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公开(公告)号：US09661751B2
公开(公告)日：2017-05-23
申请号：US15005345
申请日：2016-01-25
Applicant: Infineon Technologies AG
Inventor： Reinhold Bayerer
CPC classification number: H05K1/142 , H01L25/162 , H01L2924/0002 , H05K1/0262 , H05K1/144 , H05K1/145 , H05K1/181 , H05K2201/04 , H05K2201/10166 , H05K2201/10303 , H05K2201/10318 , H05K2201/1059 , H01L2924/00
Abstract: A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board (PCB) arranged outside the semiconductor module, and a control unit arranged outside the semiconductor module and having a second PCB. The control unit is configured to control the controllable power semiconductor component. The controllable power semiconductor component has a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and also a control terminal for controlling the load path. The first PCB has a conductor track connected in series with the load path. The first and second PCBs are spaced apart from one another and electrically connected to one another by a pin.
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42.发明申请公开(公告)号：US20170135207A1
公开(公告)日：2017-05-11
申请号：US15416212
申请日：2017-01-26
Inventor： Robert Christopher BURNS , Wolfgang TUSLER , Bernd HAEGELE
CPC classification number: H05K1/05 , H01L23/492 , H01L25/072 , H01L25/18 , H01L2924/0002 , H02M7/003 , H05K1/021 , H05K1/0263 , H05K1/053 , H05K1/056 , H05K1/09 , H05K3/4644 , H05K7/023 , H05K7/04 , H05K2201/0326 , H05K2201/04 , H05K2201/06 , H05K2201/10166 , H01L2924/00
Abstract: The invention relates to a circuit board (1a, 1b, 1c), particularly for a power-electronic module (2), comprising an electrically-conductive substrate (3) which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface (3a, 3b) of the electrically-conductive substrate (3), at least one conductor surface (4a, 4b) is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface (4a, 4b) being in direct electrical contact with the electrically-conductive substrate (3).
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公开(公告)号：US20160294079A1
公开(公告)日：2016-10-06
申请号：US15060752
申请日：2016-03-04
Applicant: SUMIDA flexible connections GmbH
Inventor： Patrick Heine
CPC classification number: H01R12/62 , H01R12/52 , H05K1/14 , H05K1/148 , H05K3/202 , H05K2201/04 , H05K2201/09118 , H05K2201/09736 , H05K2203/302
Abstract: An electric connector that is particularly suitable for connecting printed circuit boards, wherein the connector has several flat conductors that are spaced apart from each other and that are embedded in an electrically insulating material to form an insulation zone in which the flat conductors extend parallel to each other and at their ends each with an exposed portion project over the transverse edges of the insulation zone. Here, it is provided that each of the flat conductors, within the insulation zone, has at least one first portion that is arranged between two second portions, wherein the first portion has a smaller thickness than the second portions.
Abstract translation: 一种特别适用于连接印刷电路板的电连接器，其中连接器具有彼此间隔开并且嵌入电绝缘材料中的多个扁平导体，以形成绝缘区域，扁平导体平行延伸至每个绝缘区域 另一个并且在它们的端部各自具有暴露部分突出在绝缘区域的横向边缘上。 这里，提供在绝缘区域内的每个扁平导体具有布置在两个第二部分之间的至少一个第一部分，其中第一部分具有比第二部分更小的厚度。
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Patent Agency Ranking
44.发明申请Driving Printed Circuit Board for Display Device and Display Device Having the Same 有权用于显示设备和显示设备的驱动印刷电路板具有相同的功能公开(公告)号：US20160073498A1
公开(公告)日：2016-03-10
申请号：US14846234
申请日：2015-09-04
Applicant: LG Display Co., Ltd.
Inventor： InHo YEO , KyongShik JEON
CPC classification number: H05K1/0218 , H05K1/0219 , H05K1/0296 , H05K1/111 , H05K1/117 , H05K1/118 , H05K1/14 , H05K2201/04 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/10128
Abstract: An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.
