公开(公告)号：US20030107026A1

公开(公告)日：2003-06-12

申请号：US10196216

申请日：2002-07-17

Inventor： Hironao Fujiki ,  Motoo Fukushima

IPC: H01C001/00 ,  H01B001/00

CPC classification number: H01B1/22 ,  C08G65/007 ,  C08G65/336 ,  C08G77/12 ,  C08G77/20 ,  C08G77/46 ,  C08K9/02 ,  C08L83/04 ,  H01B1/20 ,  H05K1/095 ,  H05K2201/0221 ,  H05K2201/0254 ,  H05K2203/159 ,  C08L83/00

Abstract: A conductive composition is obtained by dispersing conductive particles in a curable polymer. At least 50% by weight of the entire conductive particles are those conductive particles coated with a metal on their outermost layer surface and having a specific gravity which differs within null1.5 from the specific gravity of the curable polymer. The composition remains stable during storage, experiences a minimal change with time of curability, and cures into a conductive rubber which experiences a minimal change with time of volume resistivity.

Abstract translation: 通过将导电颗粒分散在可固化聚合物中来获得导电组合物。 整个导电颗粒的至少50重量％是在其最外层表面上涂覆有金属的导电颗粒，其比重与可固化聚合物的比重不同在±1.5内。 该组合物在储存期间保持稳定，经受可固化性随时间的最小变化，并且固化成导电橡胶，其经历体积电阻率随时间的最小变化。

公开(公告)号：US5354611A

公开(公告)日：1994-10-11

申请号：US71345

申请日：1993-05-28

Applicant: David J. Arthur ,  Gwo S. Swei ,  Phong X. Nguyen

Inventor： David J. Arthur ,  Gwo S. Swei ,  Phong X. Nguyen

IPC: C08K7/28 ,  C08K9/04 ,  H05K1/03 ,  B32B18/00

CPC classification number: H05K1/0373 ,  C08K7/28 ,  C08K9/04 ,  H05K1/034 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0254 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2982 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: A composite material is disclosed. The material comprises a polymeric matrix and from about 20 volume percent to about 70 volume percent inorganic particles distributed throughout the matrix. Suitable inorganic particles include hollow inorganic microspheres and porous inorganic particles. The inorganic particles are coated with a surface coating. The composite material of the present invention exhibits a dielectric constant of less than about 2.5 and a thermal coefficient of expansion of less than about 70 ppm/.degree.C.

Abstract translation: 公开了一种复合材料。 该材料包括聚合物基质和分布在整个基质中的约20体积％至约70体积％的无机颗粒。 合适的无机颗粒包括中空无机微球和多孔无机颗粒。 无机颗粒用表面涂层涂覆。 本发明的复合材料的介电常数小于约2.5，热膨胀系数小于约70ppm /℃。

公开(公告)号：US5194459A

公开(公告)日：1993-03-16

申请号：US650335

申请日：1991-02-04

Applicant: Yoshiaki Sato ,  Sakuko Kaneda

Inventor： Yoshiaki Sato ,  Sakuko Kaneda

IPC: C08K7/22 ,  C08J9/32 ,  C08K7/00 ,  C08L27/12 ,  H01B3/44 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08J9/32 ,  H01B3/445 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/249971

Abstract: An insulating material formed from a network of hollow gas-filled microspheres embedded in a cured three-dimensional cross-linked polymer network of copolymerized unsaturated fluorinated monomers and acrylic monomers reacted in a fluorinated organic solvent.

公开(公告)号：US5098781A

公开(公告)日：1992-03-24

申请号：US635087

申请日：1990-12-28

Applicant: Michael G. Minnick ,  Rakesh Jain

Inventor： Michael G. Minnick ,  Rakesh Jain

IPC: B32B7/02 ,  B32B15/08 ,  C08G59/00 ,  C08K7/00 ,  C08K7/02 ,  C08K7/16 ,  C08K7/28 ,  C08L63/02 ,  C08L71/00 ,  C08L71/12 ,  C08L79/08 ,  H05K1/03

CPC classification number: H05K1/036 ,  B32B15/08 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10S428/901 ,  Y10T428/249971 ,  Y10T428/249972 ,  Y10T428/249974 ,  Y10T428/31522 ,  Y10T442/656

Abstract: The present invention is directed to a metal-clad electrical laminate which comprises a core of one or more of a polyetherimide thermoplastic, polyphenylene oxide thermoplastic, or a resinous-filled reinforced substrate. A pair of intermediate layers of hollow glass microsphere-filled polyphenylene oxide/epoxy is bound to either side of the core. Finally, a pair of metal foil layers are bound to the filled intermediate layers to produce the laminate of the present invention. The laminate desirably has a thickness of less than about 0.010 in., a dielectric constant of about 3 or less, and a HGM content in excess of about 10 wt-%. Additionally, the laminate has a softening point sufficiently high to avoid substantial distortion at processing temperatures of around 200.degree.-235.degree. C.

