PRINTED CIRCUIT BOARD AND SURFACE TREATMENT METHOD OF PRINTED CIRCUIT BOARD
    41.
    发明申请
    PRINTED CIRCUIT BOARD AND SURFACE TREATMENT METHOD OF PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板和印刷电路板的表面处理方法

    公开(公告)号:US20140182905A1

    公开(公告)日:2014-07-03

    申请号:US14143475

    申请日:2013-12-30

    Abstract: Disclosed herein are a printed circuit board including a copper foil layer surface treated with Pb-free solder having the same height as that of a solder resist, and a surface treatment method of the printed circuit board.According to the present invention, the surface treatment of the package board or interposer board having an ultra-fine pitch (300 μm or less) may be easily implemented by a cheap process. In addition, the surface treatment of the printed circuit board may be eco-friendly performed by using the Pb-free solder, and it may be easy to surface treat the package board or interposer board based on the organic material sensitive to a high temperature.

    Abstract translation: 本发明公开了一种印刷电路板,其包括利用与阻焊剂相同高度的无铅焊料处理的铜箔层表面和印刷电路板的表面处理方法。 根据本发明,可以通过廉价的处理容易地实现具有超细间距(300μm以下)的封装基板或中介板的表面处理。 此外,印刷电路板的表面处理可以通过使用无铅焊料进行环保处理,并且可以容易地基于对高温敏感的有机材料来表面处理封装板或插入板。

    CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME
    44.
    发明申请
    CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME 审中-公开
    电路装置及其制造方法

    公开(公告)号:US20140014401A1

    公开(公告)日:2014-01-16

    申请号:US13547454

    申请日:2012-07-12

    Abstract: A circuit device includes: a substrate having an insulative upper surface; a hydrophobic anti-plating layer of a hydrophobic material formed on the upper surface of the substrate and having at least one patterned through-hole for exposing a plating portion of the upper surface of the substrate; an active metal layer formed on the plating portion of the upper surface of the substrate and disposed in the patterned through-hole in the hydrophobic anti-plating layer; and an electroless deposited metal layer electroless deposited on the active metal layer.

    Abstract translation: 电路装置包括:具有绝缘上表面的基板; 疏水性材料的疏水性防镀层形成在所述基板的上表面上并且具有至少一个图案化的通孔,用于暴露所述基板的上表面的镀层部分; 形成在所述基板的上表面的电镀部上并设置在所述疏水性防镀层的所述图案化通孔中的活性金属层; 以及沉积在活性金属层上的无电沉积金属层。

    METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD
    46.
    发明申请
    METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD 审中-公开
    制造层压板电路板的方法

    公开(公告)号:US20130255858A1

    公开(公告)日:2013-10-03

    申请号:US13437933

    申请日:2012-04-03

    Abstract: A method of manufacturing a laminate circuit board is disclosed. The method includes forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer with a thickness of 5 to 40 nm over the circuit metal layer, and forming a cover layer covering the substrate and the nanometer plating layer with improved adhesion by chemical bonding to form the laminate circuit board. Another method includes forming the circuit metal layer and the nanometer plating layer on a preforming substrate, pressing the preforming substrate against a substrate to push the circuit metal layer and the nanometer plating layer into the substrate, and removing the preforming substrate. By the present invention, the density of circuit is increased and much denser circuit can be implemented on the substrate with the same area.

    Abstract translation: 公开了一种制造叠层电路板的方法。 该方法包括在基板上形成金属层,图案化金属层以形成电路金属层,在电路金属层上形成厚度为5至40nm的纳米电镀层,并形成覆盖基板的覆盖层和 纳米电镀层通过化学键合具有改善的粘附性以形成层压电路板。 另一种方法包括在预成型基板上形成电路金属层和纳米电镀层,将预成型基板压靠在基板上,将电路金属层和纳米电镀层推入基板,以及去除预成形基板。 通过本发明,电路的密度增加,并且可以在具有相同面积的基板上实现更加密集的电路。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    50.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号:US20130126224A1

    公开(公告)日:2013-05-23

    申请号:US13682505

    申请日:2012-11-20

    Inventor: Joon Sung Kim

    Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate; an outer circuit layer formed on an upper portion of the base substrate and including a connection pad; a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; and a second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed.

    Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括:基底; 形成在所述基底基板的上部并且包括连接垫的外部电路层; 形成在所述基底基板的上部的第一阻焊膜,使得所述外电路层的所述连接焊盘露出; 以及形成在外部电路层的上部并形成为使得连接焊盘露出的第二阻焊剂。

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