Abstract translation: 电子设备连接单元包括基板和被配置为将信号从电子设备发送到驱动印刷电路板（PCB）的基板上的多个信号焊盘。 衬底上的一个或多个有源接地焊盘构造成将至少驱动PCB连接到电子设备的参考电压。 衬底上的一个或多个虚拟接地焊盘被配置成连接到电子设备的参考电压而不延伸到驱动PCB上。 一个或多个连接器连接到一个或多个虚拟接地焊盘，其中一个或多个连接器中的每一个被配置为将一个或多个虚拟接地焊盘的至少一个子集电耦合到一个或多个有源接地焊盘。
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45.发明申请公开(公告)号：US20150271921A1
公开(公告)日：2015-09-24
申请号：US14217621
申请日：2014-03-18
Inventor： SHAO-CHUNG HU , KUO-YANG HORNG , LING-YUEH YANG , WEI-CHING LIU , PEN-SHAN CHAO , KUN-FENG CHEN , LOUIS LU-CHEN HSU
CPC classification number: H05K1/14 , H05K1/0209 , H05K1/0216 , H05K1/11 , H05K1/141 , H05K1/148 , H05K1/181 , H05K3/32 , H05K3/366 , H05K2201/04 , H05K2201/046 , H05K2201/047 , H05K2201/10515 , Y02P70/611 , Y10T29/49126
Abstract: A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.
Abstract translation: 介绍了一种微电子3D封装结构及其制造方法。 微电子3D封装结构包括具有多个第一边缘并且布置有第一电子器件的第一板; 具有多个第二边缘并且设置有第二电子设备的第二板，其中所述第二板的至少一个第二边缘连接到所述第一板的至少一个第一边缘以形成接合线; 以及设置在两个相邻板的接合线处并且适于用作传输信号的连接路径的接合连接部分。
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公开(公告)号：US20150173182A1
公开(公告)日：2015-06-18
申请号：US14617365
申请日：2015-02-09
Applicant: Richard A. Cobley , Joseph G. Murray
Inventor： Richard A. Cobley , Joseph G. Murray
CPC classification number: H05K1/0293 , G05B2219/21109 , G21D3/00 , H05K1/141 , H05K2201/04 , Y02E30/39
Abstract: A system and apparatus for monitoring and control of the operation of various types of industrial plants, including power plants, nuclear power plants and plants including various types of mechanical, electrical and chemical machinery. The invention employs modular non-microprocessor based, non-software based digital hardware that enables communication between sensors and control logic and between the control logic and actuators that control a functional aspect of each plant.
Abstract translation: 一种用于监测和控制包括发电厂，核电站和各种机械，电气和化学机械在内的各种工厂的运行的系统和装置。 本发明采用基于模块化非基于微处理器的非基于软件的数字硬件，其实现传感器和控制逻辑之间以及控制逻辑和控制每个工厂的功能方面的致动器之间的通信。
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公开(公告)号：US20140347563A1
公开(公告)日：2014-11-27
申请号：US14371559
申请日：2012-09-21
Applicant: SHARP KABUSHIKI KAISHA
Inventor： Kenichiro Ito , Hideto Takeuchi , Yasufumi Gouma
IPC: H05K5/00 , G02F1/1335 , H04N5/44 , H05K1/02
CPC classification number: H05K5/0017 , G02F1/133602 , G02F1/13452 , G02F2001/133314 , G02F2001/133322 , H04N5/44 , H04N5/64 , H05K1/028 , H05K1/189 , H05K2201/04 , H05K2201/05 , H05K2201/10128
Abstract: A display device includes: a backlight chassis; and a circuit substrate having a substrate rear surface facing the chassis with a circuit pattern formed on the substrate rear surface and having a part held with respect to the chassis, the chassis having a drawn part with which an edge of the source substrate makes contact when the source substrate is displaced.
Abstract translation: 显示装置包括：背光底盘; 以及电路基板，其具有基板后表面，所述基板背面具有形成在所述基板后表面上并且具有相对于所述底架保持的部分的电路图案的所述基板后表面，所述底板具有拉出部，所述源极基板的边缘与所述引出部分接合， 源极衬底被移位。
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公开(公告)号：US20110311013A1
公开(公告)日：2011-12-22
申请号：US13165347
申请日：2011-06-21
Applicant: Richard A. Cobley , Joseph G. Murray
Inventor： Richard A. Cobley , Joseph G. Murray
CPC classification number: H05K1/0293 , G05B2219/21109 , G21D3/00 , H05K1/141 , H05K2201/04 , Y02E30/39
Abstract: A system and apparatus for monitoring and control of the operation of various types of industrial plants, including power plants, nuclear power plants and plants including various types of mechanical, electrical and chemical machinery. The invention employs modular non-microprocessor based, non-software based digital hardware that enables communication between sensors and control logic and between the control logic and actuators that control a functional aspect of each plant.
Abstract translation: 一种用于监测和控制包括发电厂，核电站和各种机械，电气和化学机械在内的各种工厂的运行的系统和装置。 本发明采用基于模块化非基于微处理器的非基于软件的数字硬件，其实现传感器和控制逻辑之间以及控制逻辑和控制每个工厂的功能方面的致动器之间的通信。
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