公开(公告)号：US5055342A

公开(公告)日：1991-10-08

申请号：US484173

申请日：1990-02-16

Applicant: Voya Markovich ,  Ashit Mehta ,  Jae M. Park ,  Eugene Skarvinko ,  David W. Wang

Inventor： Voya Markovich ,  Ashit Mehta ,  Jae M. Park ,  Eugene Skarvinko ,  David W. Wang

IPC: B32B27/30 ,  C08K3/00 ,  C08K3/36 ,  C08K7/00 ,  C08K7/22 ,  C08L27/12 ,  C09D127/12 ,  H01B3/44 ,  H01L23/14 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0373 ,  C08K3/36 ,  C08K7/22 ,  H01B3/445 ,  H05K1/034 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K3/0032 ,  Y10S428/901 ,  Y10S525/935 ,  Y10S525/936 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: Fluorinated polymeric composition exhibiting low dielectric constant and a low coefficient of thermal expansion containing a fluorinated polymeric material and a silica and/or quartz filler having a mean particle size of no greater than 7 microns, and use thereof to form a substrate having vias therein. Layers of the above composition are obtained by applying the composition to a substrate and then heating the composition to a temperature sufficient to cause the composition to fuse.

Abstract translation: 显示低介电常数和含有氟化聚合物材料的低热膨胀系数和平均粒径不大于7微米的二氧化硅和/或石英填料的氟化聚合物组合物及其在其中形成具有通孔的基材的用途。 通过将组合物施加到基底上，然后将组合物加热到足以使组合物熔合的温度来获得上述组合物的层。

公开(公告)号：US4997702A

公开(公告)日：1991-03-05

申请号：US475454

申请日：1990-02-06

Applicant: Samuel Gazit ,  Gary W. Adams

Inventor： Samuel Gazit ,  Gary W. Adams

IPC: B32B27/20 ,  H05K1/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B27/20 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/057 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2713

Abstract: A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.

Abstract translation: 提出了一种印刷电路板，其由层压在导电片上的环氧树脂浸渍非织造网基材组成。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。 印刷电路板还具有通过添加高达70重量％的低热膨胀系数（CTE）颗粒填料和/或在无纺布网中使用热稳定的增强纤维而获得的改进的热性能。

公开(公告)号：US20240314927A1

公开(公告)日：2024-09-19

申请号：US18604322

申请日：2024-03-13

Applicant: AT&S Austria Technologie & Systemtechnik AG

Inventor： Nina WANG ,  Artan BAFTIRI

IPC: H05K1/03 ,  H01L23/498

CPC classification number: H05K1/0373 ,  H01L23/49894 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0266

Abstract: A sheet for manufacturing a component carrier includes a first structure having first filler particles in a resin matrix, and a second structure stacked with the first structure and having second filler particles in a resin matrix, wherein a hollow volume in a respective one of the second filler particles is larger than in a respective one of the first filler particles.

公开(公告)号：US20180332719A1

公开(公告)日：2018-11-15

申请号：US15593610

申请日：2017-05-12

Applicant: International Business Machines Corporation

Inventor： Matthew S. DOYLE ,  Joseph KUCZYNSKI ,  Phillip V. MANN ,  Kevin M. O'CONNELL

IPC: H05K3/42 ,  H05K3/00 ,  H05K3/22

CPC classification number: H05K3/429 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/421 ,  H05K2201/0254 ,  H05K2201/09509 ,  H05K2201/09563

Abstract: A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.

公开(公告)号：US20150282329A1

公开(公告)日：2015-10-01

申请号：US14231454

申请日：2014-03-31

Applicant: Apple Inc.

Inventor： John J. Baker

IPC: H05K3/28 ,  H05K3/30

CPC classification number: H05K3/284 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/108 ,  C09J5/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/0284 ,  H05K3/288 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2203/0126 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0783 ,  H05K2203/092 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1163 ,  H05K2203/1194 ,  H01L2924/00012

Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

Abstract translation: 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 粘合剂可用于连接电子器件结构。 粘合剂可以作为液体粘合剂分配并固化以形成粘合剂接合部。 粘合接头可能脱粘。 可以通过将局部引发剂例如化学或局部化的能量施加到粘合剂来引发连锁反应。 一旦开始，连锁反应可能会蔓延到整个粘合剂中以固化粘合剂，从而全局地改变粘合剂粘度，或者削弱粘合剂以促进剥离。 还可以对粘合剂进行局部变化，例如局部增加和降低粘合剂粘度。 链反应固化可用于固化在电子设备结构的间隙内隐藏的粘合剂或脱粘合剂。 粘度变化可用于控制粘合剂流动的位置。

公开(公告)号：US20150156866A1

公开(公告)日：2015-06-04

申请号：US14559474

申请日：2014-12-03

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Dae Seob SHIM ,  Young Kwon KOO ,  Dong Myeong SHIN ,  Do Sang LEE ,  Oh Hyeon HWANG ,  Kyoung Ku KANG

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K1/0274 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/0254 ,  H05K2201/026

Abstract: A transparent conductor, a method of fabricating the same, and an optical display, the transparent conductor including a base layer; and a conductive layer on the base layer, the conductive layer including metal nanowires and a matrix, wherein the matrix is prepared from a matrix composition, the matrix composition including inorganic hollow particles, a fluorine-containing monomer, or a mixture thereof.

Abstract translation: 透明导体，其制造方法和光学显示器，所述透明导体包括基底层; 以及基底层上的导电层，所述导电层包括金属纳米线和基体，其中所述基体由基质组合物制备，所述基质组合物包含无机中空颗粒，含氟单体或其混合物。