on a substrate. Surface mount connector technology is employed to enable a flush connection of connector leads to the surface of the substrate. Retaining pins are provided with each connector and are sized to be received by the substrate, but not to extend through the substrate. The retaining pins are sized and configured to hold each connector in a set position, while mitigating interference with an opposing side of the PCB.

Abstract translation: 本发明的实施例涉及一种用于衬底上的双面和交错连接器布置的工艺和组件。 使用表面贴装连接器技术来实现连接器引线与基板表面的平齐连接。 保持销设置有每个连接器，并且其尺寸被设计成被衬底接收，但不延伸通过衬底。 固定销的尺寸和构造适于将每个连接器固定在设定位置，同时减轻与PCB相对侧的干扰。

公开(公告)号：US09265148B2

公开(公告)日：2016-02-16

申请号：US14124298

申请日：2012-05-08

Applicant: Wilfried Lassmann ,  Christian Büttner

Inventor： Wilfried Lassmann ,  Christian Büttner

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K5/00 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/4608 ,  H05K5/0082 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09781

Abstract: The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer layer and a supply voltage area of at least one inner layer.

Abstract translation: 本发明提出一种具有多层的印刷电路板，其特征在于至少一层外层和至少一层与外层相邻的内层。 印刷电路板具有多个微通孔，其形成在至少一个外层的电源电压区域和至少一个内层的电源电压区域之